CN107808872B - 一种腔体向下的球栅阵列塑料封装制备方法 - Google Patents
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Abstract
本发明涉及一种腔体向下的球栅阵列塑料封装制备方法,包括如下步骤;槽体形成‑芯片贴片‑键合‑贴膜‑包封‑切割道形成‑揭膜‑植球;本发明是先在植球焊盘区域贴一张隔离膜,再采用模塑工艺方法将芯片、键合引线、焊盘等包封在IC载板同侧,然后去除焊盘上包封材料和隔离膜,可提高包封的密度、一致性、平整性及与IC载板结合强度,降低包封后的吸水性,显著提高了集成电路的信赖度,满足客户高可靠要求;该制备方法采用激光或等离子或机械加工等多种工艺,可灵活地加工塑封区域并控制厚度,减去了昂贵的塑封模具费用和长时间的模具开发周期,降低了运行成本和减少开发周期。
Description
技术领域
本发明涉及一种球栅阵列塑料封装制备方法,尤其是一种腔体向下的球栅阵列塑料封装制备方法,属于集成电路封装技术领域。
背景技术
球栅阵列塑料封装(PBGA)封装形式是引脚按二维阵列的方式排布在IC载板一个平面上,是集成电路高密度塑料封装的一种主要封装形式。腔体向下的球栅阵列塑料封装(cavity down PBGA)是球栅阵列塑料封装(PBGA)封装形式之一,其主要特征是阵列引脚与贴片塑封区在IC载板的同侧,与阵列引脚与贴片塑封区在IC载板的异侧相比,不仅可以减小集成电路的整体厚度,还可以留存IC载板的另外一侧用于其他开发,如把芯片贴装在热沉上,再在热沉上安装风扇、翅片等散热装置,来增加集成电路散热能力。腔体向下的球栅阵列塑料封装形式,传统工艺是采用灌封工艺来包封芯片和键合引线,传统封装工艺的密度、一致性、平整性及与IC载板结合强度较弱,降低了集成电路的信赖度,不能满足客户高可靠要求,同时小批量生产试验期间昂贵的塑封模具费用和长时间的模具开发周期,增加了运行成本和开发周期。
发明内容
本发明的目的是针对传统腔体向下的球栅阵列塑料封装工艺的缺陷,本发明提出了一种腔体向下的球栅阵列塑料封装制备方法,先在植球焊盘区域贴一张隔离膜,再采用模塑工艺方法来包封芯片、键合引线、焊盘等IC载板一面,再去除在焊盘上包封材料和隔离膜,可以提高包封的密度、一致性、平整性及与IC载板结合强度,降低包封后的吸水性,显著提高了集成电路的信赖度,满足客户高可靠要求。
为实现以上技术目的,本发明的技术方案是:一种腔体向下的球栅阵列塑料封装制备方法,其特征是:包括如下步骤:
步骤一. 槽体形成:选取一IC载板,通过激光或等离子或机械切割,在IC载板上的中心区域形成一个槽体;
在槽体四周的IC载板上均匀分布有若干个焊盘,焊盘间均通过传输线连接,且传输线深入到IC载板内部;
步骤二. 芯片贴片:通过贴片工艺把芯片安装在槽体内;
步骤三. 键合:利用键合工艺,将芯片通过键合引线与靠近槽体的焊盘(2)焊接;
步骤四. 贴膜:在IC载板的植球焊盘区域上贴附一张隔离膜,用于防止IC载板上植球焊盘区域的焊盘与包封料黏合;
步骤五. 包封:通过压缩或注塑工艺,将组装好的芯片、键合引线、焊盘利用包封料包封起来,并固化;
步骤六. 切割道形成:通过激光或等离子或机械切割工艺,对包封料进行切割,在IC载板上形成了切割道,所述切割道环绕在槽体四周;
步骤七. 揭膜:通过切割道将植球焊盘区域上的包封料和隔离膜剥离,使植球焊盘裸露出来;
步骤八. 植球:在植球焊盘上焊接焊球,用于引出芯片焊球作为芯片封装后的引脚。
