JP2006509917A - 銅配線の電気化学的または化学的沈着のためのメッキ溶液およびその方法 - Google Patents

銅配線の電気化学的または化学的沈着のためのメッキ溶液およびその方法 Download PDF

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Publication number
JP2006509917A
JP2006509917A JP2004564876A JP2004564876A JP2006509917A JP 2006509917 A JP2006509917 A JP 2006509917A JP 2004564876 A JP2004564876 A JP 2004564876A JP 2004564876 A JP2004564876 A JP 2004564876A JP 2006509917 A JP2006509917 A JP 2006509917A
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JP
Japan
Prior art keywords
copper
acid
solvent
group
linked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004564876A
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English (en)
Japanese (ja)
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JP2006509917A5 (https=
Inventor
ディー． ボイド，スティーブン
ケサリ，ススルト
エム． ラマンナ，ウィリアム
ジェイ． ペアレント，マイケル
エー． ザッゼラ，ローレンス
チァン，ハイヤン
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2006509917A publication Critical patent/JP2006509917A/ja
Publication of JP2006509917A5 publication Critical patent/JP2006509917A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2004564876A 2002-12-16 2003-11-07 銅配線の電気化学的または化学的沈着のためのメッキ溶液およびその方法 Pending JP2006509917A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/320,263 US7147767B2 (en) 2002-12-16 2002-12-16 Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
PCT/US2003/035398 WO2004061162A1 (en) 2002-12-16 2003-11-07 Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor

Publications (2)

Publication Number Publication Date
JP2006509917A true JP2006509917A (ja) 2006-03-23
JP2006509917A5 JP2006509917A5 (https=) 2006-12-21

Family

ID=32506836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004564876A Pending JP2006509917A (ja) 2002-12-16 2003-11-07 銅配線の電気化学的または化学的沈着のためのメッキ溶液およびその方法

Country Status (7)

Country Link
US (1) US7147767B2 (https=)
EP (1) EP1573091A1 (https=)
JP (1) JP2006509917A (https=)
KR (1) KR20050085664A (https=)
CN (1) CN1726310A (https=)
AU (1) AU2003287545A1 (https=)
WO (1) WO2004061162A1 (https=)

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US7256111B2 (en) * 2004-01-26 2007-08-14 Applied Materials, Inc. Pretreatment for electroless deposition
JP2005327898A (ja) * 2004-05-14 2005-11-24 Fujitsu Ltd 半導体装置及びその製造方法
US20060237319A1 (en) * 2005-04-22 2006-10-26 Akira Furuya Planting process and manufacturing process for semiconductor device thereby, and plating apparatus
JP4802008B2 (ja) * 2006-02-16 2011-10-26 ジュズ インターナショナル ピーティーイー エルティーディー 無電解メッキ液およびメッキ法
US7686875B2 (en) * 2006-05-11 2010-03-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
US8298325B2 (en) * 2006-05-11 2012-10-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
KR101135332B1 (ko) * 2007-03-15 2012-04-17 닛코킨조쿠 가부시키가이샤 구리전해액 및 그것을 이용하여 얻어진 2층 플렉시블 기판
TWI341554B (en) * 2007-08-02 2011-05-01 Enthone Copper metallization of through silicon via
US9439293B2 (en) 2007-11-21 2016-09-06 Xerox Corporation Galvanic process for making printed conductive metal markings for chipless RFID applications
DE502008002080D1 (de) * 2008-06-02 2011-02-03 Autotech Deutschland Gmbh Pyrophosphathaltiges Bad zur cyanidfreien Abscheidung von Kupfer-Zinn-Legierungen
CN104195602B (zh) * 2009-04-07 2017-05-31 巴斯夫欧洲公司 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物
CN102256440A (zh) * 2010-05-20 2011-11-23 姚富翔 铝基电路板、其制备方法与供该方法使用的电镀液
CN104120463B (zh) * 2014-06-25 2016-06-22 济南大学 钢铁基体的一种无氰亚铜电镀铜表面改性方法
TWI606140B (zh) * 2015-12-25 2017-11-21 Electroless copper plating bath and electroless copper plating method for increasing hardness of copper plating
US10184189B2 (en) 2016-07-18 2019-01-22 ECSI Fibrotools, Inc. Apparatus and method of contact electroplating of isolated structures
JP2018104739A (ja) * 2016-12-22 2018-07-05 ローム・アンド・ハース電子材料株式会社 無電解めっき方法
CN109208041B (zh) * 2018-09-18 2020-06-02 山东金宝电子股份有限公司 一种高性能超薄双面光铜箔制备用添加剂
US11842958B2 (en) * 2022-03-18 2023-12-12 Chun-Ming Lin Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure
US12087662B1 (en) 2023-06-12 2024-09-10 Chun-Ming Lin Semiconductor package structure having thermal management structure

