JP2007154134A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2007154134A5 JP2007154134A5 JP2005355189A JP2005355189A JP2007154134A5 JP 2007154134 A5 JP2007154134 A5 JP 2007154134A5 JP 2005355189 A JP2005355189 A JP 2005355189A JP 2005355189 A JP2005355189 A JP 2005355189A JP 2007154134 A5 JP2007154134 A5 JP 2007154134A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- group
- thermosetting resin
- polyol
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 28
- 229920005862 polyol Polymers 0.000 claims 27
- 229920001187 thermosetting polymer Polymers 0.000 claims 26
- -1 polyol compound Chemical class 0.000 claims 21
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 15
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 12
- 150000001875 compounds Chemical class 0.000 claims 10
- 239000002994 raw material Substances 0.000 claims 9
- 150000003077 polyols Chemical class 0.000 claims 6
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 239000002904 solvent Substances 0.000 claims 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims 3
- 238000006243 chemical reaction Methods 0.000 claims 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 claims 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 claims 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 claims 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 claims 2
- 229920001228 polyisocyanate Polymers 0.000 claims 2
- 239000005056 polyisocyanate Substances 0.000 claims 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims 2
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 claims 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 claims 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 claims 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 claims 1
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 claims 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 claims 1
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 claims 1
- JVYDLYGCSIHCMR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butanoic acid Chemical compound CCC(CO)(CO)C(O)=O JVYDLYGCSIHCMR-UHFFFAOYSA-N 0.000 claims 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000005058 Isophorone diisocyanate Substances 0.000 claims 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims 1
- 239000005062 Polybutadiene Substances 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 229940106691 bisphenol a Drugs 0.000 claims 1
- 238000009835 boiling Methods 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 claims 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 claims 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 claims 1
- 229940116333 ethyl lactate Drugs 0.000 claims 1
- 239000010419 fine particle Substances 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 230000000977 initiatory effect Effects 0.000 claims 1
- 229940117955 isoamyl acetate Drugs 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims 1
- DKJCSMHIPYRALV-UHFFFAOYSA-N methoxymethyl propanoate Chemical compound CCC(=O)OCOC DKJCSMHIPYRALV-UHFFFAOYSA-N 0.000 claims 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 238000005191 phase separation Methods 0.000 claims 1
- 229920002857 polybutadiene Polymers 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920005906 polyester polyol Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000008096 xylene Substances 0.000 claims 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355189A JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
