HK1082591A1 - Semiconductor package having non-ceramic based window frame - Google Patents
Semiconductor package having non-ceramic based window frameInfo
- Publication number
- HK1082591A1 HK1082591A1 HK06104050.3A HK06104050A HK1082591A1 HK 1082591 A1 HK1082591 A1 HK 1082591A1 HK 06104050 A HK06104050 A HK 06104050A HK 1082591 A1 HK1082591 A1 HK 1082591A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- window frame
- flange
- ceramic based
- semiconductor package
- die
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/339,834 US7298046B2 (en) | 2003-01-10 | 2003-01-10 | Semiconductor package having non-ceramic based window frame |
PCT/US2004/000621 WO2004064120A2 (en) | 2003-01-10 | 2004-01-09 | Semiconductor package having non-ceramic based window frame |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1082591A1 true HK1082591A1 (en) | 2006-06-09 |
Family
ID=32711185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06104050.3A HK1082591A1 (en) | 2003-01-10 | 2006-04-03 | Semiconductor package having non-ceramic based window frame |
Country Status (10)
Country | Link |
---|---|
US (2) | US7298046B2 (ja) |
EP (1) | EP1584101B1 (ja) |
JP (1) | JP4466645B2 (ja) |
KR (1) | KR101015749B1 (ja) |
CN (1) | CN101080800B (ja) |
AT (1) | ATE515053T1 (ja) |
CA (1) | CA2512845C (ja) |
HK (1) | HK1082591A1 (ja) |
IL (1) | IL169543A (ja) |
WO (1) | WO2004064120A2 (ja) |
Families Citing this family (23)
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US20070175660A1 (en) * | 2006-01-27 | 2007-08-02 | Yeung Betty H | Warpage-reducing packaging design |
ATE397647T1 (de) * | 2006-03-06 | 2008-06-15 | Umicore Ag & Co Kg | Zusammensetzung zur befestigung von hochleistungshalbleiter |
US20080006204A1 (en) * | 2006-07-06 | 2008-01-10 | General Electric Company | Corrosion resistant wafer processing apparatus and method for making thereof |
US20080016684A1 (en) * | 2006-07-06 | 2008-01-24 | General Electric Company | Corrosion resistant wafer processing apparatus and method for making thereof |
US7961470B2 (en) * | 2006-07-19 | 2011-06-14 | Infineon Technologies Ag | Power amplifier |
US7952188B2 (en) * | 2007-01-08 | 2011-05-31 | Infineon Technologies Ag | Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip |
CN101399237B (zh) * | 2008-10-24 | 2010-06-02 | 江阴市赛英电子有限公司 | 全压接快速散热型陶瓷外壳 |
US20100139885A1 (en) * | 2008-12-09 | 2010-06-10 | Renewable Thermodynamics, Llc | Sintered diamond heat exchanger apparatus |
WO2011119891A2 (en) * | 2010-03-25 | 2011-09-29 | Anwar Abdul Mohammed | High performance low cost open air cavity ceramic power packages for high temperature die attach processes |
US8907467B2 (en) | 2012-03-28 | 2014-12-09 | Infineon Technologies Ag | PCB based RF-power package window frame |
JP6296687B2 (ja) | 2012-04-27 | 2018-03-20 | キヤノン株式会社 | 電子部品、電子モジュールおよびこれらの製造方法。 |
JP5885690B2 (ja) | 2012-04-27 | 2016-03-15 | キヤノン株式会社 | 電子部品および電子機器 |
EP2757582A1 (en) * | 2013-01-17 | 2014-07-23 | Nxp B.V. | Packaged electrical components |
US9879722B2 (en) * | 2013-03-11 | 2018-01-30 | Bell Helicopter Textron Inc. | Low shear modulus transition shim for elastomeric bearing bonding in torsional applications |
