JP2006186288A - 機能素子実装モジュール及びその製造方法 - Google Patents
機能素子実装モジュール及びその製造方法 Download PDFInfo
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Abstract
【解決手段】所定の配線パターンが形成され光機能素子3が実装された基板2上に、液状の封止樹脂8を堰き止めるための突堤部7を光機能素子3の周囲に設け、光機能素子3と突堤部7との間に液状の封止樹脂8を滴下して光機能素子3と突堤部7との間に当該封止樹脂8を充填し、光機能素子3の光機能部に対応する光透過用孔部9aを有するパッケージ構成部材9を、その光透過用孔部9aを光機能素子3の光機能部30に対向させた状態で突堤部7に当接させることによりパッケージ構成部材9を封止樹脂8に接触させ、さらに、封止樹脂8を硬化させてパッケージ構成部材を基板2上に固着し、最後に突堤部7を切断除去する。
【選択図】図1
Description
請求項2記載の発明は、請求項1記載の発明において、前記機能素子が、前記基板の配線パターンに対しワイヤーボンディング法によって電気的に接続されているものである。
請求項3記載の発明は、請求項1又は2のいずれか1項記載の発明において、前記パッケージ構成部材の孔部を覆う保護用被覆部材が当該パッケージ構成部材上に設けられているものである。
請求項4記載の発明は、請求項3記載の発明において、前記パッケージ構成部材と前記保護用被覆部材との間に機能部露出用空間に連通するガス排出口が設けられているものである。
請求項5記載の発明は、請求項3記載の発明において、前記保護用被覆部材が、前記パッケージ構成部材から剥離可能な保護フィルムであるものである。
請求項6記載の発明は、請求項1乃至5のいずれか1項記載の発明において、前記機能素子が光機能素子であるものである。
請求項7記載の発明は、請求項1乃至6のいずれか1項記載の発明において、前記機能素子の機能部の近傍に、前記封止樹脂を堰き止めるための堰き止め部が設けられているものである。
請求項8記載の発明は、請求項7記載の発明において、前記堰き止め部が、当該機能素子の機能部の周囲の領域に設けられているものである。
請求項9記載の発明は、請求項8記載の発明において、前記堰き止め部が、ほぼリング形状に形成されているものである。
請求項10記載の発明は、請求項7乃至9のいずれか1項記載の発明において、前記堰き止め部が、前記機能素子上に突出するように形成された突堤部であるものである。
請求項11記載の発明は、請求項7乃至9のいずれか1項記載の発明において、前記堰き止め部が、前記機能素子上に設けた保護膜によって形成された溝部であるものである。
請求項12記載の発明は、所定の配線パターンが形成され所定の機能素子が実装された基板上に、液状の封止樹脂を堰き止めるための突堤部を前記機能素子の近傍に設け、前記機能素子と前記突堤部との間に液状の封止樹脂を滴下して前記機能素子と前記突堤部との間に当該封止樹脂を充填し、前記機能素子の機能部に対応する孔部を有するパッケージ構成部材を、当該孔部を前記機能素子の機能部に対向させた状態で前記突堤部に当接させることにより当該パッケージ構成部材を前記液状の封止樹脂に接触させ、前記液状の封止樹脂を硬化させて前記パッケージ構成部材を前記基板上に固着し、前記突堤部を除去する工程を有する機能素子実装モジュールの製造方法である。
請求項13記載の発明は、請求項12記載の発明において、前記突堤部を、前記機能素子の周囲の領域に設けるものである。
請求項14記載の発明は、請求項13記載の発明において、前記突堤部が、ほぼリング形状に形成されているものである。
請求項15記載の発明は、請求項12乃至14のいずれか1項記載の発明において、前記機能素子が光機能素子であるものである。
請求項16記載の発明は、請求項12乃至15のいずれか1項記載の発明において、前記機能素子として、当該機能部の近傍に前記封止樹脂を堰き止めるための堰き止め部を有する機能素子を用いるものである。
また、本発明によれば、放熱性に優れ、かつ、非常に小型の機能素子実装モジュールを提供することができる。
図1(a)〜(d)は、本発明に係る機能素子実装モジュールの例として光機能素子実装モジュールの製造方法の実施の形態を示す断面構成図、図2は、同光機能素子実装モジュールの実施の形態を示す断面構成図である。
その他の構成及び作用効果については上述の実施の形態と同一であるのでその詳細な説明を省略する。
また、図6(a)は、同機能素子モジュールの断面構成図、図6(b)は、同機能素子モジュールの封止前の外観構成を示す平面図である。
以下、上記実施の形態と対応する部分には同一の符号を付しその詳細な説明を省略する。
また、本発明の場合、溝部32の大きさ及び形状は特に限定されることはないが、封止樹脂8の機能部露出用空間10Aへの流れ込みを考慮すると、パッケージ構成部材9の孔部9Aの形状に対応するように、例えば、孔部9Aとほぼ同じ大きさの矩形リング形状に形成することが好ましい。
なお、本実施の形態の機能素子モジュール1Dは、例えば図5に示す実施の形態と同一の方法によって作成することができる。
