JP2007027786A5 - - Google Patents

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Publication number
JP2007027786A5
JP2007027786A5 JP2006261571A JP2006261571A JP2007027786A5 JP 2007027786 A5 JP2007027786 A5 JP 2007027786A5 JP 2006261571 A JP2006261571 A JP 2006261571A JP 2006261571 A JP2006261571 A JP 2006261571A JP 2007027786 A5 JP2007027786 A5 JP 2007027786A5
Authority
JP
Japan
Prior art keywords
resist
applying
film
metal layer
entire surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006261571A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007027786A (ja
Filing date
Publication date
Priority claimed from US10/183,674 external-priority patent/US6824959B2/en
Application filed filed Critical
Publication of JP2007027786A publication Critical patent/JP2007027786A/ja
Publication of JP2007027786A5 publication Critical patent/JP2007027786A5/ja
Withdrawn legal-status Critical Current

Links

JP2006261571A 2002-06-27 2006-09-26 ポリマー基板にホールをつくるためのプロセス Withdrawn JP2007027786A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/183,674 US6824959B2 (en) 2002-06-27 2002-06-27 Process for creating holes in polymeric substrates

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004518069A Division JP4411410B2 (ja) 2002-06-27 2003-06-27 ポリマー基板にホールをつくるためのプロセス

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010043307A Division JP2010118708A (ja) 2002-06-27 2010-02-26 ポリマー基板にホールをつくるためのプロセス

Publications (2)

Publication Number Publication Date
JP2007027786A JP2007027786A (ja) 2007-02-01
JP2007027786A5 true JP2007027786A5 (enExample) 2007-03-29

Family

ID=29779180

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2004518069A Expired - Fee Related JP4411410B2 (ja) 2002-06-27 2003-06-27 ポリマー基板にホールをつくるためのプロセス
JP2006261571A Withdrawn JP2007027786A (ja) 2002-06-27 2006-09-26 ポリマー基板にホールをつくるためのプロセス
JP2010043307A Pending JP2010118708A (ja) 2002-06-27 2010-02-26 ポリマー基板にホールをつくるためのプロセス

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2004518069A Expired - Fee Related JP4411410B2 (ja) 2002-06-27 2003-06-27 ポリマー基板にホールをつくるためのプロセス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010043307A Pending JP2010118708A (ja) 2002-06-27 2010-02-26 ポリマー基板にホールをつくるためのプロセス

Country Status (11)

Country Link
US (1) US6824959B2 (enExample)
EP (1) EP1523868B1 (enExample)
JP (3) JP4411410B2 (enExample)
KR (1) KR100659808B1 (enExample)
CN (1) CN1672472A (enExample)
AU (1) AU2003245746A1 (enExample)
DE (1) DE60317902T2 (enExample)
ES (1) ES2297175T3 (enExample)
MY (1) MY134327A (enExample)
TW (1) TWI228953B (enExample)
WO (1) WO2004004430A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050153107A1 (en) * 2004-01-12 2005-07-14 Tdk Corporation Substrate having functional layer pattern formed thereon and method of forming functional layer pattern
US7271697B2 (en) * 2004-12-07 2007-09-18 Multi-Fineline Electronix Miniature circuitry and inductive components and methods for manufacturing same
KR100738055B1 (ko) * 2005-05-18 2007-07-12 삼성에스디아이 주식회사 전자소자의 적층 형성 방법 및 이를 이용한 ｆｅｄ의제조방법
US8008188B2 (en) 2007-06-11 2011-08-30 Ppg Industries Ohio, Inc. Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
US8637778B2 (en) 2010-04-08 2014-01-28 Intel Corporation Debond interconnect structures

