JP2007516355A5 - - Google Patents
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- JP2007516355A5 JP2007516355A5 JP2006539688A JP2006539688A JP2007516355A5 JP 2007516355 A5 JP2007516355 A5 JP 2007516355A5 JP 2006539688 A JP2006539688 A JP 2006539688A JP 2006539688 A JP2006539688 A JP 2006539688A JP 2007516355 A5 JP2007516355 A5 JP 2007516355A5
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- Prior art keywords
- precursor
- reaction chamber
- flow rate
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- Prior art date
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/716,006 | 2003-11-18 | ||
| US10/716,006 US7261919B2 (en) | 2003-11-18 | 2003-11-18 | Silicon carbide and other films and method of deposition |
| PCT/US2004/037064 WO2005049884A2 (en) | 2003-11-18 | 2004-11-05 | Method for depositing silicon carbide and ceramic films |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007516355A JP2007516355A (ja) | 2007-06-21 |
| JP2007516355A5 true JP2007516355A5 (enExample) | 2008-01-24 |
| JP4758354B2 JP4758354B2 (ja) | 2011-08-24 |
Family
ID=34574334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006539688A Expired - Fee Related JP4758354B2 (ja) | 2003-11-18 | 2004-11-05 | 基体上に炭化ケイ素層を形成する方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US7261919B2 (enExample) |
| EP (1) | EP1690287A2 (enExample) |
| JP (1) | JP4758354B2 (enExample) |
| KR (1) | KR20060123343A (enExample) |
| CN (1) | CN1906735A (enExample) |
| AU (1) | AU2004291847A1 (enExample) |
| CA (1) | CA2546081A1 (enExample) |
| IL (1) | IL175640A0 (enExample) |
| WO (1) | WO2005049884A2 (enExample) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7563633B2 (en) * | 2006-08-25 | 2009-07-21 | Robert Bosch Gmbh | Microelectromechanical systems encapsulation process |
| TWI475594B (zh) * | 2008-05-19 | 2015-03-01 | Entegris Inc | 靜電夾頭 |
| US20100083762A1 (en) * | 2008-10-02 | 2010-04-08 | Evoy Stephane | Fabrication and use of submicron wide suspended structures |
| US8861170B2 (en) | 2009-05-15 | 2014-10-14 | Entegris, Inc. | Electrostatic chuck with photo-patternable soft protrusion contact surface |
| SG10201402319QA (en) | 2009-05-15 | 2014-07-30 | Entegris Inc | Electrostatic chuck with polymer protrusions |
| DE102009040785A1 (de) * | 2009-09-09 | 2011-03-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Substrat aus einer Aluminium-Silizium-Legierung oder kristallinem Silizium, Metallspiegel, Verfahren zu dessen Herstellung sowie dessen Verwendung |
| US9257274B2 (en) | 2010-04-15 | 2016-02-09 | Lam Research Corporation | Gapfill of variable aspect ratio features with a composite PEALD and PECVD method |
| US9892917B2 (en) | 2010-04-15 | 2018-02-13 | Lam Research Corporation | Plasma assisted atomic layer deposition of multi-layer films for patterning applications |
| US8637411B2 (en) | 2010-04-15 | 2014-01-28 | Novellus Systems, Inc. | Plasma activated conformal dielectric film deposition |
| US20110256734A1 (en) | 2010-04-15 | 2011-10-20 | Hausmann Dennis M | Silicon nitride films and methods |
| US9611544B2 (en) | 2010-04-15 | 2017-04-04 | Novellus Systems, Inc. | Plasma activated conformal dielectric film deposition |
| US9390909B2 (en) | 2013-11-07 | 2016-07-12 | Novellus Systems, Inc. | Soft landing nanolaminates for advanced patterning |
| US9997357B2 (en) | 2010-04-15 | 2018-06-12 | Lam Research Corporation | Capped ALD films for doping fin-shaped channel regions of 3-D IC transistors |
| US8956983B2 (en) | 2010-04-15 | 2015-02-17 | Novellus Systems, Inc. | Conformal doping via plasma activated atomic layer deposition and conformal film deposition |
