KR100659808B1 - 중합체 기판에 홀을 형성하는 방법 - Google Patents

중합체 기판에 홀을 형성하는 방법 Download PDF

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Publication number
KR100659808B1
KR100659808B1 KR1020047021341A KR20047021341A KR100659808B1 KR 100659808 B1 KR100659808 B1 KR 100659808B1 KR 1020047021341 A KR1020047021341 A KR 1020047021341A KR 20047021341 A KR20047021341 A KR 20047021341A KR 100659808 B1 KR100659808 B1 KR 100659808B1
Authority
KR
South Korea
Prior art keywords
resist
applying
film
metal layer
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020047021341A
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English (en)
Korean (ko)
Other versions
KR20050006301A (ko
Inventor
올손케빈씨
왕알란이
Original Assignee
피피지 인더스트리즈 오하이오 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 피피지 인더스트리즈 오하이오 인코포레이티드 filed Critical 피피지 인더스트리즈 오하이오 인코포레이티드
Publication of KR20050006301A publication Critical patent/KR20050006301A/ko
Application granted granted Critical
Publication of KR100659808B1 publication Critical patent/KR100659808B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Materials For Photolithography (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Paints Or Removers (AREA)
KR1020047021341A 2002-06-27 2003-06-27 중합체 기판에 홀을 형성하는 방법 Expired - Fee Related KR100659808B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/183,674 US6824959B2 (en) 2002-06-27 2002-06-27 Process for creating holes in polymeric substrates
US10/183,674 2002-06-27
PCT/US2003/020477 WO2004004430A1 (en) 2002-06-27 2003-06-27 Process for creating holes in polymeric substrates

Publications (2)

Publication Number Publication Date
KR20050006301A KR20050006301A (ko) 2005-01-15
KR100659808B1 true KR100659808B1 (ko) 2006-12-19

Family

ID=29779180

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047021341A Expired - Fee Related KR100659808B1 (ko) 2002-06-27 2003-06-27 중합체 기판에 홀을 형성하는 방법

Country Status (11)

Country Link
US (1) US6824959B2 (enExample)
EP (1) EP1523868B1 (enExample)
JP (3) JP4411410B2 (enExample)
KR (1) KR100659808B1 (enExample)
CN (1) CN1672472A (enExample)
AU (1) AU2003245746A1 (enExample)
DE (1) DE60317902T2 (enExample)
ES (1) ES2297175T3 (enExample)
MY (1) MY134327A (enExample)
TW (1) TWI228953B (enExample)
WO (1) WO2004004430A1 (enExample)

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* Cited by examiner, † Cited by third party
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US20050153107A1 (en) * 2004-01-12 2005-07-14 Tdk Corporation Substrate having functional layer pattern formed thereon and method of forming functional layer pattern
US7271697B2 (en) * 2004-12-07 2007-09-18 Multi-Fineline Electronix Miniature circuitry and inductive components and methods for manufacturing same
KR100738055B1 (ko) * 2005-05-18 2007-07-12 삼성에스디아이 주식회사 전자소자의 적층 형성 방법 및 이를 이용한 ｆｅｄ의제조방법
US8008188B2 (en) 2007-06-11 2011-08-30 Ppg Industries Ohio, Inc. Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
US8637778B2 (en) 2010-04-08 2014-01-28 Intel Corporation Debond interconnect structures

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US3469982A (en) 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
FR2041471A5 (en) 1969-04-25 1971-01-29 Cii Multi-layer circuits with thermosetting - dielectric
US3984299A (en) 1970-06-19 1976-10-05 Ppg Industries, Inc. Process for electrodepositing cationic compositions
US3738835A (en) 1971-10-21 1973-06-12 Ibm Electrophoretic photoresist composition and a method of forming etch resistant masks
US3947338A (en) 1971-10-28 1976-03-30 Ppg Industries, Inc. Method of electrodepositing self-crosslinking cationic compositions
US3793278A (en) 1972-03-10 1974-02-19 Ppg Industries Inc Method of preparing sulfonium group containing compositions
US3833436A (en) 1972-09-05 1974-09-03 Buckbee Mears Co Etching of polyimide films
DE2707405C3 (de) 1976-07-19 1987-12-03 Vianova Kunstharz Ag, Werndorf Verfahren zur Herstellung von Bindemitteln für die Elektrotauchlackierung
US4343885A (en) 1978-05-09 1982-08-10 Dynachem Corporation Phototropic photosensitive compositions containing fluoran colorformer
JPS5527647A (en) 1978-08-17 1980-02-27 Nippon Telegraph & Telephone Paint for forming insulating film of conductive printed circuit board and method of forming insulating film
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JPS59133232A (ja) 1983-01-21 1984-07-31 Hitachi Ltd ポリイミドのエツチング方法
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JPH0287590A (ja) 1988-09-22 1990-03-28 Shindo Denshi Kogyo Kk フイルム回路基板の貫通穴形成方法
US5242713A (en) 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
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US5096556A (en) 1990-06-25 1992-03-17 Ppg Industries, Inc. Cationic microgels and their use in electrodeposition
JPH04355990A (ja) 1990-09-18 1992-12-09 Fujitsu Ltd 回路基板およびその製造方法
US5229550A (en) 1990-10-30 1993-07-20 International Business Machines Corporation Encapsulated circuitized power core alignment and lamination
US5298685A (en) 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5153986A (en) 1991-07-17 1992-10-13 International Business Machines Method for fabricating metal core layers for a multi-layer circuit board
US5242780A (en) 1991-10-18 1993-09-07 Industrial Technology Research Institute Electrophoretic positive working photosensitive composition comprising as the photosensitive ingredient an aliphatic polyester having o-quinone diazide on the side chain and end groups
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JPH05320313A (ja) 1992-05-27 1993-12-03 Murata Mfg Co Ltd 電子部品封止用樹脂組成物
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JP4257877B2 (ja) * 1998-10-08 2009-04-22 関西ペイント株式会社 塗料組成物
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Also Published As

Publication number Publication date
JP4411410B2 (ja) 2010-02-10
AU2003245746A1 (en) 2004-01-19
TWI228953B (en) 2005-03-01
EP1523868A1 (en) 2005-04-20
US20040000426A1 (en) 2004-01-01
JP2005531162A (ja) 2005-10-13
WO2004004430A1 (en) 2004-01-08
DE60317902D1 (de) 2008-01-17
JP2010118708A (ja) 2010-05-27
CN1672472A (zh) 2005-09-21
DE60317902T2 (de) 2008-10-23
KR20050006301A (ko) 2005-01-15
ES2297175T3 (es) 2008-05-01
MY134327A (en) 2007-12-31
US6824959B2 (en) 2004-11-30
JP2007027786A (ja) 2007-02-01
EP1523868B1 (en) 2007-12-05
TW200414848A (en) 2004-08-01

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