CN1726310A - 用于铜互连的电化学或化学沉积的电镀溶液及其方法 - Google Patents

用于铜互连的电化学或化学沉积的电镀溶液及其方法 Download PDF

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Publication number
CN1726310A
CN1726310A CNA2003801061271A CN200380106127A CN1726310A CN 1726310 A CN1726310 A CN 1726310A CN A2003801061271 A CNA2003801061271 A CN A2003801061271A CN 200380106127 A CN200380106127 A CN 200380106127A CN 1726310 A CN1726310 A CN 1726310A
Authority
CN
China
Prior art keywords
copper
acid
plating solution
electrolytic plating
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2003801061271A
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English (en)
Chinese (zh)
Inventor
S·D·博伊德
S·克萨里
W·M·拉曼纳
M·J·帕伦特
L·A·扎哲拉
张海燕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1726310A publication Critical patent/CN1726310A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
CNA2003801061271A 2002-12-16 2003-11-07 用于铜互连的电化学或化学沉积的电镀溶液及其方法 Pending CN1726310A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/320,263 2002-12-16
US10/320,263 US7147767B2 (en) 2002-12-16 2002-12-16 Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor

Publications (1)

Publication Number Publication Date
CN1726310A true CN1726310A (zh) 2006-01-25

Family

ID=32506836

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2003801061271A Pending CN1726310A (zh) 2002-12-16 2003-11-07 用于铜互连的电化学或化学沉积的电镀溶液及其方法

Country Status (7)

Country Link
US (1) US7147767B2 (https=)
EP (1) EP1573091A1 (https=)
JP (1) JP2006509917A (https=)
KR (1) KR20050085664A (https=)
CN (1) CN1726310A (https=)
AU (1) AU2003287545A1 (https=)
WO (1) WO2004061162A1 (https=)

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CN102256440A (zh) * 2010-05-20 2011-11-23 姚富翔 铝基电路板、其制备方法与供该方法使用的电镀液
CN101855714B (zh) * 2007-08-02 2013-05-08 恩索恩公司 穿硅通孔的铜金属填充
CN104120463A (zh) * 2014-06-25 2014-10-29 济南大学 钢铁基体的一种无氰亚铜电镀铜表面改性方法
CN106917077A (zh) * 2015-12-25 2017-07-04 钧泽科技有限公司 无电镀铜镀液及增加铜镀层硬度的无电镀铜方法
CN109208041A (zh) * 2018-09-18 2019-01-15 山东金宝电子股份有限公司 一种高性能超薄双面光铜箔制备用添加剂

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JP2005327898A (ja) * 2004-05-14 2005-11-24 Fujitsu Ltd 半導体装置及びその製造方法
US20060237319A1 (en) * 2005-04-22 2006-10-26 Akira Furuya Planting process and manufacturing process for semiconductor device thereby, and plating apparatus
JP4802008B2 (ja) * 2006-02-16 2011-10-26 ジュズ インターナショナル ピーティーイー エルティーディー 無電解メッキ液およびメッキ法
US7686875B2 (en) * 2006-05-11 2010-03-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
US8298325B2 (en) * 2006-05-11 2012-10-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
KR101135332B1 (ko) * 2007-03-15 2012-04-17 닛코킨조쿠 가부시키가이샤 구리전해액 및 그것을 이용하여 얻어진 2층 플렉시블 기판
US9439293B2 (en) 2007-11-21 2016-09-06 Xerox Corporation Galvanic process for making printed conductive metal markings for chipless RFID applications
DE502008002080D1 (de) * 2008-06-02 2011-02-03 Autotech Deutschland Gmbh Pyrophosphathaltiges Bad zur cyanidfreien Abscheidung von Kupfer-Zinn-Legierungen
CN104195602B (zh) * 2009-04-07 2017-05-31 巴斯夫欧洲公司 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物
US10184189B2 (en) 2016-07-18 2019-01-22 ECSI Fibrotools, Inc. Apparatus and method of contact electroplating of isolated structures
JP2018104739A (ja) * 2016-12-22 2018-07-05 ローム・アンド・ハース電子材料株式会社 無電解めっき方法
US11842958B2 (en) * 2022-03-18 2023-12-12 Chun-Ming Lin Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure
US12087662B1 (en) 2023-06-12 2024-09-10 Chun-Ming Lin Semiconductor package structure having thermal management structure

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US6291082B1 (en) * 2000-06-13 2001-09-18 Advanced Micro Devices, Inc. Method of electroless ag layer formation for cu interconnects
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101855714B (zh) * 2007-08-02 2013-05-08 恩索恩公司 穿硅通孔的铜金属填充
CN102256440A (zh) * 2010-05-20 2011-11-23 姚富翔 铝基电路板、其制备方法与供该方法使用的电镀液
CN104120463A (zh) * 2014-06-25 2014-10-29 济南大学 钢铁基体的一种无氰亚铜电镀铜表面改性方法
CN104120463B (zh) * 2014-06-25 2016-06-22 济南大学 钢铁基体的一种无氰亚铜电镀铜表面改性方法
CN106917077A (zh) * 2015-12-25 2017-07-04 钧泽科技有限公司 无电镀铜镀液及增加铜镀层硬度的无电镀铜方法
CN106917077B (zh) * 2015-12-25 2019-09-27 钧泽科技有限公司 无电镀铜镀液及增加铜镀层硬度的无电镀铜方法
CN109208041A (zh) * 2018-09-18 2019-01-15 山东金宝电子股份有限公司 一种高性能超薄双面光铜箔制备用添加剂

Also Published As

Publication number Publication date
EP1573091A1 (en) 2005-09-14
JP2006509917A (ja) 2006-03-23
US7147767B2 (en) 2006-12-12
WO2004061162A1 (en) 2004-07-22
KR20050085664A (ko) 2005-08-29
US20040112756A1 (en) 2004-06-17
AU2003287545A1 (en) 2004-07-29

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