JP2007531321A - ロール・ツー・ロールで製作された光学シートおよび封入された半導体回路デバイス - Google Patents

ロール・ツー・ロールで製作された光学シートおよび封入された半導体回路デバイス Download PDF

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JP2007531321A
JP2007531321A JP2007506288A JP2007506288A JP2007531321A JP 2007531321 A JP2007531321 A JP 2007531321A JP 2007506288 A JP2007506288 A JP 2007506288A JP 2007506288 A JP2007506288 A JP 2007506288A JP 2007531321 A JP2007531321 A JP 2007531321A
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Prior art keywords
substrate
photoactive
sheet
conductive
light
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JP2007506288A
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English (en)
Japanese (ja)
Inventor
ダニエルズ・ジョン・ジェー
ネルソン・グレゴリー・ブイ
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Articulated Technologies LLC
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Articulated Technologies LLC
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Priority claimed from US10/920,010 external-priority patent/US7217956B2/en
Priority claimed from US10/919,915 external-priority patent/US7294961B2/en
Priority claimed from US10/919,830 external-priority patent/US7052924B2/en
Priority claimed from US11/029,129 external-priority patent/US7259030B2/en
Priority claimed from US11/029,137 external-priority patent/US7427782B2/en
Application filed by Articulated Technologies LLC filed Critical Articulated Technologies LLC
Publication of JP2007531321A publication Critical patent/JP2007531321A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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    • B32B2307/00—Properties of the layers or laminate
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    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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  • Electroluminescent Light Sources (AREA)
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US10/920,010 US7217956B2 (en) 2004-03-29 2004-08-17 Light active sheet material
US10/919,915 US7294961B2 (en) 2004-03-29 2004-08-17 Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
US10/919,830 US7052924B2 (en) 2004-03-29 2004-08-17 Light active sheet and methods for making the same
US11/029,129 US7259030B2 (en) 2004-03-29 2005-01-04 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US11/029,137 US7427782B2 (en) 2004-03-29 2005-01-04 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
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