JP2007154134A5 - - Google Patents
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- Publication number
- JP2007154134A5 JP2007154134A5 JP2005355189A JP2005355189A JP2007154134A5 JP 2007154134 A5 JP2007154134 A5 JP 2007154134A5 JP 2005355189 A JP2005355189 A JP 2005355189A JP 2005355189 A JP2005355189 A JP 2005355189A JP 2007154134 A5 JP2007154134 A5 JP 2007154134A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- group
- thermosetting resin
- polyol
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 28
- 229920005862 polyol Polymers 0.000 claims 27
- 229920001187 thermosetting polymer Polymers 0.000 claims 26
- -1 polyol compound Chemical class 0.000 claims 21
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 15
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 12
- 150000001875 compounds Chemical class 0.000 claims 10
- 239000002994 raw material Substances 0.000 claims 9
- 150000003077 polyols Chemical class 0.000 claims 6
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 239000002904 solvent Substances 0.000 claims 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims 3
- 238000006243 chemical reaction Methods 0.000 claims 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 claims 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 claims 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 claims 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 claims 2
- 229920001228 polyisocyanate Polymers 0.000 claims 2
- 239000005056 polyisocyanate Substances 0.000 claims 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims 2
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 claims 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 claims 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 claims 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 claims 1
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 claims 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 claims 1
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 claims 1
- JVYDLYGCSIHCMR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butanoic acid Chemical compound CCC(CO)(CO)C(O)=O JVYDLYGCSIHCMR-UHFFFAOYSA-N 0.000 claims 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000005058 Isophorone diisocyanate Substances 0.000 claims 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims 1
- 239000005062 Polybutadiene Substances 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 229940106691 bisphenol a Drugs 0.000 claims 1
- 238000009835 boiling Methods 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 claims 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 claims 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 claims 1
- 229940116333 ethyl lactate Drugs 0.000 claims 1
- 239000010419 fine particle Substances 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 230000000977 initiatory effect Effects 0.000 claims 1
- 229940117955 isoamyl acetate Drugs 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims 1
- DKJCSMHIPYRALV-UHFFFAOYSA-N methoxymethyl propanoate Chemical compound CCC(=O)OCOC DKJCSMHIPYRALV-UHFFFAOYSA-N 0.000 claims 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 238000005191 phase separation Methods 0.000 claims 1
