JP2007154134A5 - - Google Patents
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- Publication number
- JP2007154134A5 JP2007154134A5 JP2005355189A JP2005355189A JP2007154134A5 JP 2007154134 A5 JP2007154134 A5 JP 2007154134A5 JP 2005355189 A JP2005355189 A JP 2005355189A JP 2005355189 A JP2005355189 A JP 2005355189A JP 2007154134 A5 JP2007154134 A5 JP 2007154134A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- group
- thermosetting resin
- polyol
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 28
- 229920005862 polyol Polymers 0.000 claims 27
- 229920001187 thermosetting polymer Polymers 0.000 claims 26
- -1 polyol compound Chemical class 0.000 claims 21
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 15
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 12
- 150000001875 compounds Chemical class 0.000 claims 10
- 239000002994 raw material Substances 0.000 claims 9
- 150000003077 polyols Chemical class 0.000 claims 6
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 239000002904 solvent Substances 0.000 claims 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims 3
- 238000006243 chemical reaction Methods 0.000 claims 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 claims 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 claims 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 claims 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 claims 2
- 229920001228 polyisocyanate Polymers 0.000 claims 2
- 239000005056 polyisocyanate Substances 0.000 claims 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims 2
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 claims 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 claims 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 claims 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 claims 1
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 claims 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 claims 1
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 claims 1
- JVYDLYGCSIHCMR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butanoic acid Chemical compound CCC(CO)(CO)C(O)=O JVYDLYGCSIHCMR-UHFFFAOYSA-N 0.000 claims 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000005058 Isophorone diisocyanate Substances 0.000 claims 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims 1
- 239000005062 Polybutadiene Substances 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 229940106691 bisphenol a Drugs 0.000 claims 1
- 238000009835 boiling Methods 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 claims 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 claims 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 claims 1
- 229940116333 ethyl lactate Drugs 0.000 claims 1
- 239000010419 fine particle Substances 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 230000000977 initiatory effect Effects 0.000 claims 1
- 229940117955 isoamyl acetate Drugs 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims 1
- DKJCSMHIPYRALV-UHFFFAOYSA-N methoxymethyl propanoate Chemical compound CCC(=O)OCOC DKJCSMHIPYRALV-UHFFFAOYSA-N 0.000 claims 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 238000005191 phase separation Methods 0.000 claims 1
