JP2009004756A5 - - Google Patents

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Publication number
JP2009004756A5
JP2009004756A5 JP2008127915A JP2008127915A JP2009004756A5 JP 2009004756 A5 JP2009004756 A5 JP 2009004756A5 JP 2008127915 A JP2008127915 A JP 2008127915A JP 2008127915 A JP2008127915 A JP 2008127915A JP 2009004756 A5 JP2009004756 A5 JP 2009004756A5
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JP
Japan
Prior art keywords
crystal semiconductor
single crystal
semiconductor layer
substrate
drive circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008127915A
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English (en)
Japanese (ja)
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JP2009004756A (ja
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Publication date
Application filed filed Critical
Priority to JP2008127915A priority Critical patent/JP2009004756A/ja
Priority claimed from JP2008127915A external-priority patent/JP2009004756A/ja
Publication of JP2009004756A publication Critical patent/JP2009004756A/ja
Publication of JP2009004756A5 publication Critical patent/JP2009004756A5/ja
Withdrawn legal-status Critical Current

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JP2008127915A 2007-05-18 2008-05-15 半導体装置の作製方法 Withdrawn JP2009004756A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008127915A JP2009004756A (ja) 2007-05-18 2008-05-15 半導体装置の作製方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007132540 2007-05-18
JP2008127915A JP2009004756A (ja) 2007-05-18 2008-05-15 半導体装置の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014094751A Division JP2014170959A (ja) 2007-05-18 2014-05-01 半導体装置の作製方法

Publications (2)

Publication Number Publication Date
JP2009004756A JP2009004756A (ja) 2009-01-08
JP2009004756A5 true JP2009004756A5 (enExample) 2011-05-06

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ID=40027928

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008127915A Withdrawn JP2009004756A (ja) 2007-05-18 2008-05-15 半導体装置の作製方法
JP2014094751A Withdrawn JP2014170959A (ja) 2007-05-18 2014-05-01 半導体装置の作製方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014094751A Withdrawn JP2014170959A (ja) 2007-05-18 2014-05-01 半導体装置の作製方法

Country Status (4)

Country Link
US (1) US7960262B2 (enExample)
JP (2) JP2009004756A (enExample)
CN (1) CN101308772B (enExample)
TW (1) TWI476927B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8236668B2 (en) * 2007-10-10 2012-08-07 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate
JP5654206B2 (ja) 2008-03-26 2015-01-14 株式会社半導体エネルギー研究所 Ｓｏｉ基板の作製方法及び該ｓｏｉ基板を用いた半導体装置
JP2009260315A (ja) * 2008-03-26 2009-11-05 Semiconductor Energy Lab Co Ltd Ｓｏｉ基板の作製方法及び半導体装置の作製方法
US7943414B2 (en) * 2008-08-01 2011-05-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate
SG161151A1 (en) * 2008-10-22 2010-05-27 Semiconductor Energy Lab Soi substrate and method for manufacturing the same
SG182208A1 (en) * 2008-12-15 2012-07-30 Semiconductor Energy Lab Manufacturing method of soi substrate and manufacturing method of semiconductor device
WO2013054823A1 (en) * 2011-10-14 2013-04-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US10836633B2 (en) 2015-12-28 2020-11-17 Hitachi Zosen Corporation Carbon nanotube composite material and method for producing carbon nanotube composite material
KR101936795B1 (ko) * 2017-03-31 2019-01-11 (주)알엔알랩 레이저를 이용한 간접 가열 방법
JP6743752B2 (ja) 2017-04-20 2020-08-19 三菱電機株式会社 半導体装置の製造方法
CN107833924B (zh) * 2017-10-26 2020-06-19 京东方科技集团股份有限公司 顶栅型薄膜晶体管及其制备方法、阵列基板、显示面板
KR102318309B1 (ko) * 2018-05-31 2021-10-28 삼성전자주식회사 3차원 구조의 도핑 농도 결정 방법, 이를 이용한 반도체 장치의 제조 방법

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TW264575B (enExample) 1993-10-29 1995-12-01 Handotai Energy Kenkyusho Kk
US5923962A (en) 1993-10-29 1999-07-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
JP3067949B2 (ja) 1994-06-15 2000-07-24 シャープ株式会社 電子装置および液晶表示装置
US6534380B1 (en) 1997-07-18 2003-03-18 Denso Corporation Semiconductor substrate and method of manufacturing the same
JPH1197379A (ja) 1997-07-25 1999-04-09 Denso Corp 半導体基板及び半導体基板の製造方法
JPH11163363A (ja) 1997-11-22 1999-06-18 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP4476390B2 (ja) 1998-09-04 2010-06-09 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2000216265A (ja) * 1999-01-22 2000-08-04 Mega Chips Corp 半導体装置及びその製造方法
JP4379943B2 (ja) 1999-04-07 2009-12-09 株式会社デンソー 半導体基板の製造方法および半導体基板製造装置
JP4101409B2 (ja) * 1999-08-19 2008-06-18 シャープ株式会社 半導体装置の製造方法
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JP2003142402A (ja) * 2001-08-10 2003-05-16 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP4772258B2 (ja) * 2002-08-23 2011-09-14 シャープ株式会社 Ｓｏｉ基板の製造方法
JP2003282885A (ja) * 2002-03-26 2003-10-03 Sharp Corp 半導体装置およびその製造方法
US7119365B2 (en) * 2002-03-26 2006-10-10 Sharp Kabushiki Kaisha Semiconductor device and manufacturing method thereof, SOI substrate and display device using the same, and manufacturing method of the SOI substrate
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JP5110772B2 (ja) 2004-02-03 2012-12-26 株式会社半導体エネルギー研究所 半導体薄膜層を有する基板の製造方法
JP5072208B2 (ja) * 2004-09-24 2012-11-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2006117900A1 (ja) * 2005-04-26 2006-11-09 Sharp Kabushiki Kaisha 半導体装置の製造方法及び半導体装置
JP2007036216A (ja) * 2005-06-24 2007-02-08 Semiconductor Energy Lab Co Ltd 半導体装置及び無線通信システム
JP2007079431A (ja) * 2005-09-16 2007-03-29 Toshiba Matsushita Display Technology Co Ltd 表示素子用アレイ基板及びその作製方法、これを用いた表示素子
KR101299604B1 (ko) * 2005-10-18 2013-08-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
CN101281912B (zh) 2007-04-03 2013-01-23 株式会社半导体能源研究所 Soi衬底及其制造方法以及半导体装置
KR101457656B1 (ko) 2007-05-17 2014-11-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치의 제조방법, 표시장치의 제조방법, 반도체장치,표시장치 및 전자기기
US7745268B2 (en) 2007-06-01 2010-06-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device with irradiation of single crystal semiconductor layer in an inert atmosphere

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