- 229920002857 polybutadiene Polymers 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920005906 polyester polyol Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000008096 xylene Substances 0.000 claims 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355189A JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
| EP06834642A EP1957552B1 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
| AT06834642T ATE529458T1 (de) | 2005-12-08 | 2006-12-07 | Wärmehärtende harzzusammensetzung, lösung einer wärmehärtenden harzzusammensetzung, filmbildendes material und härteprodukt daraus |
| CN2006800424515A CN101309944B (zh) | 2005-12-08 | 2006-12-07 | 热固性树脂组合物、热固性树脂组合物溶液、成膜材料及它们的固化产物 |
| US12/095,990 US8575280B2 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
| KR1020087016533A KR100971852B1 (ko) | 2005-12-08 | 2006-12-07 | 열경화성 수지 조성물, 열경화성 수지 조성물 용액, 피막형성 재료 및 이들의 경화물 |
| PCT/JP2006/324887 WO2007066816A1 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
| TW095145687A TWI398485B (zh) | 2005-12-08 | 2006-12-07 | 熱硬化性樹脂組成物，熱硬化性樹脂組成物溶液及皮膜形成材料及此等之硬化物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355189A JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007154134A JP2007154134A (ja) | 2007-06-21 |
| JP2007154134A5 true JP2007154134A5 (enExample) | 2008-12-18 |
| JP5265854B2 JP5265854B2 (ja) | 2013-08-14 |
Family
ID=37888303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005355189A Expired - Fee Related JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8575280B2 (enExample) |
| EP (1) | EP1957552B1 (enExample) |
| JP (1) | JP5265854B2 (enExample) |
| KR (1) | KR100971852B1 (enExample) |
| CN (1) | CN101309944B (enExample) |
| TW (1) | TWI398485B (enExample) |
| WO (1) | WO2007066816A1 (enExample) |
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| US20110007490A1 (en) * | 2008-03-21 | 2011-01-13 | Showa Denko K.K. | Resin composition and cured film thereof |
| TW200946551A (en) * | 2008-03-31 | 2009-11-16 | Toyo Kohan Co Ltd | Polyurethane resins containing cycloaliphatic and/or aromatic component and phase difference films using them |
| JP5176073B2 (ja) * | 2008-05-21 | 2013-04-03 | 日立化成株式会社 | 熱硬化性樹脂組成物 |
| WO2010084872A1 (ja) * | 2009-01-20 | 2010-07-29 | 昭和電工株式会社 | （ポリ）カーボネートポリオールおよび該（ポリ）カーボネートポリオールを原料とするカルボキシル基含有ポリウレタン |
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| BRPI1014962B1 (pt) | 2009-04-09 | 2020-03-03 | Swimc Llc | Composição de revestimento, método, e, artigo revestido |
| KR101854476B1 (ko) | 2009-07-17 | 2018-06-14 | 발스파 소싱 인코포레이티드 | 코팅 조성물 및 그것으로 코팅된 용품 |
| EP3498751A1 (en) | 2009-09-18 | 2019-06-19 | Swimc Llc | Coating composition including an unsaturated polymer |
| KR20120088837A (ko) * | 2009-11-10 | 2012-08-08 | 우베 고산 가부시키가이샤 | 수성 폴리우레탄 수지 분산체, 그 제조 방법 및 그 사용 |
| WO2011074503A1 (ja) * | 2009-12-14 | 2011-06-23 | 昭和電工株式会社 | 重合性化合物および該化合物を含む硬化性組成物 |
| CN103282830B (zh) | 2010-12-14 | 2016-06-22 | 株式会社钟化 | 新颖的感光性树脂组合物及其利用 |
| CN103619960B (zh) * | 2011-06-17 | 2016-11-16 | 太阳油墨制造株式会社 | 阻燃性固化性树脂组合物、使用其的干膜及印刷电路板 |
| JP5996874B2 (ja) * | 2011-06-30 | 2016-09-21 | 株式会社タムラ製作所 | 熱硬化性樹脂組成物 |
| US9957390B2 (en) * | 2012-01-25 | 2018-05-01 | Kaneka Corporation | Resin composition for pigment-containing insulating film, and use thereof |
| CN103045151B (zh) * | 2013-01-16 | 2015-02-11 | 广州奥翼电子科技有限公司 | 电子纸用胶黏剂、制备方法及其应用 |
| TWI487732B (zh) * | 2013-01-21 | 2015-06-11 | Daxin Materials Corp | 光硬化型矽氧烷聚胺酯（甲基）丙烯酸酯組成物、黏著劑及硬化物 |
