JP5265854B2 - 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 - Google Patents
熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 Download PDFInfo
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- JP5265854B2 JP5265854B2 JP2005355189A JP2005355189A JP5265854B2 JP 5265854 B2 JP5265854 B2 JP 5265854B2 JP 2005355189 A JP2005355189 A JP 2005355189A JP 2005355189 A JP2005355189 A JP 2005355189A JP 5265854 B2 JP5265854 B2 JP 5265854B2
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- polyol
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- thermosetting resin
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- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 101
- 239000011342 resin composition Substances 0.000 title claims abstract description 93
- 239000000463 material Substances 0.000 title claims description 30
- 229920005992 thermoplastic resin Polymers 0.000 title 1
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- -1 polyol compounds Chemical class 0.000 claims abstract description 129
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 110
- 150000001875 compounds Chemical class 0.000 claims abstract description 92
- 150000003077 polyols Chemical class 0.000 claims abstract description 47
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 41
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 32
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- 239000002994 raw material Substances 0.000 claims abstract description 28
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 21
- 239000004417 polycarbonate Substances 0.000 claims abstract description 21
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 16
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 15
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 11
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 11
- 229920000570 polyether Polymers 0.000 claims abstract description 11
- 229920005906 polyester polyol Polymers 0.000 claims abstract description 7
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 67
- 238000006243 chemical reaction Methods 0.000 claims description 62
- 239000002904 solvent Substances 0.000 claims description 39
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- 239000002253 acid Substances 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 21
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- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims description 20
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 14
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 13
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 12
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- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 claims description 11
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 11
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- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 claims description 8
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- 239000010419 fine particle Substances 0.000 claims description 7
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- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 claims description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- 238000009835 boiling Methods 0.000 claims description 6
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 claims description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 6
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 claims description 5
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 claims description 5
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 5
- 125000003700 epoxy group Chemical group 0.000 claims description 5
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 5
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 5
- 239000008096 xylene Substances 0.000 claims description 5
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 claims description 4