- 229920002857 polybutadiene Polymers 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920005906 polyester polyol Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000008096 xylene Substances 0.000 claims 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355189A JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
| KR1020087016533A KR100971852B1 (ko) | 2005-12-08 | 2006-12-07 | 열경화성 수지 조성물, 열경화성 수지 조성물 용액, 피막형성 재료 및 이들의 경화물 |
| EP06834642A EP1957552B1 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
| TW095145687A TWI398485B (zh) | 2005-12-08 | 2006-12-07 | 熱硬化性樹脂組成物，熱硬化性樹脂組成物溶液及皮膜形成材料及此等之硬化物 |
| CN2006800424515A CN101309944B (zh) | 2005-12-08 | 2006-12-07 | 热固性树脂组合物、热固性树脂组合物溶液、成膜材料及它们的固化产物 |
| AT06834642T ATE529458T1 (de) | 2005-12-08 | 2006-12-07 | Wärmehärtende harzzusammensetzung, lösung einer wärmehärtenden harzzusammensetzung, filmbildendes material und härteprodukt daraus |
| US12/095,990 US8575280B2 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
| PCT/JP2006/324887 WO2007066816A1 (en) | 2005-12-08 | 2006-12-07 | Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355189A JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007154134A JP2007154134A (ja) | 2007-06-21 |
| JP2007154134A5 true JP2007154134A5 (cg-RX-API-DMAC10.html) | 2008-12-18 |
| JP5265854B2 JP5265854B2 (ja) | 2013-08-14 |
Family
ID=37888303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005355189A Expired - Fee Related JP5265854B2 (ja) | 2005-12-08 | 2005-12-08 | 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8575280B2 (cg-RX-API-DMAC10.html) |
| EP (1) | EP1957552B1 (cg-RX-API-DMAC10.html) |
| JP (1) | JP5265854B2 (cg-RX-API-DMAC10.html) |
| KR (1) | KR100971852B1 (cg-RX-API-DMAC10.html) |
| CN (1) | CN101309944B (cg-RX-API-DMAC10.html) |
| TW (1) | TWI398485B (cg-RX-API-DMAC10.html) |
| WO (1) | WO2007066816A1 (cg-RX-API-DMAC10.html) |
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| US8524838B2 (en) * | 2004-09-21 | 2013-09-03 | Showa Denko K.K. | Heat-curable urethane resin composition |
| KR100960951B1 (ko) | 2008-03-20 | 2010-06-03 | 동아화학 주식회사 | 무독성 디메틸술폭사이드 용매를 사용한 한 장갑 코팅용일액형 폴리우레탄 반응조성물과 그 제조방법 및 이를이용한 코팅장갑 |
| EP2270102A1 (en) * | 2008-03-21 | 2011-01-05 | Showa Denko K.K. | Resin composition and cured film thereof |
| TW200946551A (en) * | 2008-03-31 | 2009-11-16 | Toyo Kohan Co Ltd | Polyurethane resins containing cycloaliphatic and/or aromatic component and phase difference films using them |
| JP5176073B2 (ja) * | 2008-05-21 | 2013-04-03 | 日立化成株式会社 | 熱硬化性樹脂組成物 |
| US8674017B2 (en) | 2009-01-20 | 2014-03-18 | Showa Denko K.K. | (Poly)carbonate polyol and carboxyl group-containing polyurethane obtained from the (poly)carbonate polyol |
| CN102356526B (zh) * | 2009-03-19 | 2013-08-28 | 昭和电工株式会社 | 放电间隙填充用组合物和静电放电保护体 |
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| EP3156228B1 (en) | 2009-04-09 | 2023-11-29 | Swimc Llc | Polymer having unsaturated cycloaliphatic functionality and coating compositions formed therefrom |
| EP3208289A1 (en) | 2009-07-17 | 2017-08-23 | Valspar Sourcing, Inc. | Coating composition and articles coated therewith |
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| KR101842054B1 (ko) | 2010-12-14 | 2018-03-27 | 가부시키가이샤 가네카 | 신규한 감광성 수지 조성물 및 그 이용 |
| CN103619960B (zh) * | 2011-06-17 | 2016-11-16 | 太阳油墨制造株式会社 | 阻燃性固化性树脂组合物、使用其的干膜及印刷电路板 |
| JP5996874B2 (ja) * | 2011-06-30 | 2016-09-21 | 株式会社タムラ製作所 | 熱硬化性樹脂組成物 |
| US9957390B2 (en) * | 2012-01-25 | 2018-05-01 | Kaneka Corporation | Resin composition for pigment-containing insulating film, and use thereof |
