JP2006522197A - 接着界面の接合および剥離のための方法および装置 - Google Patents
接着界面の接合および剥離のための方法および装置 Download PDFInfo
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- JP2006522197A JP2006522197A JP2006506050A JP2006506050A JP2006522197A JP 2006522197 A JP2006522197 A JP 2006522197A JP 2006506050 A JP2006506050 A JP 2006506050A JP 2006506050 A JP2006506050 A JP 2006506050A JP 2006522197 A JP2006522197 A JP 2006522197A
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- microspheres
- adhesive
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- curing
- microsphere
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/919—Delaminating in preparation for post processing recycling step
- Y10S156/927—Delaminating vehicle component, e.g. brake pad
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/195—Delaminating roller means
- Y10T156/1956—Roller pair delaminating means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0307504A GB0307504D0 (en) | 2003-04-01 | 2003-04-01 | Method and apparatus for bonding and debonding adhesive interface surfaces |
| GB0325658A GB0325658D0 (en) | 2003-11-04 | 2003-11-04 | Method and apparatus for bonding and debonding adhesive interface surfaces |
| PCT/GB2004/001366 WO2004087826A2 (en) | 2003-04-01 | 2004-03-31 | Method and apparatus for bonding and debonding adhesive interface surfaces |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006522197A true JP2006522197A (ja) | 2006-09-28 |
| JP2006522197A5 JP2006522197A5 (enExample) | 2007-05-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006506050A Pending JP2006522197A (ja) | 2003-04-01 | 2004-03-31 | 接着界面の接合および剥離のための方法および装置 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US7901532B2 (enExample) |
| EP (1) | EP1608717B2 (enExample) |
| JP (1) | JP2006522197A (enExample) |
| KR (1) | KR20050116838A (enExample) |
| AT (1) | ATE464362T1 (enExample) |
| DE (1) | DE602004026564D1 (enExample) |
| DK (1) | DK1608717T3 (enExample) |
| ES (1) | ES2343888T3 (enExample) |
| MX (1) | MXPA05010694A (enExample) |
| PL (1) | PL1608717T3 (enExample) |
| WO (1) | WO2004087826A2 (enExample) |
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| JP2013159743A (ja) * | 2012-02-07 | 2013-08-19 | Nitto Denko Corp | 粘着剤積層物の剥離方法およびそれに用いる粘着剤層 |
| JP5548133B2 (ja) * | 2008-10-14 | 2014-07-16 | リンテック株式会社 | 接合体、ルーフ構造体、それに用いる積層シート及び積層シートの使用方法 |
| JP2020524695A (ja) * | 2017-06-23 | 2020-08-20 | プロドゥイ デンタイル ピエール ロラン | 歯科用接着剤 |
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| JP2008142674A (ja) * | 2006-12-13 | 2008-06-26 | Fujitsu Ltd | 電子機器及び電子機器の解体方法 |
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- 2004-03-31 US US10/551,335 patent/US7901532B2/en not_active Expired - Fee Related
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| JPH05311134A (ja) * | 1992-05-07 | 1993-11-22 | Nitto Denko Corp | 高周波加熱型接着剤 |
| JPH11286645A (ja) * | 1998-04-03 | 1999-10-19 | Matsui Shikiso Chem Co Ltd | 点描着色用着色粒子 |
| JP2003501544A (ja) * | 1999-06-02 | 2003-01-14 | ベイン,ピーター・スチュワート | 熱膨張性のマイクロカプセルを含んでなる接着用の組成物 |
| JP2002080817A (ja) * | 2000-09-04 | 2002-03-22 | Three M Innovative Properties Co | 架橋型発泡粘着剤及びその製造方法 |
| JP2002127290A (ja) * | 2000-10-23 | 2002-05-08 | Matsushita Electric Works Ltd | 再剥離可能な積層体およびその再剥離方法 |
| JP2002146087A (ja) * | 2000-11-15 | 2002-05-22 | Tokai Kogyo Co Ltd | 装飾体及びその製造方法 |
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| JP5548133B2 (ja) * | 2008-10-14 | 2014-07-16 | リンテック株式会社 | 接合体、ルーフ構造体、それに用いる積層シート及び積層シートの使用方法 |
| JP2012037024A (ja) * | 2010-08-11 | 2012-02-23 | Hitachi Plant Technologies Ltd | 配管用モジュール向け仮設部材の施工方法及び配管モジュールの搬送方法 |
| JP2013159743A (ja) * | 2012-02-07 | 2013-08-19 | Nitto Denko Corp | 粘着剤積層物の剥離方法およびそれに用いる粘着剤層 |
| JP2020524695A (ja) * | 2017-06-23 | 2020-08-20 | プロドゥイ デンタイル ピエール ロラン | 歯科用接着剤 |
| JP7242568B2 (ja) | 2017-06-23 | 2023-03-20 | プロドゥイ デンタイル ピエール ロラン | 歯科用接着剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| PL1608717T3 (pl) | 2010-09-30 |
| EP1608717A2 (en) | 2005-12-28 |
| EP1608717B2 (en) | 2013-05-15 |
| WO2004087826A3 (en) | 2005-02-10 |
| ES2343888T3 (es) | 2010-08-12 |
| MXPA05010694A (es) | 2006-04-18 |
| KR20050116838A (ko) | 2005-12-13 |
| US7901532B2 (en) | 2011-03-08 |
| DK1608717T3 (da) | 2010-07-19 |
| WO2004087826A2 (en) | 2004-10-14 |
| DE602004026564D1 (de) | 2010-05-27 |
| ATE464362T1 (de) | 2010-04-15 |
| US20060219350A1 (en) | 2006-10-05 |
| EP1608717B1 (en) | 2010-04-14 |
| WO2004087826A9 (en) | 2009-07-30 |
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