JP2006509917A5 - - Google Patents
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- Publication number
- JP2006509917A5 JP2006509917A5 JP2004564876A JP2004564876A JP2006509917A5 JP 2006509917 A5 JP2006509917 A5 JP 2006509917A5 JP 2004564876 A JP2004564876 A JP 2004564876A JP 2004564876 A JP2004564876 A JP 2004564876A JP 2006509917 A5 JP2006509917 A5 JP 2006509917A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- linked
- solution
- perfluoroalkanesulfonyl
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010949 copper Substances 0.000 claims 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 29
- 229910052802 copper Inorganic materials 0.000 claims 29
- 239000000243 solution Substances 0.000 claims 25
- 239000000758 substrate Substances 0.000 claims 16
- 239000002904 solvent Substances 0.000 claims 13
- 125000002015 acyclic group Chemical group 0.000 claims 10
- 125000004122 cyclic group Chemical group 0.000 claims 10
- 238000009713 electroplating Methods 0.000 claims 10
- 125000005842 heteroatom Chemical group 0.000 claims 10
- 229910052757 nitrogen Inorganic materials 0.000 claims 10
- 229910052760 oxygen Inorganic materials 0.000 claims 10
- 229910052717 sulfur Inorganic materials 0.000 claims 10
- 150000003949 imides Chemical class 0.000 claims 9
- 239000003054 catalyst Substances 0.000 claims 8
- 238000000151 deposition Methods 0.000 claims 8
- 238000007747 plating Methods 0.000 claims 8
- 125000004432 carbon atom Chemical group C* 0.000 claims 7
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims 7
- 239000007983 Tris buffer Substances 0.000 claims 6
- LGRLWUINFJPLSH-UHFFFAOYSA-N methanide Chemical compound [CH3-] LGRLWUINFJPLSH-UHFFFAOYSA-N 0.000 claims 6
- 239000003638 chemical reducing agent Substances 0.000 claims 4
- 150000002500 ions Chemical class 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 claims 3
- 239000002253 acid Substances 0.000 claims 3
- 239000000654 additive Substances 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 238000007772 electroless plating Methods 0.000 claims 3
- 125000003118 aryl group Chemical group 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 2
- 125000005525 methide group Chemical group 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/320,263 US7147767B2 (en) | 2002-12-16 | 2002-12-16 | Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
| PCT/US2003/035398 WO2004061162A1 (en) | 2002-12-16 | 2003-11-07 | Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006509917A JP2006509917A (ja) | 2006-03-23 |
| JP2006509917A5 true JP2006509917A5 (https=) | 2006-12-21 |
Family
ID=32506836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004564876A Pending JP2006509917A (ja) | 2002-12-16 | 2003-11-07 | 銅配線の電気化学的または化学的沈着のためのメッキ溶液およびその方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7147767B2 (https=) |
| EP (1) | EP1573091A1 (https=) |
| JP (1) | JP2006509917A (https=) |
| KR (1) | KR20050085664A (https=) |
| CN (1) | CN1726310A (https=) |
| AU (1) | AU2003287545A1 (https=) |
| WO (1) | WO2004061162A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7256111B2 (en) * | 2004-01-26 | 2007-08-14 | Applied Materials, Inc. | Pretreatment for electroless deposition |
| JP2005327898A (ja) * | 2004-05-14 | 2005-11-24 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| US20060237319A1 (en) * | 2005-04-22 | 2006-10-26 | Akira Furuya | Planting process and manufacturing process for semiconductor device thereby, and plating apparatus |
| JP4802008B2 (ja) * | 2006-02-16 | 2011-10-26 | ジュズ インターナショナル ピーティーイー エルティーディー | 無電解メッキ液およびメッキ法 |
| US7686875B2 (en) * | 2006-05-11 | 2010-03-30 | Lam Research Corporation | Electroless deposition from non-aqueous solutions |
| US8298325B2 (en) * | 2006-05-11 | 2012-10-30 | Lam Research Corporation | Electroless deposition from non-aqueous solutions |
| KR101135332B1 (ko) * | 2007-03-15 | 2012-04-17 | 닛코킨조쿠 가부시키가이샤 | 구리전해액 및 그것을 이용하여 얻어진 2층 플렉시블 기판 |
| TWI341554B (en) * | 2007-08-02 | 2011-05-01 | Enthone | Copper metallization of through silicon via |
| US9439293B2 (en) | 2007-11-21 | 2016-09-06 | Xerox Corporation | Galvanic process for making printed conductive metal markings for chipless RFID applications |
| DE502008002080D1 (de) * | 2008-06-02 | 2011-02-03 | Autotech Deutschland Gmbh | Pyrophosphathaltiges Bad zur cyanidfreien Abscheidung von Kupfer-Zinn-Legierungen |
| CN104195602B (zh) * | 2009-04-07 | 2017-05-31 | 巴斯夫欧洲公司 | 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物 |
| CN102256440A (zh) * | 2010-05-20 | 2011-11-23 | 姚富翔 | 铝基电路板、其制备方法与供该方法使用的电镀液 |
| CN104120463B (zh) * | 2014-06-25 | 2016-06-22 | 济南大学 | 钢铁基体的一种无氰亚铜电镀铜表面改性方法 |
| TWI606140B (zh) * | 2015-12-25 | 2017-11-21 | Electroless copper plating bath and electroless copper plating method for increasing hardness of copper plating | |
