JP2006522197A5 - - Google Patents

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Publication number
JP2006522197A5
JP2006522197A5 JP2006506050A JP2006506050A JP2006522197A5 JP 2006522197 A5 JP2006522197 A5 JP 2006522197A5 JP 2006506050 A JP2006506050 A JP 2006506050A JP 2006506050 A JP2006506050 A JP 2006506050A JP 2006522197 A5 JP2006522197 A5 JP 2006522197A5
Authority
JP
Japan
Prior art keywords
microspheres
adhesive
composition
curing
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006506050A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006522197A (ja
Filing date
Publication date
Priority claimed from GB0307504A external-priority patent/GB0307504D0/en
Priority claimed from GB0325658A external-priority patent/GB0325658D0/en
Application filed filed Critical
Priority claimed from PCT/GB2004/001366 external-priority patent/WO2004087826A2/en
Publication of JP2006522197A publication Critical patent/JP2006522197A/ja
Publication of JP2006522197A5 publication Critical patent/JP2006522197A5/ja
Pending legal-status Critical Current

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JP2006506050A 2003-04-01 2004-03-31 接着界面の接合および剥離のための方法および装置 Pending JP2006522197A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0307504A GB0307504D0 (en) 2003-04-01 2003-04-01 Method and apparatus for bonding and debonding adhesive interface surfaces
GB0325658A GB0325658D0 (en) 2003-11-04 2003-11-04 Method and apparatus for bonding and debonding adhesive interface surfaces
PCT/GB2004/001366 WO2004087826A2 (en) 2003-04-01 2004-03-31 Method and apparatus for bonding and debonding adhesive interface surfaces

Publications (2)

Publication Number Publication Date
JP2006522197A JP2006522197A (ja) 2006-09-28
JP2006522197A5 true JP2006522197A5 (enExample) 2007-05-24

Family

ID=33133142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006506050A Pending JP2006522197A (ja) 2003-04-01 2004-03-31 接着界面の接合および剥離のための方法および装置

Country Status (11)

Country Link
US (1) US7901532B2 (enExample)
EP (1) EP1608717B2 (enExample)
JP (1) JP2006522197A (enExample)
KR (1) KR20050116838A (enExample)
AT (1) ATE464362T1 (enExample)
DE (1) DE602004026564D1 (enExample)
DK (1) DK1608717T3 (enExample)
ES (1) ES2343888T3 (enExample)
MX (1) MXPA05010694A (enExample)
PL (1) PL1608717T3 (enExample)
WO (1) WO2004087826A2 (enExample)

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