JP2007281406A5 - - Google Patents
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- Publication number
- JP2007281406A5 JP2007281406A5 JP2006165159A JP2006165159A JP2007281406A5 JP 2007281406 A5 JP2007281406 A5 JP 2007281406A5 JP 2006165159 A JP2006165159 A JP 2006165159A JP 2006165159 A JP2006165159 A JP 2006165159A JP 2007281406 A5 JP2007281406 A5 JP 2007281406A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- stretchable
- semiconductor element
- semiconductor structure
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 25
- 238000005538 encapsulation Methods 0.000 claims description 12
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 5
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 5
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical group C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 5
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 34
- 239000010410 layer Substances 0.000 claims 28
- 238000005452 bending Methods 0.000 claims 4
- 230000008878 coupling Effects 0.000 claims 4
- 238000010168 coupling process Methods 0.000 claims 4
- 238000005859 coupling reaction Methods 0.000 claims 4
- 239000010409 thin film Substances 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 230000005669 field effect Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000000737 periodic effect Effects 0.000 claims 2
- 238000010010 raising Methods 0.000 claims 2
- 230000002040 relaxant effect Effects 0.000 claims 2
- 238000005096 rolling process Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US79010406P | 2006-04-07 | 2006-04-07 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013169101A Division JP5851457B2 (ja) | 2006-04-07 | 2013-08-16 | 伸縮性半導体素子、伸縮性半導体素子を製造する方法、伸縮性電子回路及び伸縮性電子回路を製造する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007281406A JP2007281406A (ja) | 2007-10-25 |
| JP2007281406A5 true JP2007281406A5 (enExample) | 2012-12-06 |
Family
ID=38682516
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006165159A Pending JP2007281406A (ja) | 2006-04-07 | 2006-06-14 | ゴム基板上での高パフォーマンスエレクトロニクスのための伸縮性単結晶シリコン |
| JP2013169101A Active JP5851457B2 (ja) | 2006-04-07 | 2013-08-16 | 伸縮性半導体素子、伸縮性半導体素子を製造する方法、伸縮性電子回路及び伸縮性電子回路を製造する方法 |
| JP2015040251A Active JP6140207B2 (ja) | 2006-04-07 | 2015-03-02 | ゴム基板上での高パフォーマンスエレクトロニクスのための伸縮性単結晶シリコン |
| JP2016175541A Active JP6377689B2 (ja) | 2006-04-07 | 2016-09-08 | ゴム基板上での高パフォーマンスエレクトロニクスのための伸縮性単結晶シリコン |
| JP2016230221A Active JP6574157B2 (ja) | 2006-04-07 | 2016-11-28 | ゴム基板上での高パフォーマンスエレクトロニクスのための伸縮性単結晶シリコン |
| JP2018130156A Pending JP2019004151A (ja) | 2006-04-07 | 2018-07-09 | ゴム基板上での高パフォーマンスエレクトロニクスのための伸縮性単結晶シリコン |
Family Applications After (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013169101A Active JP5851457B2 (ja) | 2006-04-07 | 2013-08-16 | 伸縮性半導体素子、伸縮性半導体素子を製造する方法、伸縮性電子回路及び伸縮性電子回路を製造する方法 |
| JP2015040251A Active JP6140207B2 (ja) | 2006-04-07 | 2015-03-02 | ゴム基板上での高パフォーマンスエレクトロニクスのための伸縮性単結晶シリコン |