进一步地,所述焊盘分为键合焊盘和植球焊盘,所述键合焊盘设置在槽体的四周,且通过键合引线与芯片连接,所述植球焊盘分布在键合焊盘的外侧,用于焊接焊球。
进一步地,所述切割道位于键合焊盘和植球焊盘之间。
进一步地,所述步骤五包封后,还可对包封料进行研磨,来调节封装体的厚度。
进一步地,所述IC载板包括环氧树脂或BT树脂、玻璃布及铜。
进一步地,所述包封料包括环氧树脂。
与传统球栅阵列制备工艺相比,本发明具有以下优点:
1)本发明球栅阵列塑料封装形式的阵列引脚和贴片塑封区在IC载板同侧,可以减小电路整体厚度,解决客户端应用对尺寸的制约,并可留存IC载板另外一侧用于其他开发,如把芯片贴装在热沉上,再在热沉上安装风扇、翅片等散热装置,来增加集成电路散热能力;
2)相比传统的灌封工艺,本发明制备工艺采用压缩或注塑等模塑工艺,可以使电路的信赖度更高,满足高可靠要求;
3)相比传统塑封需要定制开模的局限性,本发明使用激光或等离子或机械切割等工艺方式,可以灵活地制备修饰塑封区域和厚度,省去了传统塑封模具开模周期,节省了高昂的开模费用;
4)本发明在植球焊盘和包封料间采用隔离膜,可有效隔离IC载板上植球焊盘区域与包封料结合,保证焊球有效焊接在植球焊盘上。
附图说明
图1为本发明的工艺流程简图。
图2为本发明IC载板上槽体形成的剖面结构示意图。
图3为本发明焊盘形成的剖面结构示意图。
图4为本发明芯片贴片后的剖面结构示意图。
图5为本发明隔离膜形成的剖面结构示意图。
图6为本发明包封后的剖面结构示意图。
图7为本发明切割道形成的剖面结构示意图。
图8为本发明玻璃包封料和隔离膜后的剖面结构示意图。
图9为本发明的剖面结构示意图。
附图标记说明:1-IC载板、2-焊盘、21-键合焊盘、22-植球焊盘、3-传输线、4-芯片、5-键合引线、6-隔离膜、7-包封料、8-焊球、9-槽体、10-切割道。
具体实施方式
下面结合具体附图和实施例对本发明作进一步说明。
本发明不限于以下的实施方式,在以下的说明中所参照的各图是为了能够对本发明的内容进行理解而设置的,即本发明不限于各图所举例的结构。
本发明实施例中的一种腔体向下的球栅阵列塑料封装制备方法,其特征是:包括如下步骤:
步骤一. 槽体形成:选取一IC载板1,通过激光或等离子或机械切割,在IC载板1上的中心区域形成一个槽体9;
所述IC载板1包括环氧树脂或BT树脂、玻璃布及铜;
在槽体9四周的IC载板1上焊接若干个均匀分布的焊盘2,所述焊盘2均通过传输线3连接,且传输线3深入到IC载板1内部;
所述焊盘2分为键合焊盘21和植球焊盘22,所述键合焊盘21设置在槽体9的四周,且通过键合引线5与芯片4焊接,所述植球焊盘22分布在键合焊盘21的外侧,用于焊接焊球8;
步骤二. 芯片贴片:通过贴片工艺把芯片4安装在槽体9内;
步骤三. 键合:利用键合工艺,将芯片4通过键合引线5与靠近槽体9的焊盘2(即键合焊盘21)焊接;
步骤四. 贴膜:在IC载板1的植球焊盘区域上贴附一张隔离膜6,用于防止IC载板1上植球焊盘区域的焊盘2(即植球焊盘22)与包封料7黏合;
步骤五. 包封:通过压缩或注塑工艺,将组装好的芯片4、键合引线5、焊盘2利用包封料7包封起来,并固化;所述包封料7包括环氧树脂;
包封后,还可对包封料7进行研磨,来调节封装体的厚度;
步骤六. 切割道形成:通过激光或等离子或机械切割工艺,对包封料7进行切割,在IC载板1上形成了切割道10,所述切割道10环绕在槽体9四周;所述切割道10位于键合焊盘21和植球焊盘22之间;
步骤七. 揭膜:通过切割道10将植球焊盘区域上的包封料7和隔离膜6剥离,使用于植球的焊盘2(即植球焊盘)裸露出来;