| CN103045151B (zh) * | 2013-01-16 | 2015-02-11 | 广州奥翼电子科技有限公司 | 电子纸用胶黏剂、制备方法及其应用 |
| TWI487732B (zh) * | 2013-01-21 | 2015-06-11 | Daxin Materials Corp | 光硬化型矽氧烷聚胺酯（甲基）丙烯酸酯組成物、黏著劑及硬化物 |
| KR101420408B1 (ko) * | 2013-04-16 | 2014-07-16 | 고삼석 | 수성 세라믹 수지의 제조방법 및 수성 세라믹 수지를 이용한 외장용 수계도료의 제조방법 및 이를 이용한 도장 시공방법 |
| CN103642383B (zh) * | 2013-12-04 | 2016-04-20 | 江南大学 | 一种本征型光固化抗静电树脂的制备方法 |
| KR102525717B1 (ko) | 2015-02-03 | 2023-04-25 | 헨켈 아게 운트 코. 카게아아 | 저 표면 에너지 필름 결합용 폴리우레탄 접착제 |
| ES2731633T3 (es) | 2015-03-12 | 2019-11-18 | Huntsman Adv Mat Licensing Switzerland Gmbh | Componente de poliol para la producción de espumas de poliuretano |
| JP6012821B1 (ja) * | 2015-07-22 | 2016-10-25 | サンユレック株式会社 | ポリウレタン樹脂組成物、封止材及び電気電子部品 |
| CN107849218B (zh) * | 2015-07-30 | 2021-03-05 | Sika技术股份公司 | 具有不受温度影响的机械性能和粘合性的疏水和高弹性的双组份聚氨酯组合物 |
| KR102099678B1 (ko) * | 2015-12-25 | 2020-04-10 | 쇼와 덴코 가부시키가이샤 | 경화성 조성물, 경화물, 오버코트막, 피복 플렉시블 배선판 및 그 제조 방법 |
| US11254836B2 (en) | 2016-11-11 | 2022-02-22 | Illinois Tool Works Inc. | One-step headlight restoration kit and formulation |
| KR101952361B1 (ko) * | 2017-07-04 | 2019-02-26 | 에스케이씨 주식회사 | 폴리우레탄 조성물 및 이로부터 얻어진 고내산성 다층 연마패드 |
| JP7272069B2 (ja) * | 2019-04-04 | 2023-05-12 | 東洋インキＳｃホールディングス株式会社 | 有機溶剤系印刷インキ、印刷物および積層体 |
| KR102880229B1 (ko) * | 2019-11-27 | 2025-11-03 | 도아고세이가부시키가이샤 | 수지 조성물, 수지 조성물층 부착 적층체, 적층체, 플렉시블 동박적층판, 플렉시블 플랫 케이블 및 전자파 차폐 필름 |
| CN111647132B (zh) * | 2020-06-09 | 2022-01-07 | 上海华峰超纤科技股份有限公司 | 低弹性聚氨酯树脂的制备方法及应用 |
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| EP1651695B1 (en) * | 2003-08-07 | 2009-01-21 | Huntsman Advanced Materials (Switzerland) GmbH | Photocrosslinkable polyurethanes |
| US8524838B2 (en) * | 2004-09-21 | 2013-09-03 | Showa Denko K.K. | Heat-curable urethane resin composition |
| KR20080026105A (ko) | 2005-05-16 | 2008-03-24 | 쇼와 덴코 가부시키가이샤 | 카르복실기 함유 폴리우레탄, 열경화성 수지 조성물 및그의 용도 |
| EP1899396B1 (en) * | 2005-07-04 | 2010-12-22 | Showa Denko K.K. | Carboxyl group-containing polyurethane and uses thereof |
| JP5399603B2 (ja) * | 2005-10-07 | 2014-01-29 | 昭和電工株式会社 | シリコーンパウダーを含む熱硬化性樹脂組成物 |
| JP5224640B2 (ja) * | 2005-10-07 | 2013-07-03 | 昭和電工株式会社 | カルボキシル基含有ポリウレタンおよび熱硬化性ポリウレタン樹脂組成物 |
| WO2007105713A1 (ja) * | 2006-03-16 | 2007-09-20 | Showa Denko K.K. | 熱硬化性樹脂組成物、フレキシブル回路基板用オーバーコート剤および表面保護膜 |
| TW200808851A (en) * | 2006-04-03 | 2008-02-16 | Showa Denko Kk | Thermoset resin composition |
| US8674017B2 (en) * | 2009-01-20 | 2014-03-18 | Showa Denko K.K. | (Poly)carbonate polyol and carboxyl group-containing polyurethane obtained from the (poly)carbonate polyol |
| EP2390276B1 (en) * | 2009-01-20 | 2018-06-13 | Showa Denko K.K. | Carboxyl group-containing polyurethane |
-
2005
- 2005-12-08 JP JP2005355189A patent/JP5265854B2/ja not_active Expired - Fee Related
-
2006
- 2006-12-07 TW TW095145687A patent/TWI398485B/zh not_active IP Right Cessation
- 2006-12-07 CN CN2006800424515A patent/CN101309944B/zh not_active Expired - Fee Related
- 2006-12-07 KR KR1020087016533A patent/KR100971852B1/ko not_active Expired - Fee Related
- 2006-12-07 WO PCT/JP2006/324887 patent/WO2007066816A1/en not_active Ceased
- 2006-12-07 EP EP06834642A patent/EP1957552B1/en not_active Not-in-force
- 2006-12-07 US US12/095,990 patent/US8575280B2/en not_active Expired - Fee Related
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