AU2002239767A1 - Copper alloy interconnections for integrated circuits and methods of making same - Google Patents

Copper alloy interconnections for integrated circuits and methods of making same

Info

Publication number
AU2002239767A1
AU2002239767A1 AU2002239767A AU3976702A AU2002239767A1 AU 2002239767 A1 AU2002239767 A1 AU 2002239767A1 AU 2002239767 A AU2002239767 A AU 2002239767A AU 3976702 A AU3976702 A AU 3976702A AU 2002239767 A1 AU2002239767 A1 AU 2002239767A1
Authority
AU
Australia
Prior art keywords
methods
integrated circuits
copper alloy
making same
alloy interconnections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002239767A
Inventor
Valery M. Dubin
Christopher D. Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2002239767A1 publication Critical patent/AU2002239767A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76849—Barrier, adhesion or liner layers formed in openings in a dielectric the layer being positioned on top of the main fill metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76867—Barrier, adhesion or liner layers characterized by methods of formation other than PVD, CVD or deposition from a liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H01L23/53233—Copper alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AU2002239767A 2000-11-15 2001-10-29 Copper alloy interconnections for integrated circuits and methods of making same Abandoned AU2002239767A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US71400300A 2000-11-15 2000-11-15
US09/714,003 2000-11-15
PCT/US2001/051183 WO2002045142A2 (en) 2000-11-15 2001-10-29 Copper alloy interconnections for integrated circuits and methods of making same

Publications (1)

Publication Number Publication Date
AU2002239767A1 true AU2002239767A1 (en) 2002-06-11

Family

ID=24868422

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002239767A Abandoned AU2002239767A1 (en) 2000-11-15 2001-10-29 Copper alloy interconnections for integrated circuits and methods of making same

Country Status (5)

Country Link
EP (1) EP1338031A2 (en)
CN (1) CN1575508A (en)
AU (1) AU2002239767A1 (en)
TW (1) TWI238459B (en)
WO (1) WO2002045142A2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7074709B2 (en) * 2002-06-28 2006-07-11 Texas Instruments Incorporated Localized doping and/or alloying of metallization for increased interconnect performance
US6841458B2 (en) 2002-09-12 2005-01-11 Intel Corporation Dopant interface formation
WO2004030089A1 (en) * 2002-09-26 2004-04-08 Advanced Micro Devices, Inc. Method of forming a copper interconnect with concentrated alloy atoms at copper-passivation interface
US7147767B2 (en) 2002-12-16 2006-12-12 3M Innovative Properties Company Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
US6858124B2 (en) * 2002-12-16 2005-02-22 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US6884338B2 (en) 2002-12-16 2005-04-26 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
JP4178295B2 (en) * 2004-07-14 2008-11-12 富士通マイクロエレクトロニクス株式会社 Semiconductor device having wiring made of copper and method of manufacturing the same
US7169700B2 (en) * 2004-08-06 2007-01-30 Taiwan Semiconductor Manufacturing Co., Ltd. Metal interconnect features with a doping gradient
DE102005014748B4 (en) * 2005-03-31 2007-02-08 Advanced Micro Devices, Inc., Sunnyvale Technique for electrochemical deposition of a chemical order alloy
JP4589835B2 (en) 2005-07-13 2010-12-01 富士通セミコンダクター株式会社 Semiconductor device manufacturing method and semiconductor device
CN100431106C (en) * 2005-09-26 2008-11-05 财团法人工业技术研究院 Method for forming interconnected electroplating lead wire of nano-carbon tube and metal composite material
EP1845554A3 (en) * 2006-04-10 2011-07-13 Imec A method to create super secondary grain growth in narrow trenches
US7843063B2 (en) 2008-02-14 2010-11-30 International Business Machines Corporation Microstructure modification in copper interconnect structure
DE102008033174B3 (en) * 2008-07-15 2009-09-17 Enthone Inc., West Haven Cyanide-free electrolyte composition for the electrodeposition of a copper layer and method for the deposition of a copper-containing layer
CN102116828B (en) * 2010-12-24 2015-10-28 上海集成电路研发中心有限公司 The defining method of electro-migration lifetime of interconnected lines
JP5667485B2 (en) * 2011-03-17 2015-02-12 ルネサスエレクトロニクス株式会社 Semiconductor device manufacturing method and semiconductor device
CN102956541B (en) * 2011-08-19 2015-11-25 中芯国际集成电路制造(上海)有限公司 A kind of method forming copper-connection
KR20160141875A (en) 2011-11-04 2016-12-09 인텔 코포레이션 Methods and apparatuses to form self-aligned caps
CN114093809A (en) * 2011-11-04 2022-02-25 英特尔公司 Method and apparatus for forming self-aligned caps
US8729702B1 (en) * 2012-11-20 2014-05-20 Stmicroelectronics, Inc. Copper seed layer for an interconnect structure having a doping concentration level gradient
CN103943556A (en) * 2014-04-28 2014-07-23 上海集成电路研发中心有限公司 Method for processing electrocoppering film used for semiconductor copper connection process
CN105845620A (en) * 2015-01-16 2016-08-10 中芯国际集成电路制造(上海)有限公司 Method of making copper interconnection structure, semiconductor device and electronic apparatus
CN111900175A (en) * 2020-07-29 2020-11-06 北海惠科光电技术有限公司 Display panel and manufacturing method thereof
CN118186248A (en) * 2022-12-12 2024-06-14 华为技术有限公司 Copper-based composite material, preparation method thereof, PCB, integrated circuit and electronic equipment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
US6268291B1 (en) * 1995-12-29 2001-07-31 International Business Machines Corporation Method for forming electromigration-resistant structures by doping
US6022808A (en) * 1998-03-16 2000-02-08 Advanced Micro Devices, Inc. Copper interconnect methodology for enhanced electromigration resistance
ATE316426T1 (en) * 1998-06-30 2006-02-15 Semitool Inc METALLIZATION STRUCTURES FOR MICROELECTRONIC APPLICATIONS AND METHOD FOR PRODUCING THESE STRUCTURES
WO2000014306A1 (en) * 1998-09-03 2000-03-16 Ebara Corporation Method for plating substrate and apparatus
US6123825A (en) * 1998-12-02 2000-09-26 International Business Machines Corporation Electromigration-resistant copper microstructure and process of making
KR100385042B1 (en) * 1998-12-03 2003-06-18 인터내셔널 비지네스 머신즈 코포레이션 Method for forming electromigration-resistant structures by doping
US6110817A (en) * 1999-08-19 2000-08-29 Taiwan Semiconductor Manufacturing Company Method for improvement of electromigration of copper by carbon doping
US6387806B1 (en) * 2000-09-06 2002-05-14 Advanced Micro Devices, Inc. Filling an interconnect opening with different types of alloys to enhance interconnect reliability

Also Published As

Publication number Publication date
WO2002045142A9 (en) 2003-02-06
WO2002045142A2 (en) 2002-06-06
CN1575508A (en) 2005-02-02
WO2002045142A3 (en) 2003-06-05
EP1338031A2 (en) 2003-08-27
TWI238459B (en) 2005-08-21

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