JP4730181B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP4730181B2 JP4730181B2 JP2006107161A JP2006107161A JP4730181B2 JP 4730181 B2 JP4730181 B2 JP 4730181B2 JP 2006107161 A JP2006107161 A JP 2006107161A JP 2006107161 A JP2006107161 A JP 2006107161A JP 4730181 B2 JP4730181 B2 JP 4730181B2
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- Prior art keywords
- solder
- freezing point
- semiconductor
- semiconductor element
- conductor member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- Die Bonding (AREA)
Description
図8(a)は、本発明の他の実施形態にかかる半導体装置の要部の概略断面構成を示す図であり、図8(b)は(a)に示される構成の形成方法を示す概略断面図である。なお、この図8(a)において、図示しない部分は上記第1実施形態の半導体装置と同様である。
21…第1の導体部材としての第1のリード、21a…突起、
22…第2の導体部材としてのターミナル、
23…第3の導体部材としての第3のリード、
31…第1のはんだ、32…第2のはんだ、33…第3のはんだ。
Claims (4)
- 第1の導体部材(21)の上に第1のはんだ(31)を介して半導体素子(11、12)を搭載し、この半導体素子(11、12)の上に第2のはんだ(32)を介して第2の導体部材(22)を搭載した状態で、前記第1および第2のはんだ(31、32)をリフローさせることにより、前記半導体素子(11、12)と前記両導体部材(21、22)とをはんだ接続するようにした半導体装置において、
前記第1のはんだ(31)の凝固点が、前記第2のはんだ(32)の凝固点よりも低いものであり、
前記第1の導体部材(21)の上面のうち前記半導体素子(11、12)の端部が重なる部位には、前記第1のはんだ(31)を盛り上げる突起(21a)が設けられていることを特徴とする半導体装置。 - 前記第1の導体部材(21)の上面のうち前記突起(21a)よりも前記半導体素子(11、12)の端部の外側に位置する部位には、溝部(21b)が設けられていることを特徴とする請求項1に記載の半導体装置。
- 前記半導体素子(11、12)の厚さは150μm以内であることを特徴とする請求項1または2に記載の半導体装置。
- 前記第2の導体部材(22)の上に第3のはんだ(33)を介して第3の導体部材(23)がはんだ接続されており、
前記第3のはんだ(33)の凝固点は、前記第1のはんだ(31)の凝固点および前記第2のはんだ(32)の凝固点よりも低いことを特徴とする請求項1ないし3のいずれか1つに記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006107161A JP4730181B2 (ja) | 2006-04-10 | 2006-04-10 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006107161A JP4730181B2 (ja) | 2006-04-10 | 2006-04-10 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007281274A JP2007281274A (ja) | 2007-10-25 |
JP4730181B2 true JP4730181B2 (ja) | 2011-07-20 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2006107161A Expired - Fee Related JP4730181B2 (ja) | 2006-04-10 | 2006-04-10 | 半導体装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4730181B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017203024A1 (de) | 2016-03-18 | 2017-09-21 | Fuji Electric Co., Ltd. | Leistungshalbleitermodul |
US10916491B2 (en) | 2017-09-15 | 2021-02-09 | Fuji Electric Co., Ltd. | Semiconductor module |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2010004609A1 (ja) * | 2008-07-07 | 2011-12-22 | 三菱電機株式会社 | 電力用半導体装置 |
JP2010225720A (ja) | 2009-03-23 | 2010-10-07 | Mitsubishi Electric Corp | パワーモジュール |
JP5709299B2 (ja) | 2010-09-29 | 2015-04-30 | ローム株式会社 | 半導体パワーモジュールおよびその製造方法 |
FR3012719B1 (fr) * | 2013-10-30 | 2017-04-14 | Compagnie Ind Et Financiere Dingenierie Ingenico | Support entrant dans la fabrication d'un dispositif electronique, connecteur de carte a memoire, terminal de lecture de carte a memoire et procede de fabrication correspondants |
JP6314433B2 (ja) * | 2013-11-12 | 2018-04-25 | 株式会社デンソー | 半導体装置及びその製造方法 |
JP2014135527A (ja) * | 2014-04-30 | 2014-07-24 | Rohm Co Ltd | 半導体パワーモジュールおよびその製造方法 |
JP6354954B2 (ja) * | 2015-05-15 | 2018-07-11 | トヨタ自動車株式会社 | 半導体装置の製造方法及び半導体装置 |
JP6586970B2 (ja) * | 2017-03-09 | 2019-10-09 | トヨタ自動車株式会社 | 半導体装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52127160A (en) * | 1976-04-19 | 1977-10-25 | Toshiba Corp | Semiconductor device |
JPH08139243A (ja) * | 1994-11-07 | 1996-05-31 | Rohm Co Ltd | 半導体装置の製造方法 |
JP2001274177A (ja) * | 2000-03-24 | 2001-10-05 | Denso Corp | 半導体装置及びその製造方法 |
-
2006
- 2006-04-10 JP JP2006107161A patent/JP4730181B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52127160A (en) * | 1976-04-19 | 1977-10-25 | Toshiba Corp | Semiconductor device |
JPH08139243A (ja) * | 1994-11-07 | 1996-05-31 | Rohm Co Ltd | 半導体装置の製造方法 |
JP2001274177A (ja) * | 2000-03-24 | 2001-10-05 | Denso Corp | 半導体装置及びその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017203024A1 (de) | 2016-03-18 | 2017-09-21 | Fuji Electric Co., Ltd. | Leistungshalbleitermodul |
US9881879B2 (en) | 2016-03-18 | 2018-01-30 | Fuji Electric Co., Ltd. | Power semiconductor module |
DE102017203024B4 (de) | 2016-03-18 | 2023-07-06 | Fuji Electric Co., Ltd. | Leistungshalbleitermodul |
US10916491B2 (en) | 2017-09-15 | 2021-02-09 | Fuji Electric Co., Ltd. | Semiconductor module |
Also Published As
Publication number | Publication date |
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JP2007281274A (ja) | 2007-10-25 |
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