步骤八. 植球:在植球焊盘22上焊接焊球8,用于引出芯片4焊球8作为芯片封装后的引脚。
本发明实施例中的芯片4通过键合引线5与键合焊盘21连接,所述键合焊盘21通过传输线3与多个植球焊盘22连接,所述植球焊盘22与焊球8焊接,因此,焊球8用于引出芯片4,并作为芯片封装后的引脚。
本发明的IC载板1和包封料7形成一个容纳芯片4的腔体,再采用常规装片、键合的封装工艺,在植球焊盘区域贴一张隔离膜,解决了包封料7和植球焊盘22容易结合的问题,再采用模塑工艺将芯片4、键合引线5、焊盘2等包封在IC载板1的同一侧,然后去除在焊盘2上包封塑料和隔离膜6露出植球焊盘22,最后采用植球、切割、打印等工艺,完成集成电路的整体封装,满足腔体向下的球栅阵列塑料封装的需求。
以上对本发明及其实施方式进行了描述,该描述没有限制性,附图中所示的也只是本发明的实施方式之一,实际结构并不局限于此。总而言之如果本领域的普通技术人员受其启示,在不脱离本发明创造宗旨的情况下,不经创造性的设计出与该技术方案相似的结构方式及实施例,均应属于本发明的保护范围。
Claims (6)
1.一种腔体向下的球栅阵列塑料封装制备方法,其特征是:包括如下步骤:
步骤一. 槽体形成:选取一IC载板(1),通过激光或等离子或机械切割,在IC载板(1)上的中心区域形成一个槽体(9);
在槽体(9)四周的IC载板(1)上均匀分布有若干个焊盘(2),焊盘(2)间均通过传输线(3)连接,且传输线(3)深入到IC载板(1)内部;
步骤二. 芯片贴片:通过贴片工艺把芯片(4)安装在槽体(9)内;
步骤三. 键合:利用键合工艺,将芯片(4)通过键合引线(5)与靠近槽体(9)的焊盘(2)焊接;
步骤四. 贴膜:在IC载板(1)的植球焊盘区域上贴附一张隔离膜(6),用于防止IC载板(1)上植球焊盘区域的焊盘(2)与包封料(7)黏合;
步骤五. 包封:通过压缩或注塑工艺,将组装好的芯片(4)、键合引线(5)、焊盘(2)利用包封料(7)包封起来,并固化;
步骤六. 切割道形成:通过激光或等离子或机械切割工艺,对包封料(7)进行切割,在IC载板(1)上形成了切割道(10),所述切割道(10)环绕在槽体(9)四周;
步骤七. 揭膜:通过切割道(10)将植球焊盘区域上的包封料(7)和隔离膜(6)剥离,使植球焊盘(22)裸露出来;
步骤八. 植球:在植球焊盘(22)上焊接焊球(8),焊球(8)用于引出芯片(4),并作为芯片封装后的引脚。
2.根据权利要求1所述的一种腔体向下的球栅阵列塑料封装制备方法,其特征在于,所述焊盘(2)分为键合焊盘(21)和植球焊盘(22),所述键合焊盘(21)设置在槽体(9)的四周,且通过键合引线(5)与芯片(4)连接,所述植球焊盘(22)分布在键合焊盘(21)的外侧,用于焊接焊球(8)。
3.根据权利要求2所述的一种腔体向下的球栅阵列塑料封装制备方法,其特征在于,所述切割道(10)位于键合焊盘(21)和植球焊盘(22)之间。
4.根据权利要求1所述的一种腔体向下的球栅阵列塑料封装制备方法,其特征在于,所述步骤五包封后,还可对包封料(7)进行研磨,来调节封装体的厚度。
5.根据权利要求1所述的一种腔体向下的球栅阵列塑料封装制备方法,其特征在于,所述IC载板(1)包括环氧树脂或BT树脂、玻璃布及铜。
6.根据权利要求1所述的一种腔体向下的球栅阵列塑料封装制备方法,其特征在于,所述包封料(7)包括环氧树脂。
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