JP2006516361A - 非セラミック系窓枠を有する半導体パッケージ - Google Patents
非セラミック系窓枠を有する半導体パッケージ Download PDFInfo
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- JP2006516361A JP2006516361A JP2006500897A JP2006500897A JP2006516361A JP 2006516361 A JP2006516361 A JP 2006516361A JP 2006500897 A JP2006500897 A JP 2006500897A JP 2006500897 A JP2006500897 A JP 2006500897A JP 2006516361 A JP2006516361 A JP 2006516361A
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- window frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Abstract
Description
Claims (14)
- 半導体パッケージであって、ファイバまたは他の幾何学的配列の充てん剤で充てんされた主に有機材料のマトリクスを含む非セラミック系材料からなる窓枠を含む半導体パッケージ。
- 前記マトリクスが、ポリテトラフルオロエチレン及びエポキシから成るグループから選択され、前記充てん剤が、ガラス、セラミックファイバ及び他の幾何学的配列形状から成るグループから選択されていることを特徴とする請求項1記載の半導体パッケージ。
- 前記非セラミック系材料が、金属で被覆されていることを特徴とする請求項1記載の半導体パッケージ。
- 前記金属が、銅及びアルミニウムから成るグループから選択されていることを特徴とする請求項3記載の半導体パッケージ。
- 前記窓枠がその上にマウントされたフランジと、前記窓枠上にマウントされた複数のリードと、前記窓枠の開口部内で前記フランジ上にマウントされて前記複数のリードに電気的に結合されているダイと、をさらに含む請求項1記載の半導体パッケージ。
- フランジと、前記フランジ上にマウントされた非セラミック系材料からなる窓枠と、前記窓枠上にマウントされたリードと、を含み、前記窓枠がファイバで充てんされた主に有機材料のマトリクスを含む半導体パッケージ。
- 前記窓枠が前記エポキシを用いて前記フランジに結合されていることを特徴とする請求項6記載の半導体パッケージ。
- 前記窓枠がファイバで充てんされて金属で被覆されたポリテトラフルオロエチレンのマトリクスでできていることを特徴とする請求項6記載の半導体パッケージ。
- 前記窓枠が銅で被覆され、前記フランジ及び前記リード線のうちの少なくとも1つが前記窓枠の前記銅被覆の一部であることを特徴とする請求項8記載の半導体パッケージ。
- 該金属被覆加工が、ニッケル及び/または金のめっきによってなされ、前記窓枠が前記フランジ及び前記リードにろう付け/はんだ付け/接着剤を用いてろう付けされていることを特徴とする請求項8記載の半導体パッケージ。
- 前記金/ゲルマニウムはんだが所定の融解温度を有し、前記金/ゲルマニウムはんだの前記所定の融解温度より低い融解温度を有する金/スズ混合物で前記フランジに結合されるダイをさらに含むことを特徴とする請求項11記載の半導体パッケージ。
- 半導体パッケージであって、平らな上面を有するフランジと、その中心部分において前記平らな上面から上方へ延びかつ前記フランジ上でダイをマウントするダイ取付領域を画定するペデスタルと、を含む半導体パッケージ。
- ろう付け材料層によって前記フランジ上にマウントされた窓枠をさらに含み、前記ペデスタルが前記ダイ取付領域の周囲で前記ろう付け材料に対するバリアを形成することを特徴とする請求項12記載の半導体パッケージ。
- 前記窓枠が、前記フランジ上にマウントされるべき少なくとも1つのダイを受ける開口部を有し、前記ペデスタルが前記フランジの前記中心部分において高くなった部分を含み前記高くなった部分が前記窓枠の前記開口部内で適合するよう構成されていることを特徴とする請求項13記載の半導体パッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/339,834 US7298046B2 (en) | 2003-01-10 | 2003-01-10 | Semiconductor package having non-ceramic based window frame |
PCT/US2004/000621 WO2004064120A2 (en) | 2003-01-10 | 2004-01-09 | Semiconductor package having non-ceramic based window frame |
Publications (3)
Publication Number | Publication Date |
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JP2006516361A true JP2006516361A (ja) | 2006-06-29 |
JP2006516361A5 JP2006516361A5 (ja) | 2007-09-20 |
JP4466645B2 JP4466645B2 (ja) | 2010-05-26 |
Family
ID=32711185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006500897A Expired - Fee Related JP4466645B2 (ja) | 2003-01-10 | 2004-01-09 | 非セラミック系窓枠を有する半導体パッケージ |
Country Status (10)
Country | Link |
---|---|
US (2) | US7298046B2 (ja) |
EP (1) | EP1584101B1 (ja) |
JP (1) | JP4466645B2 (ja) |
KR (1) | KR101015749B1 (ja) |
CN (1) | CN101080800B (ja) |
AT (1) | ATE515053T1 (ja) |
CA (1) | CA2512845C (ja) |
HK (1) | HK1082591A1 (ja) |
IL (1) | IL169543A (ja) |
WO (1) | WO2004064120A2 (ja) |
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-
2003
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2014156029A1 (ja) * | 2013-03-28 | 2017-02-16 | パナソニックIpマネジメント株式会社 | 半導体パッケージおよび半導体デバイス |
Also Published As
Publication number | Publication date |
---|---|
JP4466645B2 (ja) | 2010-05-26 |
CN101080800B (zh) | 2012-02-22 |
EP1584101A4 (en) | 2008-11-26 |
CN101080800A (zh) | 2007-11-28 |
US7298046B2 (en) | 2007-11-20 |
US20040195662A1 (en) | 2004-10-07 |
KR101015749B1 (ko) | 2011-02-22 |
IL169543A0 (en) | 2007-07-04 |
US7582964B2 (en) | 2009-09-01 |
US20080142963A1 (en) | 2008-06-19 |
CA2512845C (en) | 2012-07-03 |
EP1584101B1 (en) | 2011-06-29 |
ATE515053T1 (de) | 2011-07-15 |
WO2004064120A2 (en) | 2004-07-29 |
WO2004064120A3 (en) | 2005-09-01 |
EP1584101A2 (en) | 2005-10-12 |
IL169543A (en) | 2016-06-30 |
HK1082591A1 (en) | 2006-06-09 |
KR20050105168A (ko) | 2005-11-03 |
CA2512845A1 (en) | 2004-07-29 |
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