| EP06834642A EP1957552B1 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
| US12/095,990 US8575280B2 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
| AT06834642T ATE529458T1 (de) | 2005-12-08 | 2006-12-07 | Wärmehärtende harzzusammensetzung, lösung einer wärmehärtenden harzzusammensetzung, filmbildendes material und härteprodukt daraus |
| TW095145687A TWI398485B (zh) | 2005-12-08 | 2006-12-07 | 熱硬化性樹脂組成物，熱硬化性樹脂組成物溶液及皮膜形成材料及此等之硬化物 |
| PCT/JP2006/324887 WO2007066816A1 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
| KR1020087016533A KR100971852B1 (ko) | 2005-12-08 | 2006-12-07 | 열경화성 수지 조성물, 열경화성 수지 조성물 용액, 피막형성 재료 및 이들의 경화물 |
| CN2006800424515A CN101309944B (zh) | 2005-12-08 | 2006-12-07 | 热固性树脂组合物、热固性树脂组合物溶液、成膜材料及它们的固化产物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355189A JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007154134A JP2007154134A (ja) | 2007-06-21 |
| JP2007154134A5 true JP2007154134A5 (enExample) | 2008-12-18 |
| JP5265854B2 JP5265854B2 (ja) | 2013-08-14 |
Family
ID=37888303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005355189A Expired - Fee Related JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8575280B2 (enExample) |
| EP (1) | EP1957552B1 (enExample) |
| JP (1) | JP5265854B2 (enExample) |
| KR (1) | KR100971852B1 (enExample) |
| CN (1) | CN101309944B (enExample) |
| TW (1) | TWI398485B (enExample) |
| WO (1) | WO2007066816A1 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006033439A1 (en) * | 2004-09-21 | 2006-03-30 | Showa Denko K.K. | Heat-curable urethane resin composition |
| KR100960951B1 (ko) | 2008-03-20 | 2010-06-03 | 동아화학 주식회사 | 무독성 디메틸술폭사이드 용매를 사용한 한 장갑 코팅용일액형 폴리우레탄 반응조성물과 그 제조방법 및 이를이용한 코팅장갑 |
| EP2270102A1 (en) * | 2008-03-21 | 2011-01-05 | Showa Denko K.K. | Resin composition and cured film thereof |
| TW200946551A (en) * | 2008-03-31 | 2009-11-16 | Toyo Kohan Co Ltd | Polyurethane resins containing cycloaliphatic and/or aromatic component and phase difference films using them |
| JP5176073B2 (ja) * | 2008-05-21 | 2013-04-03 | 日立化成株式会社 | 熱硬化性樹脂組成物 |
| EP2390277B1 (en) * | 2009-01-20 | 2014-04-16 | Showa Denko K.K. | (poly)carbonate polyol and carboxyl group-containing polyurethane using the (poly)carbonate polyol as starting material |
| KR101276985B1 (ko) * | 2009-03-19 | 2013-06-24 | 쇼와 덴코 가부시키가이샤 | 방전 갭 충전용 조성물 및 정전 방전 보호체 |
| MX338773B (es) | 2009-04-09 | 2016-05-02 | Valspar Sourcing Inc | Polimero que tiene funcionalidad cicloalifatica insaturada y composiciones de recubrimiento formadas de este. |
| WO2010118349A1 (en) | 2009-04-09 | 2010-10-14 | Valspar Sourcing, Inc. | Polyester coating composition |
| US8747979B2 (en) | 2009-07-17 | 2014-06-10 | Valspar Sourcing, Inc. | Coating compositions and articles coated therewith |
| US9011999B2 (en) * | 2009-09-18 | 2015-04-21 | Valspar Sourcing, Inc. | Coating composition including an unsaturated polymer |
| US20120238701A1 (en) * | 2009-11-10 | 2012-09-20 | Takeshi Yamada | Aqueous polyurethane resin dispersion, process for preparing the same and use thereof |
| KR101420202B1 (ko) * | 2009-12-14 | 2014-07-17 | 쇼와 덴코 가부시키가이샤 | 중합성 화합물 및 그 화합물을 포함하는 경화성 조성물 |
| CN103282830B (zh) | 2010-12-14 | 2016-06-22 | 株式会社钟化 | 新颖的感光性树脂组合物及其利用 |
