CN206163483U - 包括薄膜体声波器件裸芯片在内的多芯片模组封装结构 - Google Patents
包括薄膜体声波器件裸芯片在内的多芯片模组封装结构 Download PDFInfo
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- CN206163483U CN206163483U CN201621225249.3U CN201621225249U CN206163483U CN 206163483 U CN206163483 U CN 206163483U CN 201621225249 U CN201621225249 U CN 201621225249U CN 206163483 U CN206163483 U CN 206163483U
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- chip
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- acoustic wave
- bulk acoustic
- substrate
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- 238000004806 packaging method and process Methods 0.000 title abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 36
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000010931 gold Substances 0.000 claims abstract description 5
- 229910052737 gold Inorganic materials 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 25
- 239000010410 layer Substances 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000009504 vacuum film coating Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 235000015110 jellies Nutrition 0.000 description 1
- 239000008274 jelly Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621225249.3U CN206163483U (zh) | 2016-11-15 | 2016-11-15 | 包括薄膜体声波器件裸芯片在内的多芯片模组封装结构 |
Applications Claiming Priority (1)
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CN201621225249.3U CN206163483U (zh) | 2016-11-15 | 2016-11-15 | 包括薄膜体声波器件裸芯片在内的多芯片模组封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206163483U true CN206163483U (zh) | 2017-05-10 |
Family
ID=58659893
Family Applications (1)
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CN201621225249.3U Active CN206163483U (zh) | 2016-11-15 | 2016-11-15 | 包括薄膜体声波器件裸芯片在内的多芯片模组封装结构 |
Country Status (1)
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CN (1) | CN206163483U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106783814A (zh) * | 2016-11-15 | 2017-05-31 | 中国电子科技集团公司第二十六研究所 | 一种薄膜体声波器件裸芯片模组封装结构及封装方法 |
TWI721315B (zh) * | 2018-09-05 | 2021-03-11 | 立積電子股份有限公司 | 體聲波結構、體聲波裝置及其製造方法 |
TWI766476B (zh) * | 2018-09-05 | 2022-06-01 | 立積電子股份有限公司 | 體聲波裝置 |
-
2016
- 2016-11-15 CN CN201621225249.3U patent/CN206163483U/zh active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106783814A (zh) * | 2016-11-15 | 2017-05-31 | 中国电子科技集团公司第二十六研究所 | 一种薄膜体声波器件裸芯片模组封装结构及封装方法 |
TWI721315B (zh) * | 2018-09-05 | 2021-03-11 | 立積電子股份有限公司 | 體聲波結構、體聲波裝置及其製造方法 |
TWI766476B (zh) * | 2018-09-05 | 2022-06-01 | 立積電子股份有限公司 | 體聲波裝置 |
US11362637B2 (en) | 2018-09-05 | 2022-06-14 | Richwave Technology Corp. | Bulk acoustic wave structure, bulk acoustic wave device, and manufacturing method thereof |
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Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220531 Address after: No.23 Xiyong Avenue, Shapingba District, Chongqing 401332 Patentee after: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION CHONGQING ACOUSTIC-OPTIC-ELECTRONIC CO.,LTD. Address before: 400060 Chongqing Nanping Nan'an District No. 14 Huayuan Road Patentee before: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO.26 Research Institute |
|
TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: No.23 Xiyong Avenue, Shapingba District, Chongqing 401332 Patentee after: CETC Chip Technology (Group) Co.,Ltd. Country or region after: China Address before: No.23 Xiyong Avenue, Shapingba District, Chongqing 401332 Patentee before: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION CHONGQING ACOUSTIC-OPTIC-ELECTRONIC CO.,LTD. Country or region before: China |