JP2008505041A - ガスベアリング基板装填機構 - Google Patents

ガスベアリング基板装填機構 Download PDF

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Publication number
JP2008505041A
JP2008505041A JP2007519595A JP2007519595A JP2008505041A JP 2008505041 A JP2008505041 A JP 2008505041A JP 2007519595 A JP2007519595 A JP 2007519595A JP 2007519595 A JP2007519595 A JP 2007519595A JP 2008505041 A JP2008505041 A JP 2008505041A
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JP
Japan
Prior art keywords
substrate
suction
vacuum
plate
levitation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007519595A
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English (en)
Japanese (ja)
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JP2008505041A5 (enExample
Inventor
カッサーニュ，バレリック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC Oerlikon Balzers AG
Original Assignee
OC Oerlikon Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OC Oerlikon Balzers AG filed Critical OC Oerlikon Balzers AG
Publication of JP2008505041A publication Critical patent/JP2008505041A/ja
Publication of JP2008505041A5 publication Critical patent/JP2008505041A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
JP2007519595A 2004-07-09 2005-07-07 ガスベアリング基板装填機構 Withdrawn JP2008505041A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58664504P 2004-07-09 2004-07-09
PCT/CH2005/000392 WO2006005214A1 (en) 2004-07-09 2005-07-07 Gas bearing substrate-loading mechanism process

Publications (2)

Publication Number Publication Date
JP2008505041A true JP2008505041A (ja) 2008-02-21
JP2008505041A5 JP2008505041A5 (enExample) 2008-08-07

Family

ID=34971820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007519595A Withdrawn JP2008505041A (ja) 2004-07-09 2005-07-07 ガスベアリング基板装填機構

Country Status (9)

Country Link
US (1) US20070215437A1 (enExample)
EP (1) EP1768921A1 (enExample)
JP (1) JP2008505041A (enExample)
KR (1) KR20070037741A (enExample)
CN (1) CN101023011A (enExample)
AU (1) AU2005262191A1 (enExample)
IL (1) IL180080A0 (enExample)
TW (1) TW200624357A (enExample)
WO (1) WO2006005214A1 (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010143733A (ja) * 2008-12-19 2010-07-01 Sumitomo Heavy Ind Ltd 基板ハンドリングシステム及び基板ハンドリング方法
JP2010159164A (ja) * 2008-12-12 2010-07-22 Tokyo Electron Ltd 真空処理装置、真空処理システムおよび処理方法
WO2011002155A3 (ko) * 2009-06-29 2011-03-24 주식회사 공영 평판 정밀 플로팅 시스템
US8026907B2 (en) 2006-02-28 2011-09-27 Panasonic Corporation Plasma display device
JP2011219250A (ja) * 2010-04-14 2011-11-04 Oiles Corp 非接触搬送装置
JP2011235999A (ja) * 2010-05-10 2011-11-24 Oiles Corp 非接触搬送装置
WO2013190800A1 (ja) * 2012-06-21 2013-12-27 川崎重工業株式会社 基板搬送システム
JP2014133655A (ja) * 2014-03-17 2014-07-24 Oiles Ind Co Ltd 非接触搬送装置
JP2014210664A (ja) * 2013-04-17 2014-11-13 サムソン エレクトロ−メカニックス カンパニーリミテッド．Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏ−Ｍｅｃｈａｎｉｃｓ Ｃｏ．，Ｌｔｄ． 非接触基板移送反転機
WO2015178189A1 (ja) * 2014-05-20 2015-11-26 オイレス工業株式会社 搬送用レールおよび浮上搬送装置
KR20190055133A (ko) * 2016-09-13 2019-05-22 코닝 인코포레이티드 유리 기재 프로세싱 장치 및 방법