| JP2016175541A Active JP6377689B2 (ja) | 2006-04-07 | 2016-09-08 | ゴム基板上での高パフォーマンスエレクトロニクスのための伸縮性単結晶シリコン |
| JP2016230221A Active JP6574157B2 (ja) | 2006-04-07 | 2016-11-28 | ゴム基板上での高パフォーマンスエレクトロニクスのための伸縮性単結晶シリコン |
| JP2018130156A Pending JP2019004151A (ja) | 2006-04-07 | 2018-07-09 | ゴム基板上での高パフォーマンスエレクトロニクスのための伸縮性単結晶シリコン |
Country Status (4)
| Country | Link |
|---|---|
| JP (6) | JP2007281406A (enExample) |
| KR (5) | KR20070100617A (enExample) |
| MY (4) | MY151572A (enExample) |
| TW (7) | TWI427802B (enExample) |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101120433B (zh) | 2004-06-04 | 2010-12-08 | 伊利诺伊大学评议会 | 用于制造并组装可印刷半导体元件的方法 |
| TWI427802B (zh) * | 2005-06-02 | 2014-02-21 | 美國伊利諾大學理事會 | 可印刷半導體結構及製造和組合之相關方法 |
| CN101681695B (zh) * | 2006-09-06 | 2013-04-10 | 伊利诺伊大学评议会 | 在用于可拉伸电子元件的半导体互连和纳米膜中的受控弯曲结构 |
| CN105826345B (zh) * | 2007-01-17 | 2018-07-31 | 伊利诺伊大学评议会 | 通过基于印刷的组装制造的光学系统 |
| CN103872002B (zh) | 2008-03-05 | 2017-03-01 | 伊利诺伊大学评议会 | 可拉伸和可折叠的电子器件 |
| US8134163B2 (en) * | 2008-08-11 | 2012-03-13 | Taiwan Semiconductor Manfacturing Co., Ltd. | Light-emitting diodes on concave texture substrate |
| US8519379B2 (en) * | 2009-12-08 | 2013-08-27 | Zena Technologies, Inc. | Nanowire structured photodiode with a surrounding epitaxially grown P or N layer |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| JP2012515436A (ja) * | 2009-01-12 | 2012-07-05 | エムシー10 インコーポレイテッド | 非平面撮像アレイの方法及び応用 |
| KR101048356B1 (ko) * | 2009-06-08 | 2011-07-14 | 서울대학교산학협력단 | 잡아 늘일 수 있는 전자소자들의 금속 연결 구조 및 그 제조방법 |
| US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
| JP2011138934A (ja) | 2009-12-28 | 2011-07-14 | Sony Corp | 薄膜トランジスタ、表示装置および電子機器 |
| US8992807B2 (en) | 2010-01-14 | 2015-03-31 | Samsung Techwin Co., Ltd. | Method of manufacturing deformation-capable graphene sheet, deformation-capable graphene sheet, and device using the same |
| WO2012091498A1 (ko) * | 2010-12-31 | 2012-07-05 | 성균관대학교산학협력단 | 그래핀 전극을 포함하는 플렉시블/스트레처블 반도체 소자, 반도체층과 그래핀 전극 사이의 접촉저항 감소 방법, 및 그래핀 인터커넥터 |
| US9159635B2 (en) | 2011-05-27 | 2015-10-13 | Mc10, Inc. | Flexible electronic structure |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| TWI524825B (zh) | 2012-10-29 | 2016-03-01 | 財團法人工業技術研究院 | 碳材導電膜的轉印方法 |
| FR2997554B1 (fr) * | 2012-10-31 | 2016-04-08 | Soitec Silicon On Insulator | Procede de modification d'un etat de contrainte initial d'une couche active vers un etat de contrainte final |
| KR102229373B1 (ko) * | 2013-10-08 | 2021-03-17 | 한양대학교 산학협력단 | 유연소자의 제조방법, 그에 의하여 제조된 유연소자 및 접합소자 |
| KR101447238B1 (ko) * | 2014-06-20 | 2014-10-08 | 한국기계연구원 | 양자점 박막 형성 방법 |
| KR102255198B1 (ko) * | 2014-08-12 | 2021-05-25 | 삼성디스플레이 주식회사 | 스트레처블 기판 및 이를 구비한 유기 발광 표시 장치 |
| KR102416112B1 (ko) * | 2014-10-02 | 2022-07-04 | 삼성전자주식회사 | 스트레처블/폴더블 광전자소자와 그 제조방법 및 광전자소자를 포함하는 장치 |
| JP6369788B2 (ja) | 2014-11-27 | 2018-08-08 | パナソニックIpマネジメント株式会社 | エレクトロニクス用構造体 |
| WO2016084345A1 (en) | 2014-11-27 | 2016-06-02 | Panasonic Intellectual Property Management Co., Ltd. | Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure |
| KR101630817B1 (ko) | 2014-12-10 | 2016-06-15 | 한국과학기술연구원 | 굴곡진 금속 나노와이어 네트워크, 이를 포함하는 신축성 투명전극 및 이의 제조방법 |
| US10297575B2 (en) * | 2016-05-06 | 2019-05-21 | Amkor Technology, Inc. | Semiconductor device utilizing an adhesive to attach an upper package to a lower die |
| KR102250527B1 (ko) * | 2016-12-08 | 2021-05-10 | 고려대학교 산학협력단 | 가변 칼라 필터 필름 및 변형률 측정 장치 |
| WO2019074111A1 (ja) | 2017-10-12 | 2019-04-18 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| US11284507B2 (en) | 2017-10-12 | 2022-03-22 | Dai Nippon Printing Co., Ltd. | Wiring board and method for manufacturing wiring board |
| TWI754106B (zh) | 2017-10-12 | 2022-02-01 | 日商大日本印刷股份有限公司 | 配線基板及配線基板的製造方法 |
| US10959326B2 (en) | 2017-11-07 | 2021-03-23 | Dai Nippon Printing Co., Ltd. | Stretchable circuit substrate and article |
| KR102027115B1 (ko) * | 2017-11-28 | 2019-10-01 | 고려대학교 세종산학협력단 | 유기광전소자 및 이의 제조방법 |
| KR102100550B1 (ko) * | 2018-01-29 | 2020-04-13 | 충북대학교 산학협력단 | 구리 전극 제작 방법 및 구리 전극 제작 시스템 |
| KR102119009B1 (ko) * | 2018-03-08 | 2020-06-04 | 포항공과대학교 산학협력단 | 신축성 기판의 제조방법 및 그를 포함하는 신축성 전자기기의 제조방법 |
| KR102119023B1 (ko) * | 2018-04-23 | 2020-06-04 | 포항공과대학교 산학협력단 | 2종 이상의 올리고머를 이용한 신축성 기판의 제조방법 및 그를 포함하는 신축성 전자기기의 제조방법 |
| KR102554461B1 (ko) * | 2018-07-26 | 2023-07-10 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 |
| KR102172349B1 (ko) * | 2018-09-14 | 2020-10-30 | 포항공과대학교 산학협력단 | 신축성 기판의 제조방법 및 그를 포함하는 신축성 전자기기의 제조방법 |
| EP3876682A4 (en) | 2018-10-31 | 2022-12-07 | Dai Nippon Printing Co., Ltd. | CIRCUIT BOARD AND PROCESS OF MAKING THE CIRCUIT BOARD |
| KR102779787B1 (ko) | 2018-10-31 | 2025-03-12 | 다이니폰 인사츠 가부시키가이샤 | 배선 기판 및 배선 기판의 제조 방법 |
| EP3883352A4 (en) | 2018-11-16 | 2022-08-31 | Dai Nippon Printing Co., Ltd. | CIRCUIT SUBSTRATE AND METHOD OF MAKING THE CIRCUIT SUBSTRATE |
| US11395404B2 (en) | 2018-11-16 | 2022-07-19 | Dai Nippon Printing Co., Ltd. | Wiring board and method for manufacturing the wiring board |
| JP7249512B2 (ja) * | 2018-11-30 | 2023-03-31 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| JP6826786B1 (ja) * | 2019-03-20 | 2021-02-10 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| CN111554638B (zh) * | 2020-04-16 | 2023-09-08 | 上海交通大学 | 用于可拉伸电子装置的基底及其制备方法 |
| US11699677B2 (en) * | 2020-06-30 | 2023-07-11 | Openlight Photonics, Inc. | Die-to-wafer bonding utilizing micro-transfer printing |
| CN111952322B (zh) * | 2020-08-14 | 2022-06-03 | 电子科技大学 | 一种具有周期可调屈曲结构的柔性半导体薄膜及制备方法 |
| CN114258185A (zh) * | 2020-09-24 | 2022-03-29 | 北京梦之墨科技有限公司 | 一种电子器件及其制备方法 |
| CN112366250B (zh) * | 2020-11-17 | 2022-11-15 | 佛山市国星半导体技术有限公司 | 一种GaN基紫外探测器及其制作方法 |
| KR102412729B1 (ko) | 2021-01-18 | 2022-06-23 | 연세대학교 산학협력단 | 신축성 디스플레이 장치 |
| WO2025187670A1 (ja) * | 2024-03-04 | 2025-09-12 | 国立大学法人大阪大学 | 薄膜デバイスおよび薄膜デバイスの製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6482673B2 (en) * | 1996-10-17 | 2002-11-19 | Seiko Epson Corporation | Semiconductor device, method of making the same, circuit board, flexible substrate, and method of making substrate |