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3451793A (en) 1966-02-12 1969-06-24 Toko Inc Magnetic thin film wire with multiple laminated film coating
US3469982A (en) 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
FR2041471A5 (en) 1969-04-25 1971-01-29 Cii Multi-layer circuits with thermosetting - dielectric
US3984299A (en) 1970-06-19 1976-10-05 Ppg Industries, Inc. Process for electrodepositing cationic compositions
US3738835A (en) 1971-10-21 1973-06-12 Ibm Electrophoretic photoresist composition and a method of forming etch resistant masks
US3947338A (en) 1971-10-28 1976-03-30 Ppg Industries, Inc. Method of electrodepositing self-crosslinking cationic compositions
US3793278A (en) 1972-03-10 1974-02-19 Ppg Industries Inc Method of preparing sulfonium group containing compositions
US3833436A (en) 1972-09-05 1974-09-03 Buckbee Mears Co Etching of polyimide films
DE2707405C3 (de) 1976-07-19 1987-12-03 Vianova Kunstharz Ag, Werndorf Verfahren zur Herstellung von Bindemitteln für die Elektrotauchlackierung
US4343885A (en) 1978-05-09 1982-08-10 Dynachem Corporation Phototropic photosensitive compositions containing fluoran colorformer
JPS5527647A (en) 1978-08-17 1980-02-27 Nippon Telegraph & Telephone Paint for forming insulating film of conductive printed circuit board and method of forming insulating film
ATE1293T1 (de) 1978-12-11 1982-07-15 Shell Internationale Research Maatschappij B.V. Zusammensetzungen auf der basis hitzehaertbarer harzartiger bindemittel, deren herstellung und deren verwendung als ueberzugsmittel.
JPS56136416A (en) * 1980-03-27 1981-10-24 Matsushita Electric Works Ltd Limit switch
US4378264A (en) 1980-05-27 1983-03-29 E. I. Du Pont De Nemours And Company Integrated laminating process
JPS58108229A (ja) 1981-12-21 1983-06-28 Hitachi Ltd ポリイミド系樹脂膜の選択エツチング方法
JPS59133232A (ja) 1983-01-21 1984-07-31 Hitachi Ltd ポリイミドのエツチング方法
GB8327756D0 (en) 1983-10-17 1983-11-16 Ici Plc Extraction process
US4508749A (en) 1983-12-27 1985-04-02 International Business Machines Corporation Patterning of polyimide films with ultraviolet light
US4592816A (en) 1984-09-26 1986-06-03 Rohm And Haas Company Electrophoretic deposition process
EP0272500B1 (en) 1986-11-28 1993-05-05 Nippon Paint Co., Ltd. Cationic micro gel praticle dispersion and a coating composition therefrom
JPH0287590A (ja) 1988-09-22 1990-03-28 Shindo Denshi Kogyo Kk フイルム回路基板の貫通穴形成方法
US5242713A (en) 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
EP0433720A3 (en) 1989-12-22 1992-08-26 Siemens Aktiengesellschaft Method of applying a solder stop coating on printed circuit boards
US5096556A (en) 1990-06-25 1992-03-17 Ppg Industries, Inc. Cationic microgels and their use in electrodeposition
JPH04355990A (ja) 1990-09-18 1992-12-09 Fujitsu Ltd 回路基板およびその製造方法
US5229550A (en) 1990-10-30 1993-07-20 International Business Machines Corporation Encapsulated circuitized power core alignment and lamination
US5298685A (en) 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5153986A (en) 1991-07-17 1992-10-13 International Business Machines Method for fabricating metal core layers for a multi-layer circuit board
US5242780A (en) 1991-10-18 1993-09-07 Industrial Technology Research Institute Electrophoretic positive working photosensitive composition comprising as the photosensitive ingredient an aliphatic polyester having o-quinone diazide on the side chain and end groups
US5227008A (en) 1992-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method for making flexible circuits
GB2265021B (en) 1992-03-10 1996-02-14 Nippon Steel Chemical Co Photosensitive materials and their use in forming protective layers for printed circuit and process for preparation of printed circuit
JPH05320313A (ja) 1992-05-27 1993-12-03 Murata Mfg Co Ltd 電子部品封止用樹脂組成物
JPH05343837A (ja) 1992-06-05 1993-12-24 Taiyo Ink Mfg Ltd ソルダーレジストインキ組成物及びソルダーレジストパターン形成方法
JPH06268378A (ja) 1993-03-12 1994-09-22 Oki Electric Ind Co Ltd 多層配線基板のビアホールの形成方法
US5600035A (en) 1994-07-13 1997-02-04 Ppg Industries, Inc. Positive photoactive compounds based on 2,6-dinitro benzyl groups and 2,5-dinitro benzyl groups
US5590460A (en) 1994-07-19 1997-01-07 Tessera, Inc. Method of making multilayer circuit
WO1996022597A1 (en) 1995-01-17 1996-07-25 Nippon Steel Chemical Co., Ltd. Laminate
JPH09148748A (ja) * 1995-11-20 1997-06-06 Taiyo Ink Mfg Ltd 多層プリント配線板及びその製造方法並びにそれに用いる樹脂絶縁層形成用組成物
US6117931A (en) * 1996-07-01 2000-09-12 Basf Corporation Curable coating compositions having improved effect pigment orientation and a method of using the same
US6080526A (en) * 1997-03-24 2000-06-27 Alliedsignal Inc. Integration of low-k polymers into interlevel dielectrics using controlled electron-beam radiation
JPH1121359A (ja) 1997-06-30 1999-01-26 Process Lab Micron:Kk ポリエステル系フィルムの化学エッチング方法
JPH1171501A (ja) 1997-08-29 1999-03-16 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた硬化物
JP3339387B2 (ja) 1997-11-07 2002-10-28 日立電線株式会社 Ｔａｂ用テープの製造方法
JP3067021B2 (ja) 1998-09-18 2000-07-17 インターナショナル・ビジネス・マシーンズ・コーポレ−ション 両面配線基板の製造方法
JP4257877B2 (ja) * 1998-10-08 2009-04-22 関西ペイント株式会社 塗料組成物
JP2000227665A (ja) * 1998-11-02 2000-08-15 Kansai Paint Co Ltd パターン形成方法
US6177357B1 (en) 1999-04-30 2001-01-23 3M Innovative Properties Company Method for making flexible circuits
US6379865B1 (en) 2000-04-11 2002-04-30 3M Innovative Properties Company Photoimageable, aqueous acid soluble polyimide polymers
JP2001305750A (ja) 2000-04-18 2001-11-02 Toray Eng Co Ltd ポリイミドフィルムのエッチング方法
JP4685236B2 (ja) * 2000-12-13 2011-05-18 三菱レイヨン株式会社 熱硬化性被覆組成物

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