| KR101420408B1 (ko) * | 2013-04-16 | 2014-07-16 | 고삼석 | 수성 세라믹 수지의 제조방법 및 수성 세라믹 수지를 이용한 외장용 수계도료의 제조방법 및 이를 이용한 도장 시공방법 |
| CN103642383B (zh) * | 2013-12-04 | 2016-04-20 | 江南大学 | 一种本征型光固化抗静电树脂的制备方法 |
| EP3253811B1 (en) | 2015-02-03 | 2023-08-02 | Henkel AG & Co. KGaA | Polyurethane adhesives for bonding low surface energy films |
| KR102561225B1 (ko) | 2015-03-12 | 2023-07-28 | 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 | Pur 발포체의 제조를 위한 폴리올 성분 |
| JP6012821B1 (ja) * | 2015-07-22 | 2016-10-25 | サンユレック株式会社 | ポリウレタン樹脂組成物、封止材及び電気電子部品 |
| EP3328913B1 (de) * | 2015-07-30 | 2021-12-01 | Sika Technology AG | Hydrophobe und hochelastische zweikomponentige polyurethanzusammensetzung mit von der temperatur unabhängigen mechanischen eigenschaften und klebeeigenschaften |
| KR102099678B1 (ko) * | 2015-12-25 | 2020-04-10 | 쇼와 덴코 가부시키가이샤 | 경화성 조성물, 경화물, 오버코트막, 피복 플렉시블 배선판 및 그 제조 방법 |
| US11254836B2 (en) | 2016-11-11 | 2022-02-22 | Illinois Tool Works Inc. | One-step headlight restoration kit and formulation |
| KR101952361B1 (ko) * | 2017-07-04 | 2019-02-26 | 에스케이씨 주식회사 | 폴리우레탄 조성물 및 이로부터 얻어진 고내산성 다층 연마패드 |
| JP7272069B2 (ja) * | 2019-04-04 | 2023-05-12 | 東洋インキＳｃホールディングス株式会社 | 有機溶剤系印刷インキ、印刷物および積層体 |
| WO2021106960A1 (ja) * | 2019-11-27 | 2021-06-03 | 東亞合成株式会社 | 樹脂組成物、樹脂組成物層付き積層体、積層体、フレキシブル銅張積層板、フレキシブルフラットケーブル、及び、電磁波シールドフィルム |
| CN111647132B (zh) * | 2020-06-09 | 2022-01-07 | 上海华峰超纤科技股份有限公司 | 低弹性聚氨酯树脂的制备方法及应用 |
| JP7845207B2 (ja) * | 2023-01-30 | 2026-04-14 | 信越化学工業株式会社 | 塗料組成物、その製造方法および被覆物品 |
| CN121406057B (zh) * | 2025-12-30 | 2026-03-13 | 福建泉州洛江振丰模配制造有限公司 | 一种热塑复合模料及其冷推成型工艺 |
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| ATE421545T1 (de) | 2003-08-07 | 2009-02-15 | Huntsman Adv Mat Switzerland | Photovernetzbare polyurethane |
| WO2006033439A1 (en) * | 2004-09-21 | 2006-03-30 | Showa Denko K.K. | Heat-curable urethane resin composition |
| TW200710115A (en) * | 2005-05-16 | 2007-03-16 | Showa Denko Kk | Carboxy group-containing polyurethane, thermosetting resin composition and their use |
| EP2216354A3 (en) * | 2005-07-04 | 2013-04-24 | Showa Denko K.K. | Carboxyl group-containing polyurethane and uses thereof |
| JP5224640B2 (ja) * | 2005-10-07 | 2013-07-03 | 昭和電工株式会社 | カルボキシル基含有ポリウレタンおよび熱硬化性ポリウレタン樹脂組成物 |
| JP5399603B2 (ja) * | 2005-10-07 | 2014-01-29 | 昭和電工株式会社 | シリコーンパウダーを含む熱硬化性樹脂組成物 |
| WO2007105713A1 (ja) * | 2006-03-16 | 2007-09-20 | Showa Denko K.K. | 熱硬化性樹脂組成物、フレキシブル回路基板用オーバーコート剤および表面保護膜 |
| US20090136732A1 (en) * | 2006-04-03 | 2009-05-28 | Showa Denko K.K. | Thermoset resin composition |
| JP5579081B2 (ja) * | 2009-01-20 | 2014-08-27 | 昭和電工株式会社 | カルボキシル基含有ポリウレタン |
| WO2010084872A1 (ja) * | 2009-01-20 | 2010-07-29 | 昭和電工株式会社 | （ポリ）カーボネートポリオールおよび該（ポリ）カーボネートポリオールを原料とするカルボキシル基含有ポリウレタン |
-
2005
- 2005-12-08 JP JP2005355189A patent/JP5265854B2/ja not_active Expired - Fee Related
-
2006
- 2006-12-07 KR KR1020087016533A patent/KR100971852B1/ko not_active Expired - Fee Related
- 2006-12-07 EP EP06834642A patent/EP1957552B1/en not_active Not-in-force
- 2006-12-07 US US12/095,990 patent/US8575280B2/en not_active Expired - Fee Related
- 2006-12-07 CN CN2006800424515A patent/CN101309944B/zh not_active Expired - Fee Related
- 2006-12-07 TW TW095145687A patent/TWI398485B/zh not_active IP Right Cessation
- 2006-12-07 WO PCT/JP2006/324887 patent/WO2007066816A1/en not_active Ceased
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