| KR101907714B1 (ko) * | 2011-06-17 | 2018-10-12 | 다이요 잉키 세이조 가부시키가이샤 | 난연성 경화성 수지 조성물, 이를 이용한 드라이 필름 및 인쇄 배선판 |
| JP5996874B2 (ja) * | 2011-06-30 | 2016-09-21 | 株式会社タムラ製作所 | 熱硬化性樹脂組成物 |
| WO2013111481A1 (ja) * | 2012-01-25 | 2013-08-01 | 株式会社カネカ | 新規な顔料含有絶縁膜用樹脂組成物及びその利用 |
| CN103045151B (zh) * | 2013-01-16 | 2015-02-11 | 广州奥翼电子科技有限公司 | 电子纸用胶黏剂、制备方法及其应用 |
| TWI487732B (zh) * | 2013-01-21 | 2015-06-11 | Daxin Materials Corp | 光硬化型矽氧烷聚胺酯（甲基）丙烯酸酯組成物、黏著劑及硬化物 |
| KR101420408B1 (ko) * | 2013-04-16 | 2014-07-16 | 고삼석 | 수성 세라믹 수지의 제조방법 및 수성 세라믹 수지를 이용한 외장용 수계도료의 제조방법 및 이를 이용한 도장 시공방법 |
| CN103642383B (zh) * | 2013-12-04 | 2016-04-20 | 江南大学 | 一种本征型光固化抗静电树脂的制备方法 |
| RU2696496C2 (ru) | 2015-02-03 | 2019-08-02 | Хенкель Аг Унд Ко. Кгаа | Полиуретановые клеящие составы для склеивания пленок с низкой поверхностной энергией |
| HUE044702T2 (hu) | 2015-03-12 | 2019-11-28 | Huntsman Adv Mat Licensing Switzerland Gmbh | Poliol összetevõ pur-habok elõállításához |
| JP6012821B1 (ja) * | 2015-07-22 | 2016-10-25 | サンユレック株式会社 | ポリウレタン樹脂組成物、封止材及び電気電子部品 |
| CN107849218B (zh) * | 2015-07-30 | 2021-03-05 | Sika技术股份公司 | 具有不受温度影响的机械性能和粘合性的疏水和高弹性的双组份聚氨酯组合物 |
| US10889729B2 (en) | 2015-12-25 | 2021-01-12 | Nippon Polytech Corp. | Curable composition, cured object, overcoat film, coated flexible wiring board, and process for producing same |
| US11254836B2 (en) | 2016-11-11 | 2022-02-22 | Illinois Tool Works Inc. | One-step headlight restoration kit and formulation |
| KR101952361B1 (ko) * | 2017-07-04 | 2019-02-26 | 에스케이씨 주식회사 | 폴리우레탄 조성물 및 이로부터 얻어진 고내산성 다층 연마패드 |
| JP7272069B2 (ja) * | 2019-04-04 | 2023-05-12 | 東洋インキＳｃホールディングス株式会社 | 有機溶剤系印刷インキ、印刷物および積層体 |
| CN114761491A (zh) * | 2019-11-27 | 2022-07-15 | 东亚合成株式会社 | 树脂组合物、带有树脂组合物层的层叠体、层叠体、柔性覆铜层叠板、柔性扁平电缆及电磁波屏蔽膜 |
| CN111647132B (zh) * | 2020-06-09 | 2022-01-07 | 上海华峰超纤科技股份有限公司 | 低弹性聚氨酯树脂的制备方法及应用 |
| JP7845207B2 (ja) * | 2023-01-30 | 2026-04-14 | 信越化学工業株式会社 | 塗料組成物、その製造方法および被覆物品 |
| CN121406057B (zh) * | 2025-12-30 | 2026-03-13 | 福建泉州洛江振丰模配制造有限公司 | 一种热塑复合模料及其冷推成型工艺 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4083815A (en) * | 1976-03-11 | 1978-04-11 | The Upjohn Company | Polyurethane coating compositions and process of preparation |
| US4263188A (en) * | 1979-05-23 | 1981-04-21 | Verbatim Corporation | Aqueous coating composition and method |
| US4576726A (en) * | 1983-01-25 | 1986-03-18 | Toyo Tire & Rubber Company Limited | Magnetic coating composition |
| JPS59174660A (ja) * | 1983-03-24 | 1984-10-03 | Toyo Tire & Rubber Co Ltd | 磁性塗料 |
| JPS60166316A (ja) * | 1984-02-09 | 1985-08-29 | Sanyo Chem Ind Ltd | バインダ−および磁気記録材料 |
| JPH02278511A (ja) * | 1989-04-19 | 1990-11-14 | Hitachi Maxell Ltd | 磁気記録媒体 |
| DE4137512A1 (de) * | 1991-11-15 | 1993-05-19 | Henkel Kgaa | Heisssiegelbeschichtung auf dispersionsbasis |
| JP3047098B2 (ja) * | 1995-12-28 | 2000-05-29 | 三洋化成工業株式会社 | ポリウレタン樹脂水性分散体およびコーティング剤 |
| AT410213B (de) * | 1998-08-04 | 2003-03-25 | Solutia Austria Gmbh | Wasserverdünnbare bindemittel für ''soft-feel''-lacke |
| AU2001284499A1 (en) * | 2000-09-11 | 2002-03-26 | Showa Denko K K | Photosensitive composition, cured article thereof, and printed circuit board using the same |
| US20030008079A1 (en) * | 2001-05-24 | 2003-01-09 | Salter Keith L. | Waterborne coating compostion and process of producing a film having improved adhesion on a substrate |
| US20040002561A1 (en) * | 2002-06-28 | 2004-01-01 | Nippon Shokubai Co., Ltd. | Resin composition |