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US20090291209A1 (en) 2008-05-20 2009-11-26 Asm International N.V. Apparatus and method for high-throughput atomic layer deposition
US9238867B2 (en) * 2008-05-20 2016-01-19 Asm International N.V. Apparatus and method for high-throughput atomic layer deposition
EP2281300A4 (en) * 2008-05-30 2013-07-17 Alta Devices Inc METHOD AND DEVICE FOR A CHEMICAL STEAM SEPARATION REACTOR
KR100876337B1 (ko) * 2008-06-25 2008-12-29 이재성 흡입력을 갖는 비접촉식 반송 플레이트
KR101293289B1 (ko) * 2010-06-04 2013-08-09 김영태 비접촉식 이송장치
CN102020115B (zh) * 2010-11-26 2013-01-30 认知精密制造（苏州）有限公司 装载及移送lcd机架部件用空气上升型载体
DE102012219332B4 (de) * 2012-10-23 2014-11-13 Mdi Schott Advanced Processing Gmbh Vorrichtung und Verfahren zum Lagern und Fixieren einer Glasscheibe
KR101978147B1 (ko) 2012-11-15 2019-05-15 (주)아모레퍼시픽 복분자딸기의 향취를 재현한 향료 조성물
US9506147B2 (en) 2015-02-13 2016-11-29 Eastman Kodak Company Atomic-layer deposition apparatus using compound gas jet
US9499906B2 (en) 2015-02-13 2016-11-22 Eastman Kodak Company Coating substrate using bernoulli atomic-layer deposition
US9499908B2 (en) 2015-02-13 2016-11-22 Eastman Kodak Company Atomic layer deposition apparatus
US9528184B2 (en) 2015-02-13 2016-12-27 Eastman Kodak Company Atomic-layer deposition method using compound gas jet
KR102298805B1 (ko) 2015-03-05 2021-09-08 (주)아모레퍼시픽 은목서의 향취를 재현한 향료 조성물
CN104659039B (zh) * 2015-03-13 2017-10-27 京东方科技集团股份有限公司 承载基板、柔性显示装置制作方法
KR102610348B1 (ko) 2015-10-30 2023-12-06 (주)아모레퍼시픽 함박꽃의 향취를 재현한 향료 조성물
KR20170138834A (ko) * 2016-06-08 2017-12-18 코닝 인코포레이티드 라미네이팅 장치
US9889995B1 (en) * 2017-03-15 2018-02-13 Core Flow Ltd. Noncontact support platform with blockage detection
CN107655788B (zh) * 2017-11-16 2019-10-01 合肥工业大学 一种用于测量玻璃基板气浮系统节流板节流参数的装置
CN110498233B (zh) * 2019-07-26 2021-04-27 江苏科技大学 二维无接触输送平台装置
US11335585B2 (en) * 2020-05-08 2022-05-17 Taiwan Semiconductor Manufacturing Co., Ltd. Vacuum wafer chuck for manufacturing semiconductor devices
KR102578464B1 (ko) * 2020-06-10 2023-09-14 세메스 주식회사 기판 이송 모듈 및 이를 포함하는 다이 본딩 장치
CN114538111B (zh) * 2022-03-21 2024-03-08 江苏威尔赛科技有限公司 一种带自动消毒功能的垃圾被服回收系统
CN119117690B (zh) * 2024-11-12 2025-02-07 合肥浩普智能装备科技有限公司 一种气浮式倒包输送机

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DE19649488A1 (de) * 1996-11-29 1997-11-06 Schott Glaswerke Vorrichtung zur Handhabung von dünnen Glasscheiben
JP4354039B2 (ja) * 1999-04-02 2009-10-28 東京エレクトロン株式会社 駆動装置
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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8026907B2 (en) 2006-02-28 2011-09-27 Panasonic Corporation Plasma display device
JP2010159164A (ja) * 2008-12-12 2010-07-22 Tokyo Electron Ltd 真空処理装置、真空処理システムおよび処理方法
JP2010143733A (ja) * 2008-12-19 2010-07-01 Sumitomo Heavy Ind Ltd 基板ハンドリングシステム及び基板ハンドリング方法
KR101142959B1 (ko) 2009-06-29 2012-05-08 김영태 평판 정밀 플로팅 시스템
WO2011002155A3 (ko) * 2009-06-29 2011-03-24 주식회사 공영 평판 정밀 플로팅 시스템
JP2011219250A (ja) * 2010-04-14 2011-11-04 Oiles Corp 非接触搬送装置
JP2011235999A (ja) * 2010-05-10 2011-11-24 Oiles Corp 非接触搬送装置
WO2013190800A1 (ja) * 2012-06-21 2013-12-27 川崎重工業株式会社 基板搬送システム
JP2014007193A (ja) * 2012-06-21 2014-01-16 Kawasaki Heavy Ind Ltd 基板搬送システム
JP2014210664A (ja) * 2013-04-17 2014-11-13 サムソン エレクトロ−メカニックス カンパニーリミテッド．Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏ−Ｍｅｃｈａｎｉｃｓ Ｃｏ．，Ｌｔｄ． 非接触基板移送反転機
JP2014133655A (ja) * 2014-03-17 2014-07-24 Oiles Ind Co Ltd 非接触搬送装置
WO2015178189A1 (ja) * 2014-05-20 2015-11-26 オイレス工業株式会社 搬送用レールおよび浮上搬送装置
KR20190055133A (ko) * 2016-09-13 2019-05-22 코닝 인코포레이티드 유리 기재 프로세싱 장치 및 방법
KR102450782B1 (ko) 2016-09-13 2022-10-06 코닝 인코포레이티드 유리 기재 프로세싱 장치 및 방법

Also Published As

Publication number Publication date
WO2006005214A1 (en) 2006-01-19
EP1768921A1 (en) 2007-04-04
TW200624357A (en) 2006-07-16
IL180080A0 (en) 2007-05-15
US20070215437A1 (en) 2007-09-20
KR20070037741A (ko) 2007-04-06
CN101023011A (zh) 2007-08-22
AU2005262191A1 (en) 2006-01-19

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