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 claims description 4
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 claims description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 4
- 229940106691 bisphenol a Drugs 0.000 claims description 4
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims description 4
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 claims description 4
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 claims description 4
- 229940116333 ethyl lactate Drugs 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- 230000000977 initiatory effect Effects 0.000 claims description 4
- 229940117955 isoamyl acetate Drugs 0.000 claims description 4
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 claims description 4
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 claims description 3
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 claims description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 3
- 238000005191 phase separation Methods 0.000 claims description 2
- DKJCSMHIPYRALV-UHFFFAOYSA-N methoxymethyl propanoate Chemical compound CCC(=O)OCOC DKJCSMHIPYRALV-UHFFFAOYSA-N 0.000 claims 1
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- C08G18/69—Polymers of conjugated dienes
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- C08G18/758—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing two or more cycloaliphatic rings
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
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- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
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- C08L75/04—Polyurethanes
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355189A JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
| EP06834642A EP1957552B1 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
| US12/095,990 US8575280B2 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
| AT06834642T ATE529458T1 (de) | 2005-12-08 | 2006-12-07 | Wärmehärtende harzzusammensetzung, lösung einer wärmehärtenden harzzusammensetzung, filmbildendes material und härteprodukt daraus |
| TW095145687A TWI398485B (zh) | 2005-12-08 | 2006-12-07 | 熱硬化性樹脂組成物，熱硬化性樹脂組成物溶液及皮膜形成材料及此等之硬化物 |
| PCT/JP2006/324887 WO2007066816A1 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
| KR1020087016533A KR100971852B1 (ko) | 2005-12-08 | 2006-12-07 | 열경화성 수지 조성물, 열경화성 수지 조성물 용액, 피막형성 재료 및 이들의 경화물 |
| CN2006800424515A CN101309944B (zh) | 2005-12-08 | 2006-12-07 | 热固性树脂组合物、热固性树脂组合物溶液、成膜材料及它们的固化产物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355189A JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
Publications (3)
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|---|---|
| JP2007154134A JP2007154134A (ja) | 2007-06-21 |
| JP2007154134A5 JP2007154134A5 (enExample) | 2008-12-18 |
| JP5265854B2 true JP5265854B2 (ja) | 2013-08-14 |
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| JP2005355189A Expired - Fee Related JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
Country Status (7)
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| US (1) | US8575280B2 (enExample) |
| EP (1) | EP1957552B1 (enExample) |
| JP (1) | JP5265854B2 (enExample) |
| KR (1) | KR100971852B1 (enExample) |
| CN (1) | CN101309944B (enExample) |
| TW (1) | TWI398485B (enExample) |
| WO (1) | WO2007066816A1 (enExample) |
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| EP2270102A1 (en) * | 2008-03-21 | 2011-01-05 | Showa Denko K.K. | Resin composition and cured film thereof |
| TW200946551A (en) * | 2008-03-31 | 2009-11-16 | Toyo Kohan Co Ltd | Polyurethane resins containing cycloaliphatic and/or aromatic component and phase difference films using them |
| JP5176073B2 (ja) * | 2008-05-21 | 2013-04-03 | 日立化成株式会社 | 熱硬化性樹脂組成物 |
| EP2390277B1 (en) * | 2009-01-20 | 2014-04-16 | Showa Denko K.K. | (poly)carbonate polyol and carboxyl group-containing polyurethane using the (poly)carbonate polyol as starting material |
