MY152238A - Printable semiconductor structures and related methods of making and assembling - Google Patents

Printable semiconductor structures and related methods of making and assembling

Info

Publication number
MY152238A
MY152238A MYPI20113695A MY152238A MY 152238 A MY152238 A MY 152238A MY PI20113695 A MYPI20113695 A MY PI20113695A MY 152238 A MY152238 A MY 152238A
Authority
MY
Malaysia
Prior art keywords
making
present
printable semiconductor
compositions
substrates
Prior art date
Application number
Inventor
Ralph G Nuzzo
John A Rogers
Etienne Menard
Keon Jae Lee
Dahl-Young Khang
Yugang Sun
Matthew Meitl
Zhengtao Zhu
Heung Cho Ko
Original Assignee
Univ Illinois
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/145,574 external-priority patent/US7622367B1/en
Application filed by Univ Illinois filed Critical Univ Illinois
Publication of MY152238A publication Critical patent/MY152238A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7781—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with inverted single heterostructure, i.e. with active layer formed on top of wide bandgap layer, e.g. IHEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78603—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02587—Structure
    • H01L21/0259—Microstructure
    • H01L21/02598—Microstructure monocrystalline
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
    • H01L29/1606—Graphene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

THE PRESENT INVENTION PROVIDES A HIGH YIELD PATHWAY FOR THE FABRICATION, TRANSFER AND ASSEMBLY OF HIGH QUALITY PRINTABLE SEMICONDUCTOR ELEMENTS (300) HAVING SELECTED PHYSICAL DIMENSIONS, SHAPES, COMPOSITIONS AND SPATIAL ORIENTATIONS. THE COMPOSITIONS AND METHODS OF THE PRESENT INVENTION PROVIDE HIGH PRECISION REGISTERED TRANSFER AND INTEGRATION OF ARRAYS OF MICROSIZED AND/OR NANOSIZED SEMICONDUCTOR STRUCTURES (290) ONTO SUBSTRATES, INCLUDING LARGE AREA SUBSTRATES AND/OR FLEXIBLE SUBSTRATES. IN ADDITION, THE PRESENT INVENTION PROVIDES METHODS OF MAKING PRINTABLE SEMICONDUCTOR ELEMENTS (300) FROM LOW COST BULK MATERIALS, SUCH AS BULK SILICON WAFERS (320), AND SMART MATERIALS PROCESSING STRATEGIES THAT ENABLE A VERSATILE AND COMMERCIALLY ATTRACTIVE PRINTING-BASED FABRICATION PLATFORM FOR MAKING A BROAD RANGE OF FUNCTIONAL SEMICONDUCTOR DEVICES.
MYPI20113695 2005-06-02 2006-06-01 Printable semiconductor structures and related methods of making and assembling MY152238A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/145,574 US7622367B1 (en) 2004-06-04 2005-06-02 Methods and devices for fabricating and assembling printable semiconductor elements
US11/145,542 US7557367B2 (en) 2004-06-04 2005-06-02 Stretchable semiconductor elements and stretchable electrical circuits
PCT/US2005/019354 WO2005122285A2 (en) 2004-06-04 2005-06-02 Methods and devices for fabricating and assembling printable semiconductor elements
US79010406P 2006-04-07 2006-04-07

Publications (1)

Publication Number Publication Date
MY152238A true MY152238A (en) 2014-09-15

Family

ID=38682516

Family Applications (4)

Application Number Title Priority Date Filing Date
MYPI20062537 MY151572A (en) 2005-06-02 2006-06-01 Printable semiconductor structures and related methods of making and assembling
MYPI20113695 MY152238A (en) 2005-06-02 2006-06-01 Printable semiconductor structures and related methods of making and assembling
MYPI20094997A MY163588A (en) 2006-04-07 2006-06-08 A stretchable form of single crystal silicon for high performance electronics on rubber substrates
MYPI20062672A MY143492A (en) 2006-04-07 2006-06-08 A stretchable form of single crystal silicon for high performance electronics on rubber substrates

Family Applications Before (1)

Application Number Title Priority Date Filing Date
MYPI20062537 MY151572A (en) 2005-06-02 2006-06-01 Printable semiconductor structures and related methods of making and assembling

Family Applications After (2)

Application Number Title Priority Date Filing Date
MYPI20094997A MY163588A (en) 2006-04-07 2006-06-08 A stretchable form of single crystal silicon for high performance electronics on rubber substrates
MYPI20062672A MY143492A (en) 2006-04-07 2006-06-08 A stretchable form of single crystal silicon for high performance electronics on rubber substrates

Country Status (4)

Country Link
JP (6) JP2007281406A (en)
KR (5) KR20070100617A (en)
MY (4) MY151572A (en)
TW (7) TWI533459B (en)

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KR102255198B1 (en) * 2014-08-12 2021-05-25 삼성디스플레이 주식회사 Stretchable substrate and organic light emitting display comprising the same
KR102416112B1 (en) * 2014-10-02 2022-07-04 삼성전자주식회사 Stretchable/foldable optoelectronic device, method of manufacturing the same and apparatus including the optoelectronic device
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Also Published As

Publication number Publication date
TW201428984A (en) 2014-07-16
TW201519287A (en) 2015-05-16
TWI489523B (en) 2015-06-21
JP6574157B2 (en) 2019-09-11
MY143492A (en) 2011-05-31
JP2019004151A (en) 2019-01-10
JP2017103459A (en) 2017-06-08
JP6140207B2 (en) 2017-05-31
JP2014017495A (en) 2014-01-30
TWI427802B (en) 2014-02-21
JP2017038064A (en) 2017-02-16
JP2007281406A (en) 2007-10-25
TW201216641A (en) 2012-04-16
KR20150044865A (en) 2015-04-27
TWI336491B (en) 2011-01-21
TW200739681A (en) 2007-10-16
JP2015133510A (en) 2015-07-23
KR20170077097A (en) 2017-07-05
TW200721517A (en) 2007-06-01
TW201042951A (en) 2010-12-01
MY163588A (en) 2017-09-29
KR20140107158A (en) 2014-09-04
TWI466488B (en) 2014-12-21
TWI570776B (en) 2017-02-11
JP6377689B2 (en) 2018-08-22
TW201717261A (en) 2017-05-16
JP5851457B2 (en) 2016-02-03
KR20130133733A (en) 2013-12-09
TWI533459B (en) 2016-05-11
KR20070100617A (en) 2007-10-11
MY151572A (en) 2014-06-13

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