| JP2004137370A (ja) | 2002-10-17 | 2004-05-13 | Hitachi Chem Co Ltd | ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料 |
| US7744962B2 (en) * | 2003-04-24 | 2010-06-29 | Kansai Paint Co., Ltd. | Thermosetting liquid coating composition for aluminum wheel and method of coating aluminum wheel |
| WO2005014682A1 (en) * | 2003-08-07 | 2005-02-17 | Huntsman Advanced Materials (Switzerland) Gmbh | Photocrosslinkable polyurethanes |
| WO2006033439A1 (en) | 2004-09-21 | 2006-03-30 | Showa Denko K.K. | Heat-curable urethane resin composition |
| KR20080026105A (ko) * | 2005-05-16 | 2008-03-24 | 쇼와 덴코 가부시키가이샤 | 카르복실기 함유 폴리우레탄, 열경화성 수지 조성물 및그의 용도 |
| ATE492579T1 (de) * | 2005-07-04 | 2011-01-15 | Showa Denko Kk | Polyurethan mit einer carboxylgruppe und seine verwendungen |
| JP5399603B2 (ja) * | 2005-10-07 | 2014-01-29 | 昭和電工株式会社 | シリコーンパウダーを含む熱硬化性樹脂組成物 |
| JP5224640B2 (ja) * | 2005-10-07 | 2013-07-03 | 昭和電工株式会社 | カルボキシル基含有ポリウレタンおよび熱硬化性ポリウレタン樹脂組成物 |
| KR100984592B1 (ko) * | 2006-03-16 | 2010-09-30 | 쇼와 덴코 가부시키가이샤 | 열경화성 수지 조성물, 연성 회로 기판용 오버코팅제 및 표면 보호막 |
| US20090136732A1 (en) * | 2006-04-03 | 2009-05-28 | Showa Denko K.K. | Thermoset resin composition |
| EP2390277B1 (en) * | 2009-01-20 | 2014-04-16 | Showa Denko K.K. | (poly)carbonate polyol and carboxyl group-containing polyurethane using the (poly)carbonate polyol as starting material |
| JP5579081B2 (ja) * | 2009-01-20 | 2014-08-27 | 昭和電工株式会社 | カルボキシル基含有ポリウレタン |
-
2005
- 2005-12-08 JP JP2005355189A patent/JP5265854B2/ja not_active Expired - Fee Related
-
2006
- 2006-12-07 TW TW095145687A patent/TWI398485B/zh not_active IP Right Cessation
- 2006-12-07 CN CN2006800424515A patent/CN101309944B/zh not_active Expired - Fee Related
- 2006-12-07 KR KR1020087016533A patent/KR100971852B1/ko not_active Expired - Fee Related
- 2006-12-07 EP EP06834642A patent/EP1957552B1/en not_active Not-in-force
- 2006-12-07 WO PCT/JP2006/324887 patent/WO2007066816A1/en not_active Ceased
- 2006-12-07 US US12/095,990 patent/US8575280B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2007154134A5 (enExample) | ||
| US20090076307A1 (en) | Aromatic diamine compound and aromatic dinitro compound | |
| JP6849269B2 (ja) | 変性ポリカルボジイミド化合物、硬化剤及び熱硬化性樹脂組成物 | |
| WO2016163285A1 (ja) | 変性ポリカルボジイミド化合物、硬化剤及び熱硬化性樹脂組成物 | |
| JP2009544782A5 (enExample) | ||
| CN101687980B (zh) | 热固性树脂组合物 | |
| WO2009078365A1 (ja) | ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物 | |
| TW201630957A (zh) | 含羥基之聚胺基甲酸酯樹脂、以其為原料之聚胺基甲酸酯樹脂、及胺基甲酸酯（甲基）丙烯酸酯樹脂、此等樹脂之製造方法、以及保護膜用組成物、及ｕｖ硬化性樹脂組成物 | |
| JP2008208340A5 (enExample) | ||
| JP2020502319A (ja) | 要求に応じて分解する熱硬化性樹脂のためのシリル含有アルコールおよびアミン | |
| JP2008019427A5 (enExample) | ||
| JP2006348278A5 (enExample) | ||
| JP2007138080A (ja) | 変性ポリカルボジイミド組成物及び変性ポリカルボジイミド | |
| JP7066664B2 (ja) | ポリヒドロキシウレタン樹脂及びポリヒドロキシウレタン樹脂の製造方法 | |
| CN111094374A (zh) | 聚碳化二亚胺化合物及热固化性树脂组合物 | |
| CN107868204A (zh) | 阴离子型水性聚氨酯树脂、其制备方法及其应用 | |
| CN102093696A (zh) | 一种可室温固化的含酮基水性聚氨酯树脂及其制备方法 | |
| JP2009242646A (ja) | 印刷インキ用バインダーおよび印刷インキ組成物 | |
| US20190092966A1 (en) | Photoimageable coverlay composition for flexible printed circuit boards | |
| JP3981775B2 (ja) | 印刷インキ用バインダー | |
| EP1650238A2 (en) | Polycarbodiimide compositions for optical use | |
| JP2002226755A (ja) | 印刷インキ組成物 | |
| KR100738126B1 (ko) | 고내열 자외선 경화 수성폴리우레탄 수지의 제조 방법 | |
| CN113527118B (zh) | 一种常温水性环氧固化剂及其制备方法和应用 | |
| JP4951962B2 (ja) | アミノフェノール化合物 |