JP2008091910A - 半導体レーザ - Google Patents
半導体レーザ Download PDFInfo
- Publication number
- JP2008091910A JP2008091910A JP2007251152A JP2007251152A JP2008091910A JP 2008091910 A JP2008091910 A JP 2008091910A JP 2007251152 A JP2007251152 A JP 2007251152A JP 2007251152 A JP2007251152 A JP 2007251152A JP 2008091910 A JP2008091910 A JP 2008091910A
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- semiconductor laser
- absorption region
- semiconductor
- absorption
- region
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 195
- 238000010521 absorption reaction Methods 0.000 claims abstract description 141
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 61
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000011358 absorbing material Substances 0.000 claims description 17
- 150000004767 nitrides Chemical class 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 238000002835 absorbance Methods 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- 229910052735 hafnium Inorganic materials 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229910052785 arsenic Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 24
- 238000005530 etching Methods 0.000 description 6
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- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000002745 absorbent Effects 0.000 description 4
- 239000002250 absorbent Substances 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000005253 cladding Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- -1 nitride compound Chemical class 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 208000012868 Overgrowth Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
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- 238000007648 laser printing Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
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- 239000001301 oxygen Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2232—Buried stripe structure with inner confining structure between the active layer and the lower electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/16—Semiconductor lasers with special structural design to influence the modes, e.g. specific multimode
- H01S2301/166—Single transverse or lateral mode
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- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/12—Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1053—Comprising an active region having a varying composition or cross-section in a specific direction
- H01S5/1064—Comprising an active region having a varying composition or cross-section in a specific direction varying width along the optical axis
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1237—Lateral grating, i.e. grating only adjacent ridge or mesa
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2018—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
- H01S5/2022—Absorbing region or layer parallel to the active layer, e.g. to influence transverse modes
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2214—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2214—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides
- H01S5/2216—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides nitrides
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2218—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties
- H01S5/2219—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties absorbing
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2218—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties
