JP2007107047A5 - 発光装置の作製方法 - Google Patents

発光装置の作製方法 Download PDF

Info

Publication number
JP2007107047A5
JP2007107047A5 JP2005298879A JP2005298879A JP2007107047A5 JP 2007107047 A5 JP2007107047 A5 JP 2007107047A5 JP 2005298879 A JP2005298879 A JP 2005298879A JP 2005298879 A JP2005298879 A JP 2005298879A JP 2007107047 A5 JP2007107047 A5 JP 2007107047A5
Authority
JP
Japan
Prior art keywords
emitting device
solvent
manufacturing light
manufacturing
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005298879A
Other languages
English (en)
Other versions
JP2007107047A (ja
JP4974504B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005298879A priority Critical patent/JP4974504B2/ja
Priority claimed from JP2005298879A external-priority patent/JP4974504B2/ja
Priority to US11/545,344 priority patent/US8932682B2/en
Priority to KR1020060099774A priority patent/KR101329016B1/ko
Publication of JP2007107047A publication Critical patent/JP2007107047A/ja
Publication of JP2007107047A5 publication Critical patent/JP2007107047A5/ja
Application granted granted Critical
Publication of JP4974504B2 publication Critical patent/JP4974504B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (3)

  1. 蒸発源から間欠的に成膜用の材料を供給することにより、被成膜面に選択的に被膜を形成することを特徴とする発光装置の作製方法。
  2. 請求項1において、
    前記供給は、前記材料が溶媒中に溶解または分散している原料液をエアロゾル化し、前記溶媒を蒸発もしくは昇華させて、キャリアガスとともに放出することによって行うことを特徴とする発光装置の作製方法。
  3. 請求項1において、
    前記供給は、粉体状の前記材料を蒸発もしくは昇華させて、キャリアガスとともに放出することによって行うことを特徴とする発光装置の作製方法。
JP2005298879A 2005-10-13 2005-10-13 成膜装置、発光装置の作製方法 Expired - Fee Related JP4974504B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005298879A JP4974504B2 (ja) 2005-10-13 2005-10-13 成膜装置、発光装置の作製方法
US11/545,344 US8932682B2 (en) 2005-10-13 2006-10-10 Method for manufacturing a light emitting device
KR1020060099774A KR101329016B1 (ko) 2005-10-13 2006-10-13 증착 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005298879A JP4974504B2 (ja) 2005-10-13 2005-10-13 成膜装置、発光装置の作製方法

Publications (3)

Publication Number Publication Date
JP2007107047A JP2007107047A (ja) 2007-04-26
JP2007107047A5 true JP2007107047A5 (ja) 2008-11-20
JP4974504B2 JP4974504B2 (ja) 2012-07-11

Family

ID=37948442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005298879A Expired - Fee Related JP4974504B2 (ja) 2005-10-13 2005-10-13 成膜装置、発光装置の作製方法

Country Status (3)