| US6787052B1 (en) * | 2000-06-19 | 2004-09-07 | Vladimir Vaganov | Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers |
| US6566273B2 (en) * | 2001-06-27 | 2003-05-20 | Infineon Technologies Ag | Etch selectivity inversion for etching along crystallographic directions in silicon |
| EP1506568B1 (en) * | 2002-04-29 | 2016-06-01 | Samsung Electronics Co., Ltd. | Direct-connect signaling system |
| JP2004071874A (ja) * | 2002-08-07 | 2004-03-04 | Sharp Corp | 半導体装置製造方法および半導体装置 |
| US7491892B2 (en) * | 2003-03-28 | 2009-02-17 | Princeton University | Stretchable and elastic interconnects |
| US7704684B2 (en) * | 2003-12-01 | 2010-04-27 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating three-dimensional nanoscale structures |
| JP5110766B2 (ja) * | 2003-12-15 | 2012-12-26 | 株式会社半導体エネルギー研究所 | 薄膜集積回路装置の作製方法及び非接触型薄膜集積回路装置の作製方法 |
| KR101207442B1 (ko) * | 2003-12-15 | 2012-12-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막 집적회로장치의 제조방법, 비접촉형 박막 집적회로장치 및 그 제조 방법, 비접촉형 박막 집적회로 장치를 가지는 아이디 태그 및 동전 |
| JP4841807B2 (ja) * | 2004-02-27 | 2011-12-21 | 株式会社半導体エネルギー研究所 | 薄膜集積回路及び薄型半導体装置 |
| KR101185613B1 (ko) * | 2004-04-27 | 2012-09-24 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 소프트 리소그래피용 복합 패터닝 장치 |
| CN101120433B (zh) * | 2004-06-04 | 2010-12-08 | 伊利诺伊大学评议会 | 用于制造并组装可印刷半导体元件的方法 |
| TWI427802B (zh) * | 2005-06-02 | 2014-02-21 | 美國伊利諾大學理事會 | 可印刷半導體結構及製造和組合之相關方法 |
-
2006
- 2006-06-01 TW TW095119520A patent/TWI427802B/zh active
- 2006-06-01 MY MYPI20062537 patent/MY151572A/en unknown
- 2006-06-01 MY MYPI20113695 patent/MY152238A/en unknown
- 2006-06-01 TW TW102142517A patent/TWI533459B/zh active
- 2006-06-08 MY MYPI20062672A patent/MY143492A/en unknown
- 2006-06-08 MY MYPI20094997A patent/MY163588A/en unknown
- 2006-06-14 TW TW095121212A patent/TWI336491B/zh active
- 2006-06-14 TW TW099127004A patent/TWI489523B/zh active
- 2006-06-14 KR KR1020060053675A patent/KR20070100617A/ko not_active Ceased
- 2006-06-14 JP JP2006165159A patent/JP2007281406A/ja active Pending
- 2006-06-14 TW TW105135576A patent/TW201717261A/zh unknown
- 2006-06-14 TW TW100139527A patent/TWI466488B/zh active
- 2006-06-14 TW TW104103340A patent/TWI570776B/zh active
-
2013
- 2013-08-16 JP JP2013169101A patent/JP5851457B2/ja active Active
- 2013-10-31 KR KR1020130131753A patent/KR20130133733A/ko not_active Ceased
-
2014
- 2014-07-29 KR KR1020140096828A patent/KR20140107158A/ko not_active Ceased
-
2015
- 2015-03-02 JP JP2015040251A patent/JP6140207B2/ja active Active
- 2015-03-24 KR KR20150040631A patent/KR20150044865A/ko not_active Ceased
-
2016
- 2016-09-08 JP JP2016175541A patent/JP6377689B2/ja active Active
- 2016-11-28 JP JP2016230221A patent/JP6574157B2/ja active Active
-
2017
- 2017-06-26 KR KR1020170080342A patent/KR20170077097A/ko not_active Ceased
-
2018
- 2018-07-09 JP JP2018130156A patent/JP2019004151A/ja active Pending
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