KR20070037741A - 가스 베어링 기판-로딩 기구 프로세스 - Google Patents

가스 베어링 기판-로딩 기구 프로세스 Download PDF

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Publication number
KR20070037741A
KR20070037741A KR1020077000087A KR20077000087A KR20070037741A KR 20070037741 A KR20070037741 A KR 20070037741A KR 1020077000087 A KR1020077000087 A KR 1020077000087A KR 20077000087 A KR20077000087 A KR 20077000087A KR 20070037741 A KR20070037741 A KR 20070037741A
Authority
KR
South Korea
Prior art keywords
substrate
floating
suction
vacuum
points
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077000087A
Other languages
English (en)
Korean (ko)
Inventor
발레릭 까싼뉴
Original Assignee
오씨 외를리콘 발처스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오씨 외를리콘 발처스 악티엔게젤샤프트 filed Critical 오씨 외를리콘 발처스 악티엔게젤샤프트
Publication of KR20070037741A publication Critical patent/KR20070037741A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
KR1020077000087A 2004-07-09 2005-07-07 가스 베어링 기판-로딩 기구 프로세스 Withdrawn KR20070037741A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58664504P 2004-07-09 2004-07-09
US60/586,645 2004-07-09

Publications (1)

Publication Number Publication Date
KR20070037741A true KR20070037741A (ko) 2007-04-06

Family

ID=34971820

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077000087A Withdrawn KR20070037741A (ko) 2004-07-09 2005-07-07 가스 베어링 기판-로딩 기구 프로세스

Country Status (9)

Country Link
US (1) US20070215437A1 (enExample)
EP (1) EP1768921A1 (enExample)
JP (1) JP2008505041A (enExample)
KR (1) KR20070037741A (enExample)
CN (1) CN101023011A (enExample)
AU (1) AU2005262191A1 (enExample)
IL (1) IL180080A0 (enExample)
TW (1) TW200624357A (enExample)
WO (1) WO2006005214A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009157647A3 (ko) * 2008-06-25 2010-02-25 Lee Jae Sung 흡입력을 갖는 비접촉식 반송 플레이트
WO2011152587A1 (ko) * 2010-06-04 2011-12-08 Kim Young-Tae 진공패드를 이용한 비접촉 이송장치
KR20140062948A (ko) 2012-11-15 2014-05-27 (주)아모레퍼시픽 복분자딸기의 향취를 재현한 향료 조성물
KR20160108685A (ko) 2015-03-05 2016-09-20 (주)아모레퍼시픽 은목서의 향취를 재현한 향료 조성물
KR20170051219A (ko) 2015-10-30 2017-05-11 (주)아모레퍼시픽 함박꽃의 향취를 재현한 향료 조성물
KR20210153469A (ko) * 2020-06-10 2021-12-17 세메스 주식회사 기판 이송 모듈 및 이를 포함하는 다이 본딩 장치