また、図8(b)に示す機能素子実装モジュール1Fは、上述した機能素子実装モジュール1Cのパッケージ構成部材9上に、ガス排出口14を有しない保護用被覆部材13を設けたものである。
これら場合、保護用被覆部材13は、上記実施の形態と同一の方法によって設けることができる。
この場合、保護フィルム15は、上記実施の形態と同一の方法によって設けることができる。
例えば、上述の実施の形態においては、突堤部をリング形状に形成したが、液状の封止樹脂を確実に堰き止められる限り、他の形状に形成することも可能である。
Claims (16)
- 所定の配線パターンが形成された基板と、
前記基板上に実装された所定の機能素子と、
前記機能素子の機能部に対応する孔部を有するパッケージ構成部材とを有し、
前記機能素子の機能部が露出した状態で、当該機能素子が封止樹脂によって封止されるとともに前記パッケージ構成部材が当該封止樹脂によって前記基板上に固着されている機能素子実装モジュール。 - 前記機能素子が、前記基板の配線パターンに対しワイヤーボンディング法によって電気的に接続されている請求項1記載の機能素子実装モジュール。
- 前記パッケージ構成部材の孔部を覆う保護用被覆部材が当該パッケージ構成部材上に設けられている請求項1又は2のいずれか1項記載の機能素子実装モジュール。
- 前記パッケージ構成部材と前記保護用被覆部材との間に機能部露出用空間に連通するガス排出口が設けられている請求項3記載の機能素子実装モジュール。
- 前記保護用被覆部材が、前記パッケージ構成部材から剥離可能な保護フィルムである請求項3記載の機能素子実装モジュール。
- 前記機能素子が光機能素子である請求項1乃至5のいずれか1項記載の機能素子実装モジュール。
- 前記機能素子の機能部の近傍に、前記封止樹脂を堰き止めるための堰き止め部が設けられている請求項1乃至6のいずれか1項記載の機能素子実装モジュール。
- 前記堰き止め部が、当該機能素子の機能部の周囲の領域に設けられている請求項7記載の機能素子実装モジュール。
- 前記堰き止め部が、ほぼリング形状に形成されている請求項8記載の機能素子実装モジュール。
- 前記堰き止め部が、前記機能素子上に突出するように形成された突堤部である請求項7乃至9のいずれか1項記載の機能素子実装モジュール。
- 前記堰き止め部が、前記機能素子上に設けた保護膜によって形成された溝部である請求項7乃至9のいずれか1項記載の機能素子実装モジュール。
- 所定の配線パターンが形成され所定の機能素子が実装された基板上に、液状の封止樹脂を堰き止めるための突堤部を前記機能素子の近傍に設け、
前記機能素子と前記突堤部との間に液状の封止樹脂を滴下して前記機能素子と前記突堤部との間に当該封止樹脂を充填し、
前記機能素子の機能部に対応する孔部を有するパッケージ構成部材を、当該孔部を前記機能素子の機能部に対向させた状態で前記突堤部に当接させることにより当該パッケージ構成部材を前記液状の封止樹脂に接触させ、
前記液状の封止樹脂を硬化させて前記パッケージ構成部材を前記基板上に固着し、
前記突堤部を除去する工程を有する機能素子実装モジュールの製造方法。 - 前記突堤部を、前記機能素子の周囲の領域に設ける請求項12記載の機能素子実装モジュールの製造方法。
- 前記突堤部が、ほぼリング形状に形成されている請求項13記載の機能素子実装モジュールの製造方法。
- 前記機能素子が光機能素子である請求項12乃至14のいずれか1項記載の機能素子実装モジュールの製造方法。
- 前記機能素子として、当該機能部の近傍に前記封止樹脂を堰き止めるための堰き止め部を有する機能素子を用いる請求項12乃至15のいずれか1項記載の機能素子実装モジュールの製造方法。
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KR1020077005826A KR20070064322A (ko) | 2004-09-14 | 2005-08-25 | 기능 소자 실장 모듈 및 그 제조 방법 |
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TW094129064A TW200620266A (en) | 2004-09-14 | 2005-08-25 | Functional element mounting module and manufacturing method thereof |
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US7727819B2 (en) | 2010-06-01 |
US7855440B2 (en) | 2010-12-21 |
KR20070064322A (ko) | 2007-06-20 |
US20070176274A1 (en) | 2007-08-02 |
US20080311707A1 (en) | 2008-12-18 |
WO2006030611A1 (ja) | 2006-03-23 |
JP3936365B2 (ja) | 2007-06-27 |
TW200620266A (en) | 2006-06-16 |
EP1801888A1 (en) | 2007-06-27 |
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