JP2007043146A5 - - Google Patents

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Publication number
JP2007043146A5
JP2007043146A5 JP2006194503A JP2006194503A JP2007043146A5 JP 2007043146 A5 JP2007043146 A5 JP 2007043146A5 JP 2006194503 A JP2006194503 A JP 2006194503A JP 2006194503 A JP2006194503 A JP 2006194503A JP 2007043146 A5 JP2007043146 A5 JP 2007043146A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006194503A
Other versions
JP2007043146A (ja
JP5110814B2 (ja
Filing date
Publication date
Priority claimed from US11/248,985 external-priority patent/US20070018292A1/en
Application filed filed Critical
Publication of JP2007043146A publication Critical patent/JP2007043146A/ja
Publication of JP2007043146A5 publication Critical patent/JP2007043146A5/ja
Application granted granted Critical
Publication of JP5110814B2 publication Critical patent/JP5110814B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006194503A 2005-07-22 2006-07-14 高速集積回路用のパッケージング Expired - Fee Related JP5110814B2 (ja)

Applications Claiming Priority (18)

Application Number Priority Date Filing Date Title
US70170105P 2005-07-22 2005-07-22
US60/701,701 2005-07-22
US72227205P 2005-09-30 2005-09-30
US60/722,272 2005-09-30
US11/248,985 US20070018292A1 (en) 2005-07-22 2005-10-12 Packaging for high speed integrated circuits
US11/248,985 2005-10-12
US11/472,904 2006-06-22
US11/472,697 2006-06-22
US11/472,953 2006-06-22
US11/472,697 US20070096277A1 (en) 2005-07-22 2006-06-22 Packaging for high speed integrated circuits
US11/472,953 US20070018289A1 (en) 2005-07-22 2006-06-22 Packaging for high speed integrated circuits
US11/472,904 US7884451B2 (en) 2005-07-22 2006-06-22 Packaging for high speed integrated circuits
US11/473,702 2006-06-23
US11/473,631 US20070018293A1 (en) 2005-07-22 2006-06-23 Packaging for high speed integrated circuits
US11/474,198 US20070018294A1 (en) 2005-07-22 2006-06-23 Packaging for high speed integrated circuits
US11/473,631 2006-06-23
US11/473,702 US7638870B2 (en) 2005-07-22 2006-06-23 Packaging for high speed integrated circuits
US11/474,198 2006-06-23

Publications (3)

Publication Number Publication Date
JP2007043146A JP2007043146A (ja) 2007-02-15
JP2007043146A5 true JP2007043146A5 (ja) 2009-09-03
JP5110814B2 JP5110814B2 (ja) 2012-12-26

Family

ID=37398828

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2006194503A Expired - Fee Related JP5110814B2 (ja) 2005-07-22 2006-07-14 高速集積回路用のパッケージング
JP2006194500A Expired - Fee Related JP4764277B2 (ja) 2005-07-22 2006-07-14 高速集積回路用のパッケージング
JP2006194499A Expired - Fee Related JP5149493B2 (ja) 2005-07-22 2006-07-14 高速集積回路用のパッケージング

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2006194500A Expired - Fee Related JP4764277B2 (ja) 2005-07-22 2006-07-14 高速集積回路用のパッケージング
JP2006194499A Expired - Fee Related JP5149493B2 (ja) 2005-07-22 2006-07-14 高速集積回路用のパッケージング

Country Status (3)

Country Link
EP (3) EP1746648A3 (ja)
JP (3) JP5110814B2 (ja)
SG (2) SG129385A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218776A (ja) * 2007-03-06 2008-09-18 Renesas Technology Corp 半導体装置
WO2010073832A1 (ja) * 2008-12-26 2010-07-01 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体パッケージ
US9200973B2 (en) * 2012-06-28 2015-12-01 Intel Corporation Semiconductor package with air pressure sensor
JP6190295B2 (ja) * 2014-03-12 2017-08-30 株式会社東芝 半導体チップ、および半導体パッケージ
CN115085706A (zh) * 2021-03-11 2022-09-20 台达电子企业管理（上海）有限公司 开关模块

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