JP2008030151A - 直線移動機構およびこれを用いた搬送ロボット - Google Patents
直線移動機構およびこれを用いた搬送ロボット Download PDFInfo
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- JP2008030151A JP2008030151A JP2006206179A JP2006206179A JP2008030151A JP 2008030151 A JP2008030151 A JP 2008030151A JP 2006206179 A JP2006206179 A JP 2006206179A JP 2006206179 A JP2006206179 A JP 2006206179A JP 2008030151 A JP2008030151 A JP 2008030151A
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- 230000007246 mechanism Effects 0.000 title claims abstract description 143
- 238000004891 communication Methods 0.000 claims description 5
- 230000002452 interceptive effect Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000003028 elevating effect Effects 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011553 magnetic fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/104—Programme-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/04—Arms extensible rotatable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】 本発明に係る直線移動機構B1は、ガイド部材1と、このガイド部材1上に設定された水平直線状の移動行程GLに沿って移動可能な2つの移動部材と、駆動プーリ31b、およびこの駆動プーリ31bに掛け回されて移動行程GLの平行線に沿う所定の往復動区間3Aa,3Bbを往復動する出力ベルト33を含んで構成された駆動機構3A,3Bと、駆動プーリ31bを駆動するためのモータM3,M4とを備え、移動部材は、連結部材24a,24bによって駆動機構3A,3Bの出力ベルト33にそれぞれ連結されており、駆動機構3A,3BおよびモータM3,M4は、それぞれガイド部材1に支持されている。
【選択図】 図7
Description
B1 直線移動機構
GL 移動行程
M3 モータ(第1駆動源)
M4 モータ(第2駆動源)
Os 旋回軸
W ワーク
1 ガイド部材
17 モータハウジング(ハウジング)
18 管体(連通路)
2A 第1移動部材
2B 第2移動部材
21a,21b ハンド
24a,24b 連結部材
3A 第1駆動機構
3B 第2駆動機構
3Aa,3Bb 区間(往復動区間)
31b 駆動プーリ
200 固定ベース
Claims (7)
- ガイド部材と、このガイド部材上に設定された水平直線状の移動行程に沿って移動可能な移動部材と、駆動プーリ、およびこの駆動プーリに掛け回されて上記移動行程の平行線に沿う所定の往復動区間を往復動する出力ベルトを含んで構成された駆動機構と、上記駆動プーリを駆動するための駆動源とを備え、
上記移動部材は、連結部材によって上記駆動機構の上記出力ベルトに連結されており、
上記駆動機構および上記駆動源は、それぞれ上記ガイド部材に支持されていることを特徴とする、直線移動機構。 - 上記駆動源は、上記移動部材に近接して配置されている、請求項1に記載の直線移動機構。
- 上記駆動機構は、上記出力ベルトに張力を付与するテンショナーを含んでいる、請求項1または2に記載の直線移動機構。
- 上記移動部材は、上記移動行程に沿って相互に干渉することなく移動可能に上記ガイド部材に支持された第1移動部材および第2移動部材を含んでいるとともに、
上記駆動機構は、上記第1移動部材および上記第2移動部材をそれぞれ駆動するように上記ガイド部材に設けられた第1駆動機構および第2駆動機構を含んでおり、
上記駆動源としては、上記第1駆動機構および上記第2移動機構にそれぞれ駆動力を付与するための第1駆動源および第2駆動源を備えている、請求項1ないし3のいずれかに記載の直線移動機構。 - 上記第1駆動源および上記第2駆動源は、上記移動行程に沿う方向に離間して配置されている、請求項4に記載の直線移動機構。
- 請求項1ないし5のいずれかに記載の直線移動機構が固定ベースに対し、上記移動行程上における鉛直状の旋回軸を中心として旋回しうるように支持されているとともに、上記移動部材には、板状ワークを載置しうるハンドが設けられていることを特徴とする、搬送ロボット。
- 上記駆動源は、ハウジング内に気密された状態で上記ガイド部材に支持されており、
上記ハウジングには、上記気密状態を維持したまま上記固定ベースと連通する連通路が連結されている、請求項6に記載の搬送ロボット。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006206179A JP4694436B2 (ja) | 2006-07-28 | 2006-07-28 | 搬送ロボット |
TW096123747A TWI433764B (zh) | 2006-07-28 | 2007-06-29 | A linear moving mechanism and a handling robot using the mechanism |
US11/879,613 US7850414B2 (en) | 2006-07-28 | 2007-07-18 | Linear transfer mechanism and transfer robot using the same |
KR1020070074462A KR101438150B1 (ko) | 2006-07-28 | 2007-07-25 | 반송 로봇 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006206179A JP4694436B2 (ja) | 2006-07-28 | 2006-07-28 | 搬送ロボット |
Publications (3)
Publication Number | Publication Date |
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JP2008030151A true JP2008030151A (ja) | 2008-02-14 |
JP2008030151A5 JP2008030151A5 (ja) | 2009-07-16 |
JP4694436B2 JP4694436B2 (ja) | 2011-06-08 |
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JP2006206179A Active JP4694436B2 (ja) | 2006-07-28 | 2006-07-28 | 搬送ロボット |
Country Status (4)
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US (1) | US7850414B2 (ja) |
JP (1) | JP4694436B2 (ja) |
KR (1) | KR101438150B1 (ja) |
TW (1) | TWI433764B (ja) |
Cited By (11)
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WO2010070896A1 (ja) * | 2008-12-18 | 2010-06-24 | 東京エレクトロン株式会社 | 真空処理装置及び真空搬送装置 |
KR100987362B1 (ko) * | 2008-09-02 | 2010-10-13 | 주식회사 티이에스 | 반송챔버 내에서 사용하기에 적합한 기판반송장치 |
KR101022057B1 (ko) | 2010-09-28 | 2011-03-16 | 주식회사 티이에스 | 반송챔버 내에서 사용하기에 적합한 기판반송장치 |
KR101023050B1 (ko) * | 2008-10-30 | 2011-03-24 | 주식회사 티이에스 | 진공환경의 반송챔버 내에서 대형기판을 반송시키는데 적합한 기판반송장치 |
US8499430B2 (en) | 2009-07-31 | 2013-08-06 | Tokyo Electron Limited | Assembly method of transfer mechanism and transfer chamber |
KR101338857B1 (ko) * | 2011-01-31 | 2013-12-16 | 주식회사 나온테크 | 4개의 기판 지지부 갖는 기판 이송 장치 |
KR101338858B1 (ko) * | 2011-01-31 | 2013-12-16 | 주식회사 나온테크 | 개별적으로 구동되는 핸드를 갖는 기판 이송 장치 및 그 제어 방법 |
JP2015080828A (ja) * | 2013-10-22 | 2015-04-27 | 日本電産サンキョー株式会社 | 産業用ロボット |
WO2019021832A1 (ja) * | 2017-07-28 | 2019-01-31 | 日本電産サンキョー株式会社 | 産業用ロボット |
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CN110944805B (zh) * | 2017-07-28 | 2023-02-21 | 日本电产三协株式会社 | 工业用机器人 |
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JP4694436B2 (ja) | 2011-06-08 |
KR101438150B1 (ko) | 2014-09-05 |
TWI433764B (zh) | 2014-04-11 |
US20080023293A1 (en) | 2008-01-31 |
US7850414B2 (en) | 2010-12-14 |
TW200823025A (en) | 2008-06-01 |
KR20080011073A (ko) | 2008-01-31 |
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