| US9373500B2 (en) | 2014-02-21 | 2016-06-21 | Lam Research Corporation | Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications |
| US9076646B2 (en) | 2010-04-15 | 2015-07-07 | Lam Research Corporation | Plasma enhanced atomic layer deposition with pulsed plasma exposure |
| WO2011149918A2 (en) | 2010-05-28 | 2011-12-01 | Entegris, Inc. | High surface resistivity electrostatic chuck |
| US9685320B2 (en) | 2010-09-23 | 2017-06-20 | Lam Research Corporation | Methods for depositing silicon oxide |
| US8524612B2 (en) | 2010-09-23 | 2013-09-03 | Novellus Systems, Inc. | Plasma-activated deposition of conformal films |
| JP5817127B2 (ja) * | 2011-01-21 | 2015-11-18 | 株式会社Sumco | 半導体基板及びその製造方法 |
| US8647993B2 (en) | 2011-04-11 | 2014-02-11 | Novellus Systems, Inc. | Methods for UV-assisted conformal film deposition |
| KR102026206B1 (ko) * | 2011-12-26 | 2019-09-27 | 엘지이노텍 주식회사 | 증착 장치 |
| KR101916289B1 (ko) * | 2011-12-29 | 2019-01-24 | 엘지이노텍 주식회사 | 탄화규소 증착 방법 |
| US8592328B2 (en) | 2012-01-20 | 2013-11-26 | Novellus Systems, Inc. | Method for depositing a chlorine-free conformal sin film |
| US8728955B2 (en) | 2012-02-14 | 2014-05-20 | Novellus Systems, Inc. | Method of plasma activated deposition of a conformal film on a substrate surface |
| WO2014027472A1 (ja) * | 2012-08-17 | 2014-02-20 | 株式会社Ihi | 耐熱複合材料の製造方法及び製造装置 |
| US9546420B1 (en) * | 2012-10-08 | 2017-01-17 | Sandia Corporation | Methods of depositing an alpha-silicon-carbide-containing film at low temperature |
| KR102207992B1 (ko) | 2012-10-23 | 2021-01-26 | 램 리써치 코포레이션 | 서브-포화된 원자층 증착 및 등각막 증착 |
| SG2013083241A (en) | 2012-11-08 | 2014-06-27 | Novellus Systems Inc | Conformal film deposition for gapfill |
| SG2013083654A (en) | 2012-11-08 | 2014-06-27 | Novellus Systems Inc | Methods for depositing films on sensitive substrates |
| KR101469713B1 (ko) * | 2012-12-06 | 2014-12-05 | 연세대학교 산학협력단 | 경사형 C/SiC 코팅막 형성 방법 및 장치 |
| JP6249815B2 (ja) * | 2014-02-17 | 2017-12-20 | 株式会社Ihi | 耐熱複合材料の製造方法及び製造装置 |
| US9214334B2 (en) | 2014-02-18 | 2015-12-15 | Lam Research Corporation | High growth rate process for conformal aluminum nitride |
| US9478438B2 (en) | 2014-08-20 | 2016-10-25 | Lam Research Corporation | Method and apparatus to deposit pure titanium thin film at low temperature using titanium tetraiodide precursor |
| US9478411B2 (en) | 2014-08-20 | 2016-10-25 | Lam Research Corporation | Method to tune TiOx stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiOx/Ti based MIS contact scheme for CMOS |
| US9564312B2 (en) | 2014-11-24 | 2017-02-07 | Lam Research Corporation | Selective inhibition in atomic layer deposition of silicon-containing films |
| CN104681413A (zh) * | 2015-02-25 | 2015-06-03 | 苏州工业园区纳米产业技术研究院有限公司 | 低应力多晶硅薄膜的制作方法 |
| JP2018511708A (ja) * | 2015-03-12 | 2018-04-26 | イビデン株式会社 | CVD−SiC材の製造方法 |
| US10566187B2 (en) | 2015-03-20 | 2020-02-18 | Lam Research Corporation | Ultrathin atomic layer deposition film accuracy thickness control |
| US9502238B2 (en) | 2015-04-03 | 2016-11-22 | Lam Research Corporation | Deposition of conformal films by atomic layer deposition and atomic layer etch |
| US10526701B2 (en) | 2015-07-09 | 2020-01-07 | Lam Research Corporation | Multi-cycle ALD process for film uniformity and thickness profile modulation |
| EP3345047A1 (en) | 2015-08-31 | 2018-07-11 | E Ink Corporation | Electronically erasing a drawing device |
| US9773643B1 (en) | 2016-06-30 | 2017-09-26 | Lam Research Corporation | Apparatus and method for deposition and etch in gap fill |
| US10062563B2 (en) | 2016-07-01 | 2018-08-28 | Lam Research Corporation | Selective atomic layer deposition with post-dose treatment |
