JP2006516361A5 - - Google Patents

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Publication number
JP2006516361A5
JP2006516361A5 JP2006500897A JP2006500897A JP2006516361A5 JP 2006516361 A5 JP2006516361 A5 JP 2006516361A5 JP 2006500897 A JP2006500897 A JP 2006500897A JP 2006500897 A JP2006500897 A JP 2006500897A JP 2006516361 A5 JP2006516361 A5 JP 2006516361A5
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JP
Japan
Prior art keywords
window frame
flange
semiconductor package
gold
melting temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006500897A
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English (en)
Japanese (ja)
Other versions
JP4466645B2 (ja
JP2006516361A (ja
Filing date
Publication date
Priority claimed from US10/339,834 external-priority patent/US7298046B2/en
Application filed filed Critical
Publication of JP2006516361A publication Critical patent/JP2006516361A/ja
Publication of JP2006516361A5 publication Critical patent/JP2006516361A5/ja
Application granted granted Critical
Publication of JP4466645B2 publication Critical patent/JP4466645B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006500897A 2003-01-10 2004-01-09 非セラミック系窓枠を有する半導体パッケージ Expired - Fee Related JP4466645B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/339,834 US7298046B2 (en) 2003-01-10 2003-01-10 Semiconductor package having non-ceramic based window frame
PCT/US2004/000621 WO2004064120A2 (en) 2003-01-10 2004-01-09 Semiconductor package having non-ceramic based window frame

Publications (3)

Publication Number Publication Date
JP2006516361A JP2006516361A (ja) 2006-06-29
JP2006516361A5 true JP2006516361A5 (enExample) 2007-09-20
JP4466645B2 JP4466645B2 (ja) 2010-05-26

Family

ID=32711185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006500897A Expired - Fee Related JP4466645B2 (ja) 2003-01-10 2004-01-09 非セラミック系窓枠を有する半導体パッケージ

Country Status (9)

Country Link
US (2) US7298046B2 (enExample)
EP (1) EP1584101B1 (enExample)
JP (1) JP4466645B2 (enExample)
KR (1) KR101015749B1 (enExample)
CN (1) CN101080800B (enExample)
AT (1) ATE515053T1 (enExample)
CA (1) CA2512845C (enExample)
IL (1) IL169543A (enExample)
WO (1) WO2004064120A2 (enExample)

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CN109037161A (zh) * 2018-06-15 2018-12-18 华为技术有限公司 一种法兰和半导体功率器件
CN112352309B (zh) * 2018-06-28 2023-10-10 京瓷株式会社 基体以及半导体装置
CN114582826A (zh) * 2020-11-30 2022-06-03 上海华为技术有限公司 一种封装结构、封装方法

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