- H01S5/222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties having a refractive index lower than that of the cladding layers or outer guiding layers
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
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- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006046297A DE102006046297A1 (de) | 2006-09-29 | 2006-09-29 | Halbleiterlaser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008091910A true JP2008091910A (ja) | 2008-04-17 |
| JP2008091910A5 JP2008091910A5 (https=) | 2011-06-16 |
Family
ID=38667082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007251152A Pending JP2008091910A (ja) | 2006-09-29 | 2007-09-27 | 半導体レーザ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20080089374A1 (https=) |
| EP (1) | EP1906498A1 (https=) |
| JP (1) | JP2008091910A (https=) |
| DE (1) | DE102006046297A1 (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012009650A (ja) * | 2010-06-25 | 2012-01-12 | Sharp Corp | 窒化物半導体レーザ素子およびその製造方法 |
| WO2014050230A1 (ja) * | 2012-09-25 | 2014-04-03 | 日本電気株式会社 | 高次モードフィルタ |
| CN111490455A (zh) * | 2019-01-29 | 2020-08-04 | 夏普株式会社 | 氮化物半导体激光元件及半导体激光装置 |
| JP2022504105A (ja) * | 2018-10-15 | 2022-01-13 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 半導体レーザおよび半導体レーザの製造方法 |
| JP2023176020A (ja) * | 2019-03-14 | 2023-12-12 | エイエムエス-オスラム インターナショナル ゲーエムベーハー | 半導体レーザダイオードおよび半導体レーザダイオードの製造方法 |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008025922B4 (de) | 2008-05-30 | 2020-02-06 | Osram Opto Semiconductors Gmbh | Kantenemittierender Halbleiterlaser mit Phasenstruktur |
| DE102008058436B4 (de) | 2008-11-21 | 2019-03-07 | Osram Opto Semiconductors Gmbh | Kantenemittierender Halbleiterlaserchip |
| DE102009015314B4 (de) * | 2009-03-27 | 2023-04-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaservorrichtung |
| JP2011243939A (ja) * | 2010-01-20 | 2011-12-01 | Panasonic Corp | 窒化物半導体レーザ装置 |
| DE102011123129B4 (de) * | 2011-05-02 | 2025-04-30 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Laserlichtquelle mit Modenfilterstruktur |
| DE102011100175B4 (de) | 2011-05-02 | 2021-12-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Laserlichtquelle mit einer Stegwellenleiterstruktur und einer Modenfilterstruktur |
| DE102011103952B4 (de) | 2011-06-10 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Kantenemittierender Halbleiterlaser |
| DE102012103549B4 (de) * | 2012-04-23 | 2020-06-18 | Osram Opto Semiconductors Gmbh | Halbleiterlaserlichtquelle mit einem kantenemittierenden Halbleiterkörper und Licht streuenden Teilbereich |
| DE102012106687B4 (de) * | 2012-07-24 | 2019-01-24 | Osram Opto Semiconductors Gmbh | Steglaser |
| DE102012109175B4 (de) | 2012-09-27 | 2019-02-28 | Osram Opto Semiconductors Gmbh | Halbleiterlaserdiode |
| DE102012110613A1 (de) * | 2012-11-06 | 2014-05-08 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
| DE102012111512B4 (de) * | 2012-11-28 | 2021-11-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterstreifenlaser |
| DE102013223499C5 (de) * | 2013-11-18 | 2020-03-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Breitstreifenlaser und Verfahren zum Herstellen eines Breitstreifenlasers |
| US10199800B2 (en) * | 2015-07-28 | 2019-02-05 | Sony Corporation | Light emitting element |
| DE102015119226A1 (de) | 2015-11-09 | 2017-05-11 | Osram Opto Semiconductors Gmbh | Halbleiterlaserdiode |
| DE102016103358A1 (de) * | 2016-02-25 | 2017-08-31 | Osram Opto Semiconductors Gmbh | Laserbarren mit gräben |