| US10184189B2 (en) | 2016-07-18 | 2019-01-22 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
| JP2018104739A (ja) * | 2016-12-22 | 2018-07-05 | ローム・アンド・ハース電子材料株式会社 | 無電解めっき方法 |
| CN109208041B (zh) * | 2018-09-18 | 2020-06-02 | 山东金宝电子股份有限公司 | 一种高性能超薄双面光铜箔制备用添加剂 |
| US11842958B2 (en) * | 2022-03-18 | 2023-12-12 | Chun-Ming Lin | Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure |
| US12087662B1 (en) | 2023-06-12 | 2024-09-10 | Chun-Ming Lin | Semiconductor package structure having thermal management structure |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0419845A3 (en) | 1989-09-05 | 1991-11-13 | General Electric Company | Method for preparing metallized polyimide composites |
| DE4217366A1 (de) * | 1992-05-26 | 1993-12-02 | Bayer Ag | Imide und deren Salze sowie deren Verwendung |
| DE4333385C2 (de) * | 1993-09-30 | 1997-01-30 | Friedrich A Spruegel | Flächendesinfektions- und Reinigungsmittel |
| US5554664A (en) * | 1995-03-06 | 1996-09-10 | Minnesota Mining And Manufacturing Company | Energy-activatable salts with fluorocarbon anions |
| US5652072A (en) * | 1995-09-21 | 1997-07-29 | Minnesota Mining And Manufacturing Company | Battery containing bis(perfluoroalkylsulfonyl)imide and cyclic perfluoroalkylene disulfonylimide salts |
| US6194317B1 (en) * | 1998-04-30 | 2001-02-27 | 3M Innovative Properties Company | Method of planarizing the upper surface of a semiconductor wafer |
| US6130161A (en) * | 1997-05-30 | 2000-10-10 | International Business Machines Corporation | Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity |
| JPH1192754A (ja) | 1997-09-24 | 1999-04-06 | Cci Corp | ガラス用撥水処理剤 |
| AU7954898A (en) | 1997-12-10 | 1999-06-28 | Minnesota Mining And Manufacturing Company | Bis(perfluoroalkylsulfonyl)imide surfactant salts in electrochemical systems |
| TWI223678B (en) * | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
| US6197696B1 (en) * | 1998-03-26 | 2001-03-06 | Matsushita Electric Industrial Co., Ltd. | Method for forming interconnection structure |
| US6287977B1 (en) * | 1998-07-31 | 2001-09-11 | Applied Materials, Inc. | Method and apparatus for forming improved metal interconnects |
| US6284656B1 (en) * | 1998-08-04 | 2001-09-04 | Micron Technology, Inc. | Copper metallurgy in integrated circuits |
| US6245663B1 (en) * | 1998-09-30 | 2001-06-12 | Conexant Systems, Inc. | IC interconnect structures and methods for making same |
| US6291887B1 (en) * | 1999-01-04 | 2001-09-18 | Advanced Micro Devices, Inc. | Dual damascene arrangements for metal interconnection with low k dielectric constant materials and nitride middle etch stop layer |
| JP4127917B2 (ja) * | 1999-01-29 | 2008-07-30 | 旭化成株式会社 | トリス（パーフルオロアルキルスルホニル）メチドの金属塩 |
| US6369242B2 (en) * | 2000-03-17 | 2002-04-09 | Roche Vitamins Inc. | Tocopherol manufacture by tris(perfluorohydrocarbylsulphonyl) methane or metal methides thereof |
| US6358899B1 (en) * | 2000-03-23 | 2002-03-19 | Ashland, Inc. | Cleaning compositions and use thereof containing ammonium hydroxide and fluorosurfactant |
| JP2001278816A (ja) * | 2000-03-27 | 2001-10-10 | Asahi Kasei Corp | 水系媒体中での反応方法 |
| US6310018B1 (en) | 2000-03-31 | 2001-10-30 | 3M Innovative Properties Company | Fluorinated solvent compositions containing hydrogen fluoride |
| US6372700B1 (en) | 2000-03-31 | 2002-04-16 | 3M Innovative Properties Company | Fluorinated solvent compositions containing ozone |
| TW486801B (en) * | 2000-04-07 | 2002-05-11 | Taiwan Semiconductor Mfg | Method of fabricating dual damascene structure |
| US6291082B1 (en) * | 2000-06-13 | 2001-09-18 | Advanced Micro Devices, Inc. | Method of electroless ag layer formation for cu interconnects |
| AU2002239767A1 (en) | 2000-11-15 | 2002-06-11 | Intel Corporation | Copper alloy interconnections for integrated circuits and methods of making same |
| US6534220B2 (en) * | 2000-12-29 | 2003-03-18 | 3M Innovative Properties Company | High-boiling electrolyte solvent |
| US6555510B2 (en) | 2001-05-10 | 2003-04-29 | 3M Innovative Properties Company | Bis(perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods therefor |
| ITMI20020178A1 (it) | 2002-02-01 | 2003-08-01 | Ausimont Spa | Uso di additivi fluorurati nell'etching o polishing di circuiti integrati |
-
2002
- 2002-12-16 US US10/320,263 patent/US7147767B2/en not_active Expired - Fee Related
-
2003
- 2003-11-07 JP JP2004564876A patent/JP2006509917A/ja active Pending
- 2003-11-07 EP EP03781787A patent/EP1573091A1/en not_active Withdrawn
- 2003-11-07 CN CNA2003801061271A patent/CN1726310A/zh active Pending
- 2003-11-07 AU AU2003287545A patent/AU2003287545A1/en not_active Abandoned
- 2003-11-07 WO PCT/US2003/035398 patent/WO2004061162A1/en not_active Ceased
- 2003-11-07 KR KR1020057010924A patent/KR20050085664A/ko not_active Ceased
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