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KR100962810B1 (ko) 2006-02-28 2010-06-10 파나소닉 주식회사 플라즈마 디스플레이 장치
US20090291209A1 (en) 2008-05-20 2009-11-26 Asm International N.V. Apparatus and method for high-throughput atomic layer deposition
US9238867B2 (en) * 2008-05-20 2016-01-19 Asm International N.V. Apparatus and method for high-throughput atomic layer deposition
EP2281300A4 (en) * 2008-05-30 2013-07-17 Alta Devices Inc METHOD AND DEVICE FOR A CHEMICAL STEAM SEPARATION REACTOR
JP5399153B2 (ja) * 2008-12-12 2014-01-29 東京エレクトロン株式会社 真空処理装置、真空処理システムおよび処理方法
JP2010143733A (ja) * 2008-12-19 2010-07-01 Sumitomo Heavy Ind Ltd 基板ハンドリングシステム及び基板ハンドリング方法
KR101142959B1 (ko) * 2009-06-29 2012-05-08 김영태 평판 정밀 플로팅 시스템
JP5536516B2 (ja) * 2010-04-14 2014-07-02 オイレス工業株式会社 非接触搬送装置
JP5465595B2 (ja) * 2010-05-10 2014-04-09 オイレス工業株式会社 非接触搬送装置
CN102020115B (zh) * 2010-11-26 2013-01-30 认知精密制造（苏州）有限公司 装载及移送lcd机架部件用空气上升型载体
JP6039260B2 (ja) * 2012-06-21 2016-12-07 川崎重工業株式会社 基板搬送システム
DE102012219332B4 (de) * 2012-10-23 2014-11-13 Mdi Schott Advanced Processing Gmbh Vorrichtung und Verfahren zum Lagern und Fixieren einer Glasscheibe
KR101451506B1 (ko) * 2013-04-17 2014-10-17 삼성전기주식회사 비접촉 기판이송 반전기
JP2014133655A (ja) * 2014-03-17 2014-07-24 Oiles Ind Co Ltd 非接触搬送装置
JP2015218055A (ja) * 2014-05-20 2015-12-07 オイレス工業株式会社 搬送用レールおよび浮上搬送装置
US9506147B2 (en) 2015-02-13 2016-11-29 Eastman Kodak Company Atomic-layer deposition apparatus using compound gas jet
US9499906B2 (en) 2015-02-13 2016-11-22 Eastman Kodak Company Coating substrate using bernoulli atomic-layer deposition
US9499908B2 (en) 2015-02-13 2016-11-22 Eastman Kodak Company Atomic layer deposition apparatus
US9528184B2 (en) 2015-02-13 2016-12-27 Eastman Kodak Company Atomic-layer deposition method using compound gas jet
CN104659039B (zh) * 2015-03-13 2017-10-27 京东方科技集团股份有限公司 承载基板、柔性显示装置制作方法
KR20170138834A (ko) * 2016-06-08 2017-12-18 코닝 인코포레이티드 라미네이팅 장치
CN109982950B (zh) * 2016-09-13 2022-04-08 康宁股份有限公司 用于处理玻璃基材的设备和方法
US9889995B1 (en) * 2017-03-15 2018-02-13 Core Flow Ltd. Noncontact support platform with blockage detection
CN107655788B (zh) * 2017-11-16 2019-10-01 合肥工业大学 一种用于测量玻璃基板气浮系统节流板节流参数的装置
CN110498233B (zh) * 2019-07-26 2021-04-27 江苏科技大学 二维无接触输送平台装置
US11335585B2 (en) * 2020-05-08 2022-05-17 Taiwan Semiconductor Manufacturing Co., Ltd. Vacuum wafer chuck for manufacturing semiconductor devices
CN114538111B (zh) * 2022-03-21 2024-03-08 江苏威尔赛科技有限公司 一种带自动消毒功能的垃圾被服回收系统
CN119117690B (zh) * 2024-11-12 2025-02-07 合肥浩普智能装备科技有限公司 一种气浮式倒包输送机

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009157647A3 (ko) * 2008-06-25 2010-02-25 Lee Jae Sung 흡입력을 갖는 비접촉식 반송 플레이트
WO2011152587A1 (ko) * 2010-06-04 2011-12-08 Kim Young-Tae 진공패드를 이용한 비접촉 이송장치
KR20140062948A (ko) 2012-11-15 2014-05-27 (주)아모레퍼시픽 복분자딸기의 향취를 재현한 향료 조성물
KR20160108685A (ko) 2015-03-05 2016-09-20 (주)아모레퍼시픽 은목서의 향취를 재현한 향료 조성물
KR20170051219A (ko) 2015-10-30 2017-05-11 (주)아모레퍼시픽 함박꽃의 향취를 재현한 향료 조성물
KR20210153469A (ko) * 2020-06-10 2021-12-17 세메스 주식회사 기판 이송 모듈 및 이를 포함하는 다이 본딩 장치

Also Published As

Publication number Publication date
JP2008505041A (ja) 2008-02-21
WO2006005214A1 (en) 2006-01-19
EP1768921A1 (en) 2007-04-04
TW200624357A (en) 2006-07-16
IL180080A0 (en) 2007-05-15
US20070215437A1 (en) 2007-09-20
CN101023011A (zh) 2007-08-22
AU2005262191A1 (en) 2006-01-19

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20070103

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid