WO2009157647A3 - 흡입력을 갖는 비접촉식 반송 플레이트 - Google Patents

흡입력을 갖는 비접촉식 반송 플레이트 Download PDF

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Publication number
WO2009157647A3
WO2009157647A3 PCT/KR2009/002393 KR2009002393W WO2009157647A3 WO 2009157647 A3 WO2009157647 A3 WO 2009157647A3 KR 2009002393 W KR2009002393 W KR 2009002393W WO 2009157647 A3 WO2009157647 A3 WO 2009157647A3
Authority
WO
WIPO (PCT)
Prior art keywords
air
plate
holes
top surface
eject
Prior art date
Application number
PCT/KR2009/002393
Other languages
English (en)
French (fr)
Other versions
WO2009157647A2 (ko
Inventor
이재성
Original Assignee
Lee Jae Sung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lee Jae Sung filed Critical Lee Jae Sung
Priority to CN2009801246877A priority Critical patent/CN102077337B/zh
Publication of WO2009157647A2 publication Critical patent/WO2009157647A2/ko
Publication of WO2009157647A3 publication Critical patent/WO2009157647A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)

Abstract

글라스의 반송과 동시에 소량의 흡입력이 발생되어 반송되는 글라스의 미세 떨림까지도 방지할 수 있고, 글라스가 접촉되는 상판을 내마모성이 좋으면서 대전방지 기능을 갖도록 하는 흡입력을 갖는 비접촉식 반송 플레이트가 개시된다. 본 발명에 따른 반송 플레이트는 챔버가 형성된 하판과, 하판의 상부면상에 겹쳐지며 챔버와 연통되는 다수의 결합공을 갖는 중판과, 중판의 상부면상에 겹쳐지며 결합공들과 연통되는 에어분출공을 갖는 상판과, 에분출공으로 삽입 고정되어 챔버의 에어를 수용하여 에어분출공과의 사이 틈새로 유도하는 에어분출 볼트를 포함한다. 이 때, 에어분출볼트의 상단에는 에어가 상측 사선방향으로 분출되도록 머리부가 형성되고, 에어분출볼트의 상부면상에는 오목한 홈이 형성되어 기압차에 의해 진공이 발생된다. 또한, 머리부의 하부면상에는 상측 사선방향으로 경사면이 형성되고, 에어분출공의 상단은 라운딩됨이 좋다. 그리고 상판의 상부면상에서부터 하판의 하부면상까지 에어가 벤트될 수 있도록 다수의 벤트공이 형성될 수도 있다. 또는 상판은 GUR (PE-UHMW)로 제작되어 내마모성 및 정전기를 방지할 수 있다.
PCT/KR2009/002393 2008-06-25 2009-05-07 흡입력을 갖는 비접촉식 반송 플레이트 WO2009157647A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009801246877A CN102077337B (zh) 2008-06-25 2009-05-07 具有吸附力的非接触式搬运板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080060221A KR100876337B1 (ko) 2008-06-25 2008-06-25 흡입력을 갖는 비접촉식 반송 플레이트
KR10-2008-0060221 2008-06-25

Publications (2)

Publication Number Publication Date
WO2009157647A2 WO2009157647A2 (ko) 2009-12-30
WO2009157647A3 true WO2009157647A3 (ko) 2010-02-25

Family

ID=40373307

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/002393 WO2009157647A2 (ko) 2008-06-25 2009-05-07 흡입력을 갖는 비접촉식 반송 플레이트

Country Status (3)

Country Link
KR (1) KR100876337B1 (ko)
CN (1) CN102077337B (ko)
WO (1) WO2009157647A2 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100916932B1 (ko) 2009-02-24 2009-09-15 이재성 대전방지용 레이전트 도막층의 틈새를 이용한 비접촉식 반송플레이트
KR100916933B1 (ko) 2009-03-20 2009-09-15 이재성 에어에 의해 부상과 반송을 시키는 비접촉식 반송플레이트
KR100913298B1 (ko) 2009-04-01 2009-08-26 이재성 진공을 이용하여 안정된 반송을 도모할 수 있는 비접촉식 반송플레이트
KR100938355B1 (ko) 2009-10-23 2010-01-22 이재성 헬리컬나선을 통해 균일하면서 높은 압력을 갖도록 에어가 분출되는 비접촉식 반송플레이트
KR101282902B1 (ko) * 2010-05-25 2013-07-05 주식회사 에이엠에이치시스템즈 코안다 효과를 이용한 비접촉 반송플레이트
KR101234017B1 (ko) 2010-08-03 2013-02-18 주식회사 에스에프에이 비접촉 반송장치
KR101276064B1 (ko) * 2011-02-15 2013-06-17 박봉선 비접촉 평판 이송장치
KR101187006B1 (ko) * 2012-04-24 2012-09-28 이재성 대면적 패널용 반송플레이트
KR101402692B1 (ko) 2013-05-24 2014-06-03 이성 주식회사 에어 플로팅 스테이지
JP7437187B2 (ja) 2020-02-26 2024-02-22 Ｊｓｗアクティナシステム株式会社 浮上搬送装置、及びレーザ処理装置
CN112278862B (zh) * 2020-10-13 2022-09-27 南京多脉智能设备有限公司 无摩擦气动式玻璃面板载具机械手

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000118712A (ja) * 1998-10-12 2000-04-25 Watanabe Shoko:Kk 浮上搬送装置用の気体噴出構造
KR100650290B1 (ko) * 2005-11-23 2006-11-27 (주)넥스트인스트루먼트 비접촉 반송플레이트
JP2006347719A (ja) * 2005-06-17 2006-12-28 Shinko Electric Co Ltd 気体浮上ユニット及び気体浮上搬送装置
KR20070037741A (ko) * 2004-07-09 2007-04-06 오씨 외를리콘 발처스 악티엔게젤샤프트 가스 베어링 기판-로딩 기구 프로세스
KR20070115805A (ko) * 2006-06-02 2007-12-06 에스엠씨 가부시키 가이샤 비접촉 반송장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000118712A (ja) * 1998-10-12 2000-04-25 Watanabe Shoko:Kk 浮上搬送装置用の気体噴出構造
KR20070037741A (ko) * 2004-07-09 2007-04-06 오씨 외를리콘 발처스 악티엔게젤샤프트 가스 베어링 기판-로딩 기구 프로세스
JP2006347719A (ja) * 2005-06-17 2006-12-28 Shinko Electric Co Ltd 気体浮上ユニット及び気体浮上搬送装置
KR100650290B1 (ko) * 2005-11-23 2006-11-27 (주)넥스트인스트루먼트 비접촉 반송플레이트
KR20070115805A (ko) * 2006-06-02 2007-12-06 에스엠씨 가부시키 가이샤 비접촉 반송장치

Also Published As

Publication number Publication date
WO2009157647A2 (ko) 2009-12-30
KR100876337B1 (ko) 2008-12-29
CN102077337A (zh) 2011-05-25
CN102077337B (zh) 2012-10-31

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