JP2007073998A5 - - Google Patents

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Publication number
JP2007073998A5
JP2007073998A5 JP2006337515A JP2006337515A JP2007073998A5 JP 2007073998 A5 JP2007073998 A5 JP 2007073998A5 JP 2006337515 A JP2006337515 A JP 2006337515A JP 2006337515 A JP2006337515 A JP 2006337515A JP 2007073998 A5 JP2007073998 A5 JP 2007073998A5
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JP
Japan
Prior art keywords
substrate
chip
active layer
chip according
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006337515A
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English (en)
Japanese (ja)
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JP2007073998A (ja
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Publication date
Priority claimed from DE10039433.7A external-priority patent/DE10039433B4/de
Application filed filed Critical
Publication of JP2007073998A publication Critical patent/JP2007073998A/ja
Publication of JP2007073998A5 publication Critical patent/JP2007073998A5/ja
Withdrawn legal-status Critical Current

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JP2006337515A 2000-08-11 2006-12-14 発光半導体チップ Withdrawn JP2007073998A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10039433.7A DE10039433B4 (de) 2000-08-11 2000-08-11 Halbleiterchip für die Optoelektronik

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002520316A Division JP2004507095A (ja) 2000-08-11 2001-07-24 発光半導体チップ

Publications (2)

Publication Number Publication Date
JP2007073998A JP2007073998A (ja) 2007-03-22
JP2007073998A5 true JP2007073998A5 (enExample) 2008-09-04

Family

ID=7652222

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2002520316A Pending JP2004507095A (ja) 2000-08-11 2001-07-24 発光半導体チップ
JP2006337515A Withdrawn JP2007073998A (ja) 2000-08-11 2006-12-14 発光半導体チップ

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2002520316A Pending JP2004507095A (ja) 2000-08-11 2001-07-24 発光半導体チップ

Country Status (7)

Country Link
US (1) US6891199B2 (enExample)
EP (1) EP1307927B1 (enExample)
JP (2) JP2004507095A (enExample)
CN (2) CN1276522C (enExample)
DE (2) DE10039433B4 (enExample)
TW (1) TW502464B (enExample)
WO (1) WO2002015287A1 (enExample)

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DE10019665A1 (de) * 2000-04-19 2001-10-31 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip und Verfahren zu dessen Herstellung
JP4294295B2 (ja) * 2002-11-06 2009-07-08 株式会社小糸製作所 車両用前照灯
US6869812B1 (en) * 2003-05-13 2005-03-22 Heng Liu High power AllnGaN based multi-chip light emitting diode
ITTO20030610A1 (it) 2003-08-05 2005-02-06 Fiat Ricerche Disposizione di illuminamento a profondita' ridotta per
KR20050034936A (ko) * 2003-10-10 2005-04-15 삼성전기주식회사 형광체를 이용한 파장변환형 발광 다이오드 패키지 및제조방법
US20060255349A1 (en) * 2004-05-11 2006-11-16 Heng Liu High power AllnGaN based multi-chip light emitting diode
JP4599111B2 (ja) * 2004-07-30 2010-12-15 スタンレー電気株式会社 灯具光源用ｌｅｄランプ
GB2417126A (en) * 2004-08-09 2006-02-15 Qinetiq Ltd Method for fabricating lateral semiconductor device
US7829909B2 (en) * 2005-11-15 2010-11-09 Verticle, Inc. Light emitting diodes and fabrication methods thereof
JP2009530798A (ja) 2006-01-05 2009-08-27 イルミテックス， インコーポレイテッド Ｌｅｄから光を導くための独立した光学デバイス
JP2007201361A (ja) * 2006-01-30 2007-08-09 Shinko Electric Ind Co Ltd 半導体装置及び半導体装置の製造方法
KR100735311B1 (ko) * 2006-04-21 2007-07-04 삼성전기주식회사 발광 다이오드 칩
JP2008016565A (ja) * 2006-07-04 2008-01-24 Shinko Electric Ind Co Ltd 発光素子収容体及びその製造方法、及び発光装置
TW200810148A (en) * 2006-08-09 2008-02-16 Everlight Electronics Co Ltd Side-emitting diode package
EP2070123A2 (en) 2006-10-02 2009-06-17 Illumitex, Inc. Led system and method
WO2009048076A1 (ja) * 2007-10-09 2009-04-16 Alps Electric Co., Ltd. 半導体発光装置
WO2009100358A1 (en) 2008-02-08 2009-08-13 Illumitex, Inc. System and method for emitter layer shaping
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
JP5182231B2 (ja) * 2009-06-09 2013-04-17 豊田合成株式会社 Ｌｅｄランプ
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
CN101692475A (zh) * 2009-10-26 2010-04-07 无锡瑞威光电科技有限公司 非正方形led芯片的组合式封装方法
CN101976715B (zh) * 2010-10-05 2011-10-05 厦门市三安光电科技有限公司 倒梯形铝镓铟磷系发光二极管的制作工艺
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
WO2015011586A1 (en) * 2013-07-26 2015-01-29 Koninklijke Philips N.V. Led dome with inner high index pillar

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JP2002359437A (ja) * 2001-03-29 2002-12-13 Toshiba Electronic Engineering Corp 光半導体素子および光半導体素子の製造方法

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