Country Link
US (1) US8932682B2 (ja)
JP (1) JP4974504B2 (ja)
KR (1) KR101329016B1 (ja)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4789551B2 (ja) * 2005-09-06 2011-10-12 株式会社半導体エネルギー研究所 有機el成膜装置
EP2020454B1 (en) * 2007-07-27 2012-09-05 Applied Materials, Inc. Evaporation apparatus with inclined crucible
JP5469950B2 (ja) * 2008-08-08 2014-04-16 株式会社半導体エネルギー研究所 発光装置の作製方法
US8328561B2 (en) 2008-08-11 2012-12-11 Veeco Instruments Inc. Electrical contacts for use with vacuum deposition sources
EP2230703A3 (en) * 2009-03-18 2012-05-02 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus and manufacturing method of lighting device
JP5395478B2 (ja) * 2009-03-18 2014-01-22 株式会社半導体エネルギー研究所 製造装置
JP5402139B2 (ja) * 2009-03-24 2014-01-29 大日本印刷株式会社 アンテナパターン及びアンテナパターンの製造方法
KR100952313B1 (ko) * 2009-03-26 2010-04-09 에스엔유 프리시젼 주식회사 원료 공급 유닛과 원료 공급 방법 및 박막 증착 장치
CN101851742B (zh) * 2009-03-31 2012-07-04 比亚迪股份有限公司 一种化合物半导体薄膜的制备方法
DE102009038519B4 (de) * 2009-08-25 2012-05-31 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zur Herstellung von Stöchiometriegradientenschichten
WO2012053486A1 (ja) * 2010-10-18 2012-04-26 日本タングステン株式会社 放電加工用電極
US9461023B2 (en) * 2011-10-28 2016-10-04 Bridgelux, Inc. Jetting a highly reflective layer onto an LED assembly
US8652860B2 (en) 2011-01-09 2014-02-18 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
DE102011051261A1 (de) * 2011-06-22 2012-12-27 Aixtron Se Verfahren und Vorrichtung zum Abscheiden von OLEDs insbesondere Verdampfungsvorrichtung dazu
KR101930849B1 (ko) * 2011-12-28 2018-12-20 삼성디스플레이 주식회사 박막 증착 장치 및 그것을 이용한 박막 증착 방법
KR101389011B1 (ko) * 2012-03-28 2014-04-24 주식회사 유니텍스 소스 컨테이너 및 기상 증착용 반응로
US9285349B2 (en) 2012-11-07 2016-03-15 Empire Technology Development Llc Analyte detectors and methods for their preparation and use
KR101481096B1 (ko) * 2013-04-04 2015-01-14 주식회사 선익시스템 유기물 증착 시스템
KR20150006725A (ko) * 2013-07-09 2015-01-19 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
JP6111171B2 (ja) * 2013-09-02 2017-04-05 東京エレクトロン株式会社 成膜方法及び成膜装置
JP6276007B2 (ja) * 2013-11-26 2018-02-07 株式会社カネカ 蒸着装置、成膜方法及び有機el装置の製造方法
US9196591B2 (en) * 2014-02-17 2015-11-24 International Business Machines Corporation Chip with shelf life
US9245846B2 (en) 2014-05-06 2016-01-26 International Business Machines Corporation Chip with programmable shelf life
JP6584067B2 (ja) * 2014-05-30 2019-10-02 日立造船株式会社 真空蒸着装置
US20150372251A1 (en) * 2014-06-19 2015-12-24 Toshishige Fujii Electric element package
US20160211351A1 (en) * 2015-01-20 2016-07-21 Institute of Microelectronics, Chinese Academy of Sciences Apparatus and method for epitaxially growing sources and drains of a finfet device
KR20190071833A (ko) * 2016-11-13 2019-06-24 어플라이드 머티어리얼스, 인코포레이티드 Euv 리소그래피를 위한 표면 처리
KR102369676B1 (ko) * 2017-04-10 2022-03-04 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
CN109326730B (zh) * 2017-08-01 2024-02-13 拓旷(上海)光电科技有限公司 用于有机发光二极管显示器的制造设备
US20190136366A1 (en) * 2017-11-08 2019-05-09 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Crucible and vapor deposition method
JP6662840B2 (ja) * 2017-12-11 2020-03-11 株式会社アルバック 蒸着装置
US20190211441A1 (en) * 2018-01-11 2019-07-11 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Storage device with sealing function and heating assembly
KR20200108152A (ko) * 2019-03-06 2020-09-17 삼성디스플레이 주식회사 표시 장치
CN113661577A (zh) * 2019-04-09 2021-11-16 夏普株式会社 显示装置以及制造方法
CN110846622B (zh) * 2019-11-11 2022-03-29 深圳市华星光电半导体显示技术有限公司 蒸镀装置及其控制方法
US20210375650A1 (en) * 2020-06-01 2021-12-02 Applied Materials, Inc. High temperature and vacuum isolation processing mini-environments
US20220145456A1 (en) * 2020-11-09 2022-05-12 Applied Materials, Inc. Refillable large volume solid precursor sublimation vessel
US20230335367A1 (en) 2020-11-10 2023-10-19 Hitachi High-Tech Corporation Electron beam application device
US11674227B2 (en) 2021-02-03 2023-06-13 Applied Materials, Inc. Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
CN115094383B (zh) * 2022-07-01 2023-06-30 江阴纳力新材料科技有限公司 一种基于蒸镀的复合正极集流体制备装置及方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59104472A (ja) 1982-12-03 1984-06-16 Nippon Telegr & Teleph Corp <Ntt> フラツシユ蒸着方法
JPH10241858A (ja) 1997-02-25 1998-09-11 Tdk Corp 有機エレクトロルミネッセンス表示装置の製造方法および製造装置
US6049167A (en) 1997-02-17 2000-04-11 Tdk Corporation Organic electroluminescent display device, and method and system for making the same
US5945163A (en) * 1998-02-19 1999-08-31 First Solar, Llc Apparatus and method for depositing a material on a substrate
TW490714B (en) * 1999-12-27 2002-06-11 Semiconductor Energy Lab Film formation apparatus and method for forming a film
US7517551B2 (en) * 2000-05-12 2009-04-14 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a light-emitting device
EP1167566B1 (en) * 2000-06-22 2011-01-26 Panasonic Electric Works Co., Ltd. Apparatus for and method of vacuum vapor deposition
JP3742567B2 (ja) * 2000-06-22 2006-02-08 松下電工株式会社 真空蒸着装置及び真空蒸着方法
JP3541294B2 (ja) * 2000-09-01 2004-07-07 独立行政法人 科学技術振興機構 有機エレクトロルミネッセンス薄膜の作製方法と作製装置
US6641674B2 (en) * 2000-11-10 2003-11-04 Helix Technology Inc. Movable evaporation device
JP2003109755A (ja) 2001-09-27 2003-04-11 Sanyo Electric Co Ltd 有機elデバイスの製造装置
JP2003197531A (ja) * 2001-12-21 2003-07-11 Seiko Epson Corp パターニング装置、パターニング方法、電子素子の製造方法、回路基板の製造方法、電子装置の製造方法、電気光学装置とその製造方法、及び電子機器
JP2003231963A (ja) * 2002-02-12 2003-08-19 Sanyo Shinku Kogyo Kk 真空蒸着方法とその装置
SG113448A1 (en) * 2002-02-25 2005-08-29 Semiconductor Energy Lab Fabrication system and a fabrication method of a light emitting device
EP1369499A3 (en) * 2002-04-15 2004-10-20 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating light-emitting device and apparatus for manufacturing light-emitting device
JP2003321765A (ja) 2002-04-30 2003-11-14 Sanyo Shinku Kogyo Kk 有機物の蒸着方法及びこの方法に用いられる蒸着装置ならびに蒸発源
US20040035360A1 (en) * 2002-05-17 2004-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
TWI336905B (en) * 2002-05-17 2011-02-01 Semiconductor Energy Lab Evaporation method, evaporation device and method of fabricating light emitting device
US20030221620A1 (en) * 2002-06-03 2003-12-04 Semiconductor Energy Laboratory Co., Ltd. Vapor deposition device
US20040040504A1 (en) * 2002-08-01 2004-03-04 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
TWI277363B (en) * 2002-08-30 2007-03-21 Semiconductor Energy Lab Fabrication system, light-emitting device and fabricating method of organic compound-containing layer
AU2003263609A1 (en) * 2002-09-20 2004-04-08 Semiconductor Energy Laboratory Co., Ltd. Fabrication system and manufacturing method of light emitting device
JP4251857B2 (ja) * 2002-11-27 2009-04-08 株式会社アルバック 真空成膜装置及び真空成膜方法
US7211461B2 (en) * 2003-02-14 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP4090039B2 (ja) * 2003-04-16 2008-05-28 トッキ株式会社 蒸着装置における蒸発源
JP4493926B2 (ja) * 2003-04-25 2010-06-30 株式会社半導体エネルギー研究所 製造装置
US7211454B2 (en) * 2003-07-25 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of a light emitting device including moving the source of the vapor deposition parallel to the substrate
JP4578872B2 (ja) * 2003-07-31 2010-11-10 株式会社半導体エネルギー研究所 容器および蒸着装置
US20050022743A1 (en) * 2003-07-31 2005-02-03 Semiconductor Energy Laboratory Co., Ltd. Evaporation container and vapor deposition apparatus
US8123862B2 (en) * 2003-08-15 2012-02-28 Semiconductor Energy Laboratory Co., Ltd. Deposition apparatus and manufacturing apparatus
JP2005105375A (ja) * 2003-09-30 2005-04-21 Matsushita Electric Ind Co Ltd 薄膜の製造方法及び薄膜の製造装置
US7339139B2 (en) * 2003-10-03 2008-03-04 Darly Custom Technology, Inc. Multi-layered radiant thermal evaporator and method of use
JP4545504B2 (ja) * 2004-07-15 2010-09-15 株式会社半導体エネルギー研究所 膜形成方法、発光装置の作製方法
JP4789551B2 (ja) * 2005-09-06 2011-10-12 株式会社半導体エネルギー研究所 有機el成膜装置