| DE102016106495A1 (de) | 2016-04-08 | 2017-10-12 | Osram Opto Semiconductors Gmbh | Halbleiterlaser |
| US10777968B2 (en) | 2016-10-28 | 2020-09-15 | Nlight, Inc. | Method, system and apparatus for higher order mode suppression |
| DE102019103909A1 (de) | 2019-02-15 | 2020-08-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Kantenemittierende Laserdiode und Verfahren für deren Herrstellung |
| US11828934B1 (en) | 2019-07-10 | 2023-11-28 | X Development Llc | High-dispersion optical components and methods for making the same |
| WO2021030639A1 (en) * | 2019-08-13 | 2021-02-18 | Nlight, Inc. | Method, system and apparatus for higher order mode suppression |
| US11011884B1 (en) * | 2019-08-29 | 2021-05-18 | X Development Llc | Systems and methods for designing optical devices having mode selective facets |
| US11455443B1 (en) | 2019-08-29 | 2022-09-27 | X Development Llc | Methods and systems for designing image processing devices |
| US11604957B1 (en) | 2019-09-20 | 2023-03-14 | X Development Llc | Methods for designing hybrid neural networks having physical and digital components |
| US11092746B1 (en) | 2019-12-18 | 2021-08-17 | X Development Llc | Post-fabrication photonic performance tuning |
| US12061851B1 (en) | 2019-12-18 | 2024-08-13 | X Development Llc | Systems and methods for designing photonic computational architectures |
| US11835715B1 (en) | 2019-12-19 | 2023-12-05 | X Development Llc | Multimodal photonic components |
| US11842129B1 (en) | 2020-05-28 | 2023-12-12 | X Development Llc | Finite floating-point numerical simulation and optimization |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936474A (ja) * | 1995-07-14 | 1997-02-07 | Mitsubishi Electric Corp | 半導体レーザ及びその製造方法 |
| JPH11112075A (ja) * | 1997-09-30 | 1999-04-23 | Fujitsu Ltd | 半導体レーザ装置及びその製造方法 |
| JP2001148545A (ja) * | 1999-09-09 | 2001-05-29 | Sharp Corp | 窒化物半導体レーザ素子およびその製造方法 |
| JP2001148544A (ja) * | 1999-09-10 | 2001-05-29 | Sharp Corp | 半導体発光素子 |
| JP2002270967A (ja) * | 2001-03-13 | 2002-09-20 | Nichia Chem Ind Ltd | 半導体レーザ素子 |
| JP2003163419A (ja) * | 2001-11-29 | 2003-06-06 | Sanyo Electric Co Ltd | 窒化物系半導体発光素子 |
| JP2004253776A (ja) * | 2003-01-31 | 2004-09-09 | Sharp Corp | 半導体レーザ素子及び光学式情報記録装置 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5219785A (en) * | 1989-01-27 | 1993-06-15 | Spectra Diode Laboratories, Inc. | Method of forming current barriers in semiconductor lasers |
| US5974069A (en) * | 1994-09-16 | 1999-10-26 | Rohm Co., Ltd | Semiconductor laser and manufacturing method thereof |
| US5963573A (en) * | 1997-08-25 | 1999-10-05 | 3M Innovative Properties Company | Light absorbing layer for II-VI semiconductor light emitting devices |
| JPH1187850A (ja) * | 1997-09-03 | 1999-03-30 | Sharp Corp | 窒化物系化合物半導体レーザ素子及びレーザ装置 |
| US6141365A (en) * | 1997-12-31 | 2000-10-31 | Lasertron | Semiconductor laser with kink suppression layer |
| JP3653169B2 (ja) * | 1998-01-26 | 2005-05-25 | シャープ株式会社 | 窒化ガリウム系半導体レーザ素子 |
| JPH11251685A (ja) * | 1998-03-05 | 1999-09-17 | Toshiba Corp | 半導体レーザ |
| US6287946B1 (en) * | 1999-05-05 | 2001-09-11 | Hrl Laboratories, Llc | Fabrication of low resistance, non-alloyed, ohmic contacts to InP using non-stoichiometric InP layers |
| JP2002131713A (ja) * | 2000-10-19 | 2002-05-09 | Mitsubishi Electric Corp | 光半導体デバイス |
| DE10105722B4 (de) * | 2001-02-08 | 2006-12-14 | Osram Opto Semiconductors Gmbh | Halbleiter-Laser mit Vertikalresonator und modenselektiven Gebieten |
| JP2002299765A (ja) * | 2001-04-03 | 2002-10-11 | Sony Corp | 半導体レーザ素子及びその作製方法 |