| KR101276985B1 (ko) * | 2009-03-19 | 2013-06-24 | 쇼와 덴코 가부시키가이샤 | 방전 갭 충전용 조성물 및 정전 방전 보호체 |
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| US8747979B2 (en) | 2009-07-17 | 2014-06-10 | Valspar Sourcing, Inc. | Coating compositions and articles coated therewith |
| US9011999B2 (en) * | 2009-09-18 | 2015-04-21 | Valspar Sourcing, Inc. | Coating composition including an unsaturated polymer |
| US20120238701A1 (en) * | 2009-11-10 | 2012-09-20 | Takeshi Yamada | Aqueous polyurethane resin dispersion, process for preparing the same and use thereof |
| KR101420202B1 (ko) * | 2009-12-14 | 2014-07-17 | 쇼와 덴코 가부시키가이샤 | 중합성 화합물 및 그 화합물을 포함하는 경화성 조성물 |
| CN103282830B (zh) | 2010-12-14 | 2016-06-22 | 株式会社钟化 | 新颖的感光性树脂组合物及其利用 |
| KR101907714B1 (ko) * | 2011-06-17 | 2018-10-12 | 다이요 잉키 세이조 가부시키가이샤 | 난연성 경화성 수지 조성물, 이를 이용한 드라이 필름 및 인쇄 배선판 |
| JP5996874B2 (ja) * | 2011-06-30 | 2016-09-21 | 株式会社タムラ製作所 | 熱硬化性樹脂組成物 |
| WO2013111481A1 (ja) * | 2012-01-25 | 2013-08-01 | 株式会社カネカ | 新規な顔料含有絶縁膜用樹脂組成物及びその利用 |
| CN103045151B (zh) * | 2013-01-16 | 2015-02-11 | 广州奥翼电子科技有限公司 | 电子纸用胶黏剂、制备方法及其应用 |
| TWI487732B (zh) * | 2013-01-21 | 2015-06-11 | Daxin Materials Corp | 光硬化型矽氧烷聚胺酯（甲基）丙烯酸酯組成物、黏著劑及硬化物 |
| KR101420408B1 (ko) * | 2013-04-16 | 2014-07-16 | 고삼석 | 수성 세라믹 수지의 제조방법 및 수성 세라믹 수지를 이용한 외장용 수계도료의 제조방법 및 이를 이용한 도장 시공방법 |
| CN103642383B (zh) * | 2013-12-04 | 2016-04-20 | 江南大学 | 一种本征型光固化抗静电树脂的制备方法 |
| RU2696496C2 (ru) | 2015-02-03 | 2019-08-02 | Хенкель Аг Унд Ко. Кгаа | Полиуретановые клеящие составы для склеивания пленок с низкой поверхностной энергией |
| HUE044702T2 (hu) | 2015-03-12 | 2019-11-28 | Huntsman Adv Mat Licensing Switzerland Gmbh | Poliol összetevõ pur-habok elõállításához |
| JP6012821B1 (ja) * | 2015-07-22 | 2016-10-25 | サンユレック株式会社 | ポリウレタン樹脂組成物、封止材及び電気電子部品 |
| CN107849218B (zh) * | 2015-07-30 | 2021-03-05 | Sika技术股份公司 | 具有不受温度影响的机械性能和粘合性的疏水和高弹性的双组份聚氨酯组合物 |
| US10889729B2 (en) | 2015-12-25 | 2021-01-12 | Nippon Polytech Corp. | Curable composition, cured object, overcoat film, coated flexible wiring board, and process for producing same |
| US11254836B2 (en) | 2016-11-11 | 2022-02-22 | Illinois Tool Works Inc. | One-step headlight restoration kit and formulation |
| KR101952361B1 (ko) * | 2017-07-04 | 2019-02-26 | 에스케이씨 주식회사 | 폴리우레탄 조성물 및 이로부터 얻어진 고내산성 다층 연마패드 |
| JP7272069B2 (ja) * | 2019-04-04 | 2023-05-12 | 東洋インキＳｃホールディングス株式会社 | 有機溶剤系印刷インキ、印刷物および積層体 |
| CN114761491A (zh) * | 2019-11-27 | 2022-07-15 | 东亚合成株式会社 | 树脂组合物、带有树脂组合物层的层叠体、层叠体、柔性覆铜层叠板、柔性扁平电缆及电磁波屏蔽膜 |
| CN111647132B (zh) * | 2020-06-09 | 2022-01-07 | 上海华峰超纤科技股份有限公司 | 低弹性聚氨酯树脂的制备方法及应用 |
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| CN121406057B (zh) * | 2025-12-30 | 2026-03-13 | 福建泉州洛江振丰模配制造有限公司 | 一种热塑复合模料及其冷推成型工艺 |
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| JP5579081B2 (ja) * | 2009-01-20 | 2014-08-27 | 昭和電工株式会社 | カルボキシル基含有ポリウレタン |
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2005
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2006
- 2006-12-07 TW TW095145687A patent/TWI398485B/zh not_active IP Right Cessation
- 2006-12-07 CN CN2006800424515A patent/CN101309944B/zh not_active Expired - Fee Related
- 2006-12-07 KR KR1020087016533A patent/KR100971852B1/ko not_active Expired - Fee Related
- 2006-12-07 EP EP06834642A patent/EP1957552B1/en not_active Not-in-force
- 2006-12-07 WO PCT/JP2006/324887 patent/WO2007066816A1/en not_active Ceased
- 2006-12-07 US US12/095,990 patent/US8575280B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI398485B (zh) | 2013-06-11 |
| US8575280B2 (en) | 2013-11-05 |
| EP1957552B1 (en) | 2011-10-19 |
| KR20080080620A (ko) | 2008-09-04 |
| CN101309944B (zh) | 2012-02-15 |
| WO2007066816A1 (en) | 2007-06-14 |
| TW200740921A (en) | 2007-11-01 |
| US20090171015A1 (en) | 2009-07-02 |
| KR100971852B1 (ko) | 2010-07-23 |
| EP1957552A1 (en) | 2008-08-20 |
| JP2007154134A (ja) | 2007-06-21 |
| CN101309944A (zh) | 2008-11-19 |
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