WO2014156029A1 (ja) * | 2013-03-28 | 2014-10-02 | パナソニック株式会社 | 半導体パッケージおよび半導体デバイス |
US10468399B2 (en) | 2015-03-31 | 2019-11-05 | Cree, Inc. | Multi-cavity package having single metal flange |
US9629246B2 (en) | 2015-07-28 | 2017-04-18 | Infineon Technologies Ag | PCB based semiconductor package having integrated electrical functionality |
US9997476B2 (en) | 2015-10-30 | 2018-06-12 | Infineon Technologies Ag | Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange |
US10225922B2 (en) | 2016-02-18 | 2019-03-05 | Cree, Inc. | PCB based semiconductor package with impedance matching network elements integrated therein |
US10332847B2 (en) * | 2017-06-01 | 2019-06-25 | Infineon Technologies Ag | Semiconductor package with integrated harmonic termination feature |
CN109037161A (zh) * | 2018-06-15 | 2018-12-18 | 华为技术有限公司 | 一种法兰和半导体功率器件 |
JP7083898B2 (ja) * | 2018-06-28 | 2022-06-13 | 京セラ株式会社 | 基体および半導体装置 |
CN114582826A (zh) * | 2020-11-30 | 2022-06-03 | 上海华为技术有限公司 | 一种封装结构、封装方法 |
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US4784974A (en) * | 1982-08-05 | 1988-11-15 | Olin Corporation | Method of making a hermetically sealed semiconductor casing |
JPS59214243A (ja) * | 1983-05-20 | 1984-12-04 | Nec Corp | 半導体装置 |
US4725347A (en) * | 1986-05-02 | 1988-02-16 | The Dow Chemical Company | Reinforced bipolar electrolytic cell frame |
JPS63109104A (ja) * | 1986-10-28 | 1988-05-13 | Nippon Steel Corp | チタンの積層鋼板の製造方法 |
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-
2003
- 2003-01-10 US US10/339,834 patent/US7298046B2/en not_active Expired - Lifetime
-
2004
- 2004-01-09 EP EP04701262A patent/EP1584101B1/en not_active Expired - Lifetime
- 2004-01-09 JP JP2006500897A patent/JP4466645B2/ja not_active Expired - Fee Related
- 2004-01-09 KR KR1020057012830A patent/KR101015749B1/ko active IP Right Grant
- 2004-01-09 CA CA2512845A patent/CA2512845C/en not_active Expired - Fee Related
- 2004-01-09 AT AT04701262T patent/ATE515053T1/de not_active IP Right Cessation
- 2004-01-09 CN CN2004800035768A patent/CN101080800B/zh not_active Expired - Fee Related
- 2004-01-09 WO PCT/US2004/000621 patent/WO2004064120A2/en active Search and Examination
-
2005
- 2005-07-05 IL IL169543A patent/IL169543A/en active IP Right Grant
-
2006
- 2006-04-03 HK HK06104050.3A patent/HK1082591A1/xx not_active IP Right Cessation
-
2007
- 2007-11-19 US US11/942,675 patent/US7582964B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1584101B1 (en) | 2011-06-29 |
JP4466645B2 (ja) | 2010-05-26 |
KR20050105168A (ko) | 2005-11-03 |
US7298046B2 (en) | 2007-11-20 |
IL169543A (en) | 2016-06-30 |
IL169543A0 (en) | 2007-07-04 |
WO2004064120A2 (en) | 2004-07-29 |
CN101080800A (zh) | 2007-11-28 |
EP1584101A4 (en) | 2008-11-26 |
ATE515053T1 (de) | 2011-07-15 |
US7582964B2 (en) | 2009-09-01 |
CN101080800B (zh) | 2012-02-22 |
CA2512845A1 (en) | 2004-07-29 |
EP1584101A2 (en) | 2005-10-12 |
US20040195662A1 (en) | 2004-10-07 |
CA2512845C (en) | 2012-07-03 |
KR101015749B1 (ko) | 2011-02-22 |
US20080142963A1 (en) | 2008-06-19 |
JP2006516361A (ja) | 2006-06-29 |
WO2004064120A3 (en) | 2005-09-01 |
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