AU2005262191A1 - Gas bearing substrate-loading mechanism process - Google Patents

Gas bearing substrate-loading mechanism process Download PDF

Info

Publication number
AU2005262191A1
AU2005262191A1 AU2005262191A AU2005262191A AU2005262191A1 AU 2005262191 A1 AU2005262191 A1 AU 2005262191A1 AU 2005262191 A AU2005262191 A AU 2005262191A AU 2005262191 A AU2005262191 A AU 2005262191A AU 2005262191 A1 AU2005262191 A1 AU 2005262191A1
Authority
AU
Australia
Prior art keywords
substrate
levitation
suction
vacuum
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2005262191A
Other languages
English (en)
Inventor
Valerick Cassagne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC OERLLIKON BALZERS AG
Original Assignee
OC OERLLIKON BALZERS AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OC OERLLIKON BALZERS AG filed Critical OC OERLLIKON BALZERS AG
Publication of AU2005262191A1 publication Critical patent/AU2005262191A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
AU2005262191A 2004-07-09 2005-07-07 Gas bearing substrate-loading mechanism process Abandoned AU2005262191A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US58664504P 2004-07-09 2004-07-09
US60/586,645 2004-07-09
PCT/CH2005/000392 WO2006005214A1 (en) 2004-07-09 2005-07-07 Gas bearing substrate-loading mechanism process

Publications (1)

Publication Number Publication Date
AU2005262191A1 true AU2005262191A1 (en) 2006-01-19

Family

ID=34971820

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2005262191A Abandoned AU2005262191A1 (en) 2004-07-09 2005-07-07 Gas bearing substrate-loading mechanism process

Country Status (9)

Country Link
US (1) US20070215437A1 (enExample)
EP (1) EP1768921A1 (enExample)
JP (1) JP2008505041A (enExample)
KR (1) KR20070037741A (enExample)
CN (1) CN101023011A (enExample)
AU (1) AU2005262191A1 (enExample)
IL (1) IL180080A0 (enExample)
TW (1) TW200624357A (enExample)
WO (1) WO2006005214A1 (enExample)

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KR100962810B1 (ko) 2006-02-28 2010-06-10 파나소닉 주식회사 플라즈마 디스플레이 장치
US20090291209A1 (en) 2008-05-20 2009-11-26 Asm International N.V. Apparatus and method for high-throughput atomic layer deposition
US9238867B2 (en) * 2008-05-20 2016-01-19 Asm International N.V. Apparatus and method for high-throughput atomic layer deposition
EP2281300A4 (en) * 2008-05-30 2013-07-17 Alta Devices Inc METHOD AND DEVICE FOR A CHEMICAL STEAM SEPARATION REACTOR
KR100876337B1 (ko) * 2008-06-25 2008-12-29 이재성 흡입력을 갖는 비접촉식 반송 플레이트
JP5399153B2 (ja) * 2008-12-12 2014-01-29 東京エレクトロン株式会社 真空処理装置、真空処理システムおよび処理方法
JP2010143733A (ja) * 2008-12-19 2010-07-01 Sumitomo Heavy Ind Ltd 基板ハンドリングシステム及び基板ハンドリング方法
KR101142959B1 (ko) * 2009-06-29 2012-05-08 김영태 평판 정밀 플로팅 시스템
JP5536516B2 (ja) * 2010-04-14 2014-07-02 オイレス工業株式会社 非接触搬送装置
JP5465595B2 (ja) * 2010-05-10 2014-04-09 オイレス工業株式会社 非接触搬送装置
KR101293289B1 (ko) * 2010-06-04 2013-08-09 김영태 비접촉식 이송장치
CN102020115B (zh) * 2010-11-26 2013-01-30 认知精密制造（苏州）有限公司 装载及移送lcd机架部件用空气上升型载体
JP6039260B2 (ja) * 2012-06-21 2016-12-07 川崎重工業株式会社 基板搬送システム
DE102012219332B4 (de) * 2012-10-23 2014-11-13 Mdi Schott Advanced Processing Gmbh Vorrichtung und Verfahren zum Lagern und Fixieren einer Glasscheibe
KR101978147B1 (ko) 2012-11-15 2019-05-15 (주)아모레퍼시픽 복분자딸기의 향취를 재현한 향료 조성물
KR101451506B1 (ko) * 2013-04-17 2014-10-17 삼성전기주식회사 비접촉 기판이송 반전기
JP2014133655A (ja) * 2014-03-17 2014-07-24 Oiles Ind Co Ltd 非接触搬送装置
JP2015218055A (ja) * 2014-05-20 2015-12-07 オイレス工業株式会社 搬送用レールおよび浮上搬送装置
US9506147B2 (en) 2015-02-13 2016-11-29 Eastman Kodak Company Atomic-layer deposition apparatus using compound gas jet
US9499906B2 (en) 2015-02-13 2016-11-22 Eastman Kodak Company Coating substrate using bernoulli atomic-layer deposition
US9499908B2 (en) 2015-02-13 2016-11-22 Eastman Kodak Company Atomic layer deposition apparatus
US9528184B2 (en) 2015-02-13 2016-12-27 Eastman Kodak Company Atomic-layer deposition method using compound gas jet
KR102298805B1 (ko) 2015-03-05 2021-09-08 (주)아모레퍼시픽 은목서의 향취를 재현한 향료 조성물
CN104659039B (zh) * 2015-03-13 2017-10-27 京东方科技集团股份有限公司 承载基板、柔性显示装置制作方法
KR102610348B1 (ko) 2015-10-30 2023-12-06 (주)아모레퍼시픽 함박꽃의 향취를 재현한 향료 조성물
KR20170138834A (ko) * 2016-06-08 2017-12-18 코닝 인코포레이티드 라미네이팅 장치
CN109982950B (zh) * 2016-09-13 2022-04-08 康宁股份有限公司 用于处理玻璃基材的设备和方法
US9889995B1 (en) * 2017-03-15 2018-02-13 Core Flow Ltd. Noncontact support platform with blockage detection
CN107655788B (zh) * 2017-11-16 2019-10-01 合肥工业大学 一种用于测量玻璃基板气浮系统节流板节流参数的装置
CN110498233B (zh) * 2019-07-26 2021-04-27 江苏科技大学 二维无接触输送平台装置
US11335585B2 (en) * 2020-05-08 2022-05-17 Taiwan Semiconductor Manufacturing Co., Ltd. Vacuum wafer chuck for manufacturing semiconductor devices
KR102578464B1 (ko) * 2020-06-10 2023-09-14 세메스 주식회사 기판 이송 모듈 및 이를 포함하는 다이 본딩 장치
CN114538111B (zh) * 2022-03-21 2024-03-08 江苏威尔赛科技有限公司 一种带自动消毒功能的垃圾被服回收系统
CN119117690B (zh) * 2024-11-12 2025-02-07 合肥浩普智能装备科技有限公司 一种气浮式倒包输送机

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Also Published As

Publication number Publication date
JP2008505041A (ja) 2008-02-21
WO2006005214A1 (en) 2006-01-19
EP1768921A1 (en) 2007-04-04
TW200624357A (en) 2006-07-16
IL180080A0 (en) 2007-05-15
US20070215437A1 (en) 2007-09-20
KR20070037741A (ko) 2007-04-06
CN101023011A (zh) 2007-08-22

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Legal Events

Date Code Title Description
MK4 Application lapsed section 142(2)(d) - no continuation fee paid for the application