JP2007535825A5 - - Google Patents

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Publication number
JP2007535825A5
JP2007535825A5 JP2007510982A JP2007510982A JP2007535825A5 JP 2007535825 A5 JP2007535825 A5 JP 2007535825A5 JP 2007510982 A JP2007510982 A JP 2007510982A JP 2007510982 A JP2007510982 A JP 2007510982A JP 2007535825 A5 JP2007535825 A5 JP 2007535825A5
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JP
Japan
Prior art keywords
transmission line
signal transmission
line structure
structure according
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007510982A
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English (en)
Japanese (ja)
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JP2007535825A (ja
JP4776618B2 (ja
Filing date
Publication date
Priority claimed from US10/709,357 external-priority patent/US7005371B2/en
Application filed filed Critical
Publication of JP2007535825A publication Critical patent/JP2007535825A/ja
Publication of JP2007535825A5 publication Critical patent/JP2007535825A5/ja
Application granted granted Critical
Publication of JP4776618B2 publication Critical patent/JP4776618B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2007510982A 2004-04-29 2005-04-28 半導体装置用のバックエンド工程伝送線路構造（バックエンド工程処理におけるサスペンデッド伝送線路構造の形成方法） Expired - Fee Related JP4776618B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/709,357 2004-04-29
US10/709,357 US7005371B2 (en) 2004-04-29 2004-04-29 Method of forming suspended transmission line structures in back end of line processing
PCT/US2005/014645 WO2005112105A1 (en) 2004-04-29 2005-04-28 Method for forming suspended transmission line structures in back end of line processing

Publications (3)

Publication Number Publication Date
JP2007535825A JP2007535825A (ja) 2007-12-06
JP2007535825A5 true JP2007535825A5 (enExample) 2008-05-08
JP4776618B2 JP4776618B2 (ja) 2011-09-21

Family

ID=35187662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007510982A Expired - Fee Related JP4776618B2 (ja) 2004-04-29 2005-04-28 半導体装置用のバックエンド工程伝送線路構造（バックエンド工程処理におけるサスペンデッド伝送線路構造の形成方法）

Country Status (7)

Country Link
US (2) US7005371B2 (enExample)
EP (1) EP1756862A4 (enExample)
JP (1) JP4776618B2 (enExample)
KR (1) KR101006286B1 (enExample)
CN (1) CN100423216C (enExample)
TW (1) TWI464840B (enExample)
WO (1) WO2005112105A1 (enExample)

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