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JPH11501909A (ja) * 1995-03-06 1999-02-16 ミネソタ マイニング アンド マニュファクチャリング カンパニー フルオロカーボンアニオンを有するエネルギー活性塩
JP2000219692A (ja) * 1999-01-29 2000-08-08 Asahi Chem Ind Co Ltd トリス（パーフルオロアルキルスルホニル）メチドの金属塩
JP2001278816A (ja) * 2000-03-27 2001-10-10 Asahi Kasei Corp 水系媒体中での反応方法
JP2001294584A (ja) * 2000-03-17 2001-10-23 F Hoffmann La Roche Ag （全ラセミ体）−α―トコフェロールを製造するための方法
WO2002053529A1 (en) * 2000-12-29 2002-07-11 3M Innovative Properties Company High-boiling electrolyte solvent
WO2002092211A2 (en) * 2001-05-10 2002-11-21 3M Innovative Properties Company Bis (perfluoroalkanesulfonyl) imides and their salts as surfactants/additives for applications having extreme environments and methods therefor

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DE4217366A1 (de) * 1992-05-26 1993-12-02 Bayer Ag Imide und deren Salze sowie deren Verwendung
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JPH1192754A (ja) 1997-09-24 1999-04-06 Cci Corp ガラス用撥水処理剤
AU7954898A (en) 1997-12-10 1999-06-28 Minnesota Mining And Manufacturing Company Bis(perfluoroalkylsulfonyl)imide surfactant salts in electrochemical systems
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6197696B1 (en) * 1998-03-26 2001-03-06 Matsushita Electric Industrial Co., Ltd. Method for forming interconnection structure
US6287977B1 (en) * 1998-07-31 2001-09-11 Applied Materials, Inc. Method and apparatus for forming improved metal interconnects
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US6358899B1 (en) * 2000-03-23 2002-03-19 Ashland, Inc. Cleaning compositions and use thereof containing ammonium hydroxide and fluorosurfactant
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US6372700B1 (en) 2000-03-31 2002-04-16 3M Innovative Properties Company Fluorinated solvent compositions containing ozone
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* Cited by examiner, † Cited by third party
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JPH11501909A (ja) * 1995-03-06 1999-02-16 ミネソタ マイニング アンド マニュファクチャリング カンパニー フルオロカーボンアニオンを有するエネルギー活性塩
JP2000219692A (ja) * 1999-01-29 2000-08-08 Asahi Chem Ind Co Ltd トリス（パーフルオロアルキルスルホニル）メチドの金属塩
JP2001294584A (ja) * 2000-03-17 2001-10-23 F Hoffmann La Roche Ag （全ラセミ体）−α―トコフェロールを製造するための方法
JP2001278816A (ja) * 2000-03-27 2001-10-10 Asahi Kasei Corp 水系媒体中での反応方法
WO2002053529A1 (en) * 2000-12-29 2002-07-11 3M Innovative Properties Company High-boiling electrolyte solvent
WO2002092211A2 (en) * 2001-05-10 2002-11-21 3M Innovative Properties Company Bis (perfluoroalkanesulfonyl) imides and their salts as surfactants/additives for applications having extreme environments and methods therefor

Also Published As

Publication number Publication date
EP1573091A1 (en) 2005-09-14
CN1726310A (zh) 2006-01-25
US7147767B2 (en) 2006-12-12
WO2004061162A1 (en) 2004-07-22
KR20050085664A (ko) 2005-08-29
US20040112756A1 (en) 2004-06-17
AU2003287545A1 (en) 2004-07-29

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