| US10037884B2 (en) | 2016-08-31 | 2018-07-31 | Lam Research Corporation | Selective atomic layer deposition for gapfill using sacrificial underlayer |
| US10269559B2 (en) | 2017-09-13 | 2019-04-23 | Lam Research Corporation | Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer |
| JP7049883B2 (ja) * | 2018-03-28 | 2022-04-07 | 東京エレクトロン株式会社 | ボロン系膜の成膜方法および成膜装置 |
| CN110345031B (zh) * | 2018-04-03 | 2020-12-11 | 中国科学院理化技术研究所 | 一种舰艇发电系统 |
| CN114127890B (zh) | 2019-05-01 | 2025-10-14 | 朗姆研究公司 | 调整的原子层沉积 |
| KR20220006663A (ko) | 2019-06-07 | 2022-01-17 | 램 리써치 코포레이션 | 원자 층 증착 동안 막 특성들의 인-시츄 (in-situ) 제어 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4560589A (en) * | 1982-09-22 | 1985-12-24 | Shin-Etsu Chemical Co., Ltd. | Method for providing a coating layer of silicon carbide on substrate surface |
| JPS59128281A (ja) * | 1982-12-29 | 1984-07-24 | 信越化学工業株式会社 | 炭化けい素被覆物の製造方法 |
| US4971851A (en) * | 1984-02-13 | 1990-11-20 | Hewlett-Packard Company | Silicon carbide film for X-ray masks and vacuum windows |
| JP2534525B2 (ja) * | 1987-12-19 | 1996-09-18 | 富士通株式会社 | β−炭化シリコン層の製造方法 |
| JP2823276B2 (ja) * | 1989-03-18 | 1998-11-11 | 株式会社東芝 | X線マスクの製造方法および薄膜の内部応力制御装置 |
| DE69023478T2 (de) | 1990-03-05 | 1996-06-20 | Ibm | Verfahren zum Herstellen von Siliziumkarbidschichten mit vorherbestimmter Spannungskraft. |
| JP2556621B2 (ja) * | 1990-12-11 | 1996-11-20 | ホーヤ株式会社 | 炭化ケイ素膜の成膜方法 |
| JPH051380A (ja) * | 1991-06-24 | 1993-01-08 | Hoya Corp | 炭化ケイ素の成膜方法 |
| JPH05335216A (ja) * | 1992-05-29 | 1993-12-17 | Fujitsu Ltd | X線マスク及びその製造方法 |
| US5296258A (en) * | 1992-09-30 | 1994-03-22 | Northern Telecom Limited | Method of forming silicon carbide |
| US5415126A (en) * | 1993-08-16 | 1995-05-16 | Dow Corning Corporation | Method of forming crystalline silicon carbide coatings at low temperatures |
| JPH08507575A (ja) * | 1993-08-17 | 1996-08-13 | アクツィオネルノエ オブシュストボ “ルッスコエ オブシュストボ プリクラドノイ エレクトロニキ” | 炭化ケイ素層の製造方法とその物品 |
| US5480695A (en) | 1994-08-10 | 1996-01-02 | Tenhover; Michael A. | Ceramic substrates and magnetic data storage components prepared therefrom |
| US5800878A (en) * | 1996-10-24 | 1998-09-01 | Applied Materials, Inc. | Reducing hydrogen concentration in pecvd amorphous silicon carbide films |
| JP3607454B2 (ja) * | 1997-03-31 | 2005-01-05 | Hoya株式会社 | X線マスク用x線透過膜、x線マスクブランク及びx線マスク並びにこれらの製造方法並びに炭化珪素膜の研磨方法 |
| US6103590A (en) * | 1997-12-12 | 2000-08-15 | Texas Instruments Incorporated | SiC patterning of porous silicon |
| US6189766B1 (en) | 1998-07-10 | 2001-02-20 | Northrop Grumman Corporation | Zero stress bonding of silicon carbide to diamond |
| US7018947B2 (en) * | 2000-02-24 | 2006-03-28 | Shipley Company, L.L.C. | Low resistivity silicon carbide |
| US6764958B1 (en) * | 2000-07-28 | 2004-07-20 | Applied Materials Inc. | Method of depositing dielectric films |
-
2003
- 2003-11-18 US US10/716,006 patent/US7261919B2/en not_active Ceased
-
2004
- 2004-11-05 CN CNA2004800405977A patent/CN1906735A/zh active Pending
- 2004-11-05 KR KR1020067011987A patent/KR20060123343A/ko not_active Withdrawn
- 2004-11-05 CA CA002546081A patent/CA2546081A1/en not_active Abandoned
- 2004-11-05 EP EP04810481A patent/EP1690287A2/en not_active Withdrawn
- 2004-11-05 AU AU2004291847A patent/AU2004291847A1/en not_active Abandoned
- 2004-11-05 WO PCT/US2004/037064 patent/WO2005049884A2/en not_active Ceased
- 2004-11-05 JP JP2006539688A patent/JP4758354B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-16 IL IL175640A patent/IL175640A0/en unknown
-
2007
- 2007-04-18 US US11/736,964 patent/US8153280B2/en not_active Expired - Fee Related
-
2009
- 2009-08-26 US US12/548,363 patent/USRE42887E1/en not_active Expired - Fee Related
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