CN1672472A - 在聚合物基材中形成通孔的方法 - Google Patents

在聚合物基材中形成通孔的方法 Download PDF

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Publication number
CN1672472A
CN1672472A CNA038178761A CN03817876A CN1672472A CN 1672472 A CN1672472 A CN 1672472A CN A038178761 A CNA038178761 A CN A038178761A CN 03817876 A CN03817876 A CN 03817876A CN 1672472 A CN1672472 A CN 1672472A
Authority
CN
China
Prior art keywords
resist
layer
film
metal
curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA038178761A
Other languages
English (en)
Chinese (zh)
Inventor
K·C·奥尔森
A·E·王
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPG Industries Inc
Original Assignee
PPG Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPG Industries Inc filed Critical PPG Industries Inc
Publication of CN1672472A publication Critical patent/CN1672472A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Materials For Photolithography (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Paints Or Removers (AREA)
CNA038178761A 2002-06-27 2003-06-27 在聚合物基材中形成通孔的方法 Pending CN1672472A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/183,674 US6824959B2 (en) 2002-06-27 2002-06-27 Process for creating holes in polymeric substrates
US10/183,674 2002-06-27

Publications (1)

Publication Number Publication Date
CN1672472A true CN1672472A (zh) 2005-09-21

Family

ID=29779180

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA038178761A Pending CN1672472A (zh) 2002-06-27 2003-06-27 在聚合物基材中形成通孔的方法

Country Status (11)

Country Link
US (1) US6824959B2 (enExample)
EP (1) EP1523868B1 (enExample)
JP (3) JP4411410B2 (enExample)
KR (1) KR100659808B1 (enExample)
CN (1) CN1672472A (enExample)
AU (1) AU2003245746A1 (enExample)
DE (1) DE60317902T2 (enExample)
ES (1) ES2297175T3 (enExample)
MY (1) MY134327A (enExample)
TW (1) TWI228953B (enExample)
WO (1) WO2004004430A1 (enExample)

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US7271697B2 (en) * 2004-12-07 2007-09-18 Multi-Fineline Electronix Miniature circuitry and inductive components and methods for manufacturing same
KR100738055B1 (ko) * 2005-05-18 2007-07-12 삼성에스디아이 주식회사 전자소자의 적층 형성 방법 및 이를 이용한 ｆｅｄ의제조방법
US8008188B2 (en) 2007-06-11 2011-08-30 Ppg Industries Ohio, Inc. Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
US8637778B2 (en) 2010-04-08 2014-01-28 Intel Corporation Debond interconnect structures

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US3469982A (en) 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
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US3984299A (en) 1970-06-19 1976-10-05 Ppg Industries, Inc. Process for electrodepositing cationic compositions
US3738835A (en) 1971-10-21 1973-06-12 Ibm Electrophoretic photoresist composition and a method of forming etch resistant masks
US3947338A (en) 1971-10-28 1976-03-30 Ppg Industries, Inc. Method of electrodepositing self-crosslinking cationic compositions
US3793278A (en) 1972-03-10 1974-02-19 Ppg Industries Inc Method of preparing sulfonium group containing compositions
US3833436A (en) 1972-09-05 1974-09-03 Buckbee Mears Co Etching of polyimide films
DE2707405C3 (de) 1976-07-19 1987-12-03 Vianova Kunstharz Ag, Werndorf Verfahren zur Herstellung von Bindemitteln für die Elektrotauchlackierung
US4343885A (en) 1978-05-09 1982-08-10 Dynachem Corporation Phototropic photosensitive compositions containing fluoran colorformer
JPS5527647A (en) 1978-08-17 1980-02-27 Nippon Telegraph & Telephone Paint for forming insulating film of conductive printed circuit board and method of forming insulating film
ATE1293T1 (de) 1978-12-11 1982-07-15 Shell Internationale Research Maatschappij B.V. Zusammensetzungen auf der basis hitzehaertbarer harzartiger bindemittel, deren herstellung und deren verwendung als ueberzugsmittel.
JPS56136416A (en) * 1980-03-27 1981-10-24 Matsushita Electric Works Ltd Limit switch
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JPS58108229A (ja) 1981-12-21 1983-06-28 Hitachi Ltd ポリイミド系樹脂膜の選択エツチング方法
JPS59133232A (ja) 1983-01-21 1984-07-31 Hitachi Ltd ポリイミドのエツチング方法
GB8327756D0 (en) 1983-10-17 1983-11-16 Ici Plc Extraction process
US4508749A (en) 1983-12-27 1985-04-02 International Business Machines Corporation Patterning of polyimide films with ultraviolet light
US4592816A (en) 1984-09-26 1986-06-03 Rohm And Haas Company Electrophoretic deposition process
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JPH0287590A (ja) 1988-09-22 1990-03-28 Shindo Denshi Kogyo Kk フイルム回路基板の貫通穴形成方法
US5242713A (en) 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
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JPH04355990A (ja) 1990-09-18 1992-12-09 Fujitsu Ltd 回路基板およびその製造方法
US5229550A (en) 1990-10-30 1993-07-20 International Business Machines Corporation Encapsulated circuitized power core alignment and lamination
US5298685A (en) 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5153986A (en) 1991-07-17 1992-10-13 International Business Machines Method for fabricating metal core layers for a multi-layer circuit board
US5242780A (en) 1991-10-18 1993-09-07 Industrial Technology Research Institute Electrophoretic positive working photosensitive composition comprising as the photosensitive ingredient an aliphatic polyester having o-quinone diazide on the side chain and end groups
US5227008A (en) 1992-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method for making flexible circuits
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JPH05320313A (ja) 1992-05-27 1993-12-03 Murata Mfg Co Ltd 電子部品封止用樹脂組成物
JPH05343837A (ja) 1992-06-05 1993-12-24 Taiyo Ink Mfg Ltd ソルダーレジストインキ組成物及びソルダーレジストパターン形成方法
JPH06268378A (ja) 1993-03-12 1994-09-22 Oki Electric Ind Co Ltd 多層配線基板のビアホールの形成方法
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JP4685236B2 (ja) * 2000-12-13 2011-05-18 三菱レイヨン株式会社 熱硬化性被覆組成物

Also Published As

Publication number Publication date
KR100659808B1 (ko) 2006-12-19
JP4411410B2 (ja) 2010-02-10
AU2003245746A1 (en) 2004-01-19
TWI228953B (en) 2005-03-01
EP1523868A1 (en) 2005-04-20
US20040000426A1 (en) 2004-01-01
JP2005531162A (ja) 2005-10-13
WO2004004430A1 (en) 2004-01-08
DE60317902D1 (de) 2008-01-17
JP2010118708A (ja) 2010-05-27
DE60317902T2 (de) 2008-10-23
KR20050006301A (ko) 2005-01-15
ES2297175T3 (es) 2008-05-01
MY134327A (en) 2007-12-31
US6824959B2 (en) 2004-11-30
JP2007027786A (ja) 2007-02-01
EP1523868B1 (en) 2007-12-05
TW200414848A (en) 2004-08-01

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