JP2008166816A5 - - Google Patents

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Publication number
JP2008166816A5
JP2008166816A5 JP2007339497A JP2007339497A JP2008166816A5 JP 2008166816 A5 JP2008166816 A5 JP 2008166816A5 JP 2007339497 A JP2007339497 A JP 2007339497A JP 2007339497 A JP2007339497 A JP 2007339497A JP 2008166816 A5 JP2008166816 A5 JP 2008166816A5
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JP
Japan
Prior art keywords
integrated circuit
circuit chip
package system
encapsulant
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007339497A
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English (en)
Japanese (ja)
Other versions
JP5348632B2 (ja
JP2008166816A (ja
Filing date
Publication date
Priority claimed from US11/618,806 external-priority patent/US8178982B2/en
Application filed filed Critical
Publication of JP2008166816A publication Critical patent/JP2008166816A/ja
Publication of JP2008166816A5 publication Critical patent/JP2008166816A5/ja
Application granted granted Critical
Publication of JP5348632B2 publication Critical patent/JP5348632B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007339497A 2006-12-30 2007-12-28 デュアルモールドマルチチップパッケージシステムおよびその製造方法 Active JP5348632B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/618,806 US8178982B2 (en) 2006-12-30 2006-12-30 Dual molded multi-chip package system
US11/618,806 2006-12-30

Publications (3)

Publication Number Publication Date
JP2008166816A JP2008166816A (ja) 2008-07-17
JP2008166816A5 true JP2008166816A5 (cg-RX-API-DMAC7.html) 2011-02-17
JP5348632B2 JP5348632B2 (ja) 2013-11-20

Family

ID=39582767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007339497A Active JP5348632B2 (ja) 2006-12-30 2007-12-28 デュアルモールドマルチチップパッケージシステムおよびその製造方法

Country Status (4)

Country Link
US (2) US8178982B2 (cg-RX-API-DMAC7.html)
JP (1) JP5348632B2 (cg-RX-API-DMAC7.html)
KR (1) KR101521254B1 (cg-RX-API-DMAC7.html)
TW (1) TWI441265B (cg-RX-API-DMAC7.html)

Families Citing this family (20)

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WO2007052198A1 (en) * 2005-11-01 2007-05-10 Nxp B.V. An air cavity package for a semiconductor die and methods of forming the air cavity package
US8178982B2 (en) 2006-12-30 2012-05-15 Stats Chippac Ltd. Dual molded multi-chip package system
TWI360207B (en) 2007-10-22 2012-03-11 Advanced Semiconductor Eng Chip package structure and method of manufacturing
US7888184B2 (en) * 2008-06-20 2011-02-15 Stats Chippac Ltd. Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof
US8076786B2 (en) * 2008-07-11 2011-12-13 Advanced Semiconductor Engineering, Inc. Semiconductor package and method for packaging a semiconductor package
US7842542B2 (en) 2008-07-14 2010-11-30 Stats Chippac, Ltd. Embedded semiconductor die package and method of making the same using metal frame carrier
US7993941B2 (en) * 2008-12-05 2011-08-09 Stats Chippac, Ltd. Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant
US8354304B2 (en) 2008-12-05 2013-01-15 Stats Chippac, Ltd. Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant
JP5238523B2 (ja) 2009-01-13 2013-07-17 株式会社日立国際電気 動画像符号化装置、動画像復号化装置、および、動画像復号化方法
US8003445B2 (en) * 2009-03-26 2011-08-23 Stats Chippac Ltd. Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (zh) 2010-03-22 2013-10-01 日月光半導體製造股份有限公司 半導體封裝件及其製造方法
US8409978B2 (en) * 2010-06-24 2013-04-02 Stats Chippac, Ltd. Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
US8598709B2 (en) * 2010-08-31 2013-12-03 Infineon Technologies Ag Method and system for routing electrical connections of semiconductor chips
US8753926B2 (en) 2010-09-14 2014-06-17 Qualcomm Incorporated Electronic packaging with a variable thickness mold cap
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
US9034692B2 (en) * 2011-03-21 2015-05-19 Stats Chippac Ltd. Integrated circuit packaging system with a flip chip and method of manufacture thereof
TWI590392B (zh) * 2015-08-03 2017-07-01 矽品精密工業股份有限公司 電子封裝件及其製法
JP7746888B2 (ja) * 2022-03-14 2025-10-01 住友電気工業株式会社 半導体装置およびその製造方法
CN117832190A (zh) * 2022-09-28 2024-04-05 星科金朋私人有限公司 集成封装及其制造方法

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