Similar Documents

Publication Publication Date Title
JP2007107047A5 (ja) 発光装置の作製方法
JP2008530733A5 (ja)
EP1995996A4 (en) FILM GENERATING DEVICE AND METHOD FOR PRODUCING AN ILLUMINATING ELEMENT
JP2007070687A5 (ja)
JP2008163457A5 (ja) 成膜装置
TW200714723A (en) Method of organic material vacuum deposition and apparatus therefor
WO2008105287A1 (ja) 蒸着源、蒸着装置、有機薄膜の成膜方法
JP2009518124A5 (ja)
TW200600595A (en) Evaporation device
JP2002060926A5 (ja) 発光装置の作製方法
JP2010540651A5 (ja)
TW200704812A (en) Vapor deposition device
JP2009520110A5 (ja)
JP2007531819A5 (ja)
JP2008513964A5 (ja)
JP2013147754A5 (ja) 成膜方法および発光装置の作製方法
JP2008513965A5 (ja)
TW200641161A (en) Method of forming mask and mask
KR20120093333A (ko) 회전 공급원을 사용하는 필름 증착 방법 및 장치
JP2006216704A5 (ja)
JP2010503205A5 (ja)
EP1728770B8 (de) Verfahren zur Markierung von Objektoberflächen
JP2004055401A5 (ja)
JP2010248629A5 (ja)
TW200703733A (en) Process for making an organic light-emitting device