| JP3849758B2 (ja) * | 2001-04-12 | 2006-11-22 | ソニー株式会社 | 半導体レーザ素子 |
| JP2003007621A (ja) * | 2001-06-21 | 2003-01-10 | Nikko Materials Co Ltd | GaN系化合物半導体結晶の製造方法 |
| US7167489B2 (en) * | 2001-09-21 | 2007-01-23 | Sharp Kabushiki Kaisha | GaN-based semiconductor laser device |
| EP1320158A1 (en) * | 2001-12-13 | 2003-06-18 | Agilent Technologies, Inc. (a Delaware corporation) | Means of controlling dopant diffusion in a semiconductor heterostructure |
| WO2003075425A1 (fr) * | 2002-03-01 | 2003-09-12 | Sanyo Electric Co., Ltd. | Element laser a semi-conducteur a base de nitrure |
| US6862300B1 (en) * | 2002-09-17 | 2005-03-01 | Bookham Technology Plc | High power semiconductor laser diode and method for making such a diode |
| JP4830315B2 (ja) * | 2004-03-05 | 2011-12-07 | 日亜化学工業株式会社 | 半導体レーザ素子 |
| JP4551121B2 (ja) * | 2004-05-24 | 2010-09-22 | シャープ株式会社 | 半導体レーザ装置 |
| KR100657938B1 (ko) * | 2004-12-17 | 2006-12-14 | 삼성전기주식회사 | 반도체 레이저 다이오드 |
| JP4193867B2 (ja) * | 2006-05-02 | 2008-12-10 | ソニー株式会社 | GaN系半導体レーザの製造方法 |
-
2006
- 2006-09-29 DE DE102006046297A patent/DE102006046297A1/de not_active Withdrawn
-
2007
- 2007-09-05 EP EP07017398A patent/EP1906498A1/de not_active Withdrawn
- 2007-09-27 JP JP2007251152A patent/JP2008091910A/ja active Pending
- 2007-10-01 US US11/906,410 patent/US20080089374A1/en not_active Abandoned
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936474A (ja) * | 1995-07-14 | 1997-02-07 | Mitsubishi Electric Corp | 半導体レーザ及びその製造方法 |
| JPH11112075A (ja) * | 1997-09-30 | 1999-04-23 | Fujitsu Ltd | 半導体レーザ装置及びその製造方法 |
| JP2001148545A (ja) * | 1999-09-09 | 2001-05-29 | Sharp Corp | 窒化物半導体レーザ素子およびその製造方法 |
| JP2001148544A (ja) * | 1999-09-10 | 2001-05-29 | Sharp Corp | 半導体発光素子 |
| JP2002270967A (ja) * | 2001-03-13 | 2002-09-20 | Nichia Chem Ind Ltd | 半導体レーザ素子 |
| JP2003163419A (ja) * | 2001-11-29 | 2003-06-06 | Sanyo Electric Co Ltd | 窒化物系半導体発光素子 |
| JP2004253776A (ja) * | 2003-01-31 | 2004-09-09 | Sharp Corp | 半導体レーザ素子及び光学式情報記録装置 |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8379682B2 (en) | 2010-06-25 | 2013-02-19 | Sharp Kabushiki Kaisha | Nitride semiconductor laser chip and method of fabrication thereof |
| JP2012009650A (ja) * | 2010-06-25 | 2012-01-12 | Sharp Corp | 窒化物半導体レーザ素子およびその製造方法 |
| WO2014050230A1 (ja) * | 2012-09-25 | 2014-04-03 | 日本電気株式会社 | 高次モードフィルタ |
| JPWO2014050230A1 (ja) * | 2012-09-25 | 2016-08-22 | 日本電気株式会社 | 高次モードフィルタ |
| US9429693B2 (en) | 2012-09-25 | 2016-08-30 | Nec Corporation | High-order mode filter |
| JP7154405B2 (ja) | 2018-10-15 | 2022-10-17 | エイエムエス-オスラム インターナショナル ゲーエムベーハー | 半導体レーザおよび半導体レーザの製造方法 |
| US12009632B2 (en) | 2018-10-15 | 2024-06-11 | Osram Opto Semiconductors Gmbh | Semiconductor laser and production method for a semiconductor laser |
| JP2022504105A (ja) * | 2018-10-15 | 2022-01-13 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 半導体レーザおよび半導体レーザの製造方法 |
| JP2020123716A (ja) * | 2019-01-29 | 2020-08-13 | シャープ株式会社 | 窒化物半導体レーザ素子および半導体レーザ装置 |
| CN111490455B (zh) * | 2019-01-29 | 2023-06-20 | 夏普株式会社 | 氮化物半导体激光元件及半导体激光装置 |
| CN111490455A (zh) * | 2019-01-29 | 2020-08-04 | 夏普株式会社 | 氮化物半导体激光元件及半导体激光装置 |
| JP2023176020A (ja) * | 2019-03-14 | 2023-12-12 | エイエムエス-オスラム インターナショナル ゲーエムベーハー | 半導体レーザダイオードおよび半導体レーザダイオードの製造方法 |
| JP7604595B2 (ja) | 2019-03-14 | 2024-12-23 | エイエムエス-オスラム インターナショナル ゲーエムベーハー | 半導体レーザダイオードおよび半導体レーザダイオードの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1906498A1 (de) | 2008-04-02 |
| DE102006046297A1 (de) | 2008-04-03 |
| US20080089374A1 (en) | 2008-04-17 |
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