JP2006121086A - 容量性／抵抗性デバイス、有機誘電ラミネート、およびそのようなデバイスを組み込むプリント配線板、ならびにその作製の方法 - Google Patents

容量性／抵抗性デバイス、有機誘電ラミネート、およびそのようなデバイスを組み込むプリント配線板、ならびにその作製の方法

Info

Publication number
JP2006121086A
JP2006121086A JP2005303550A JP2005303550A JP2006121086A JP 2006121086 A JP2006121086 A JP 2006121086A JP 2005303550 A JP2005303550 A JP 2005303550A JP 2005303550 A JP2005303550 A JP 2005303550A JP 2006121086 A JP2006121086 A JP 2006121086A
Authority
JP
Japan
Prior art keywords
dielectric
capacitive
electrode
resistive
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005303550A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006121086A5 (https=
Inventor
William J Borland
ジェー．ボーランド ウィリアム
G Sidney Cox
コックス ジー．シドニー
David Ross Mcgregor
ロス マクグレゴール デビッド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2006121086A publication Critical patent/JP2006121086A/ja
Publication of JP2006121086A5 publication Critical patent/JP2006121086A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2005303550A 2004-10-18 2005-10-18 容量性／抵抗性デバイス、有機誘電ラミネート、およびそのようなデバイスを組み込むプリント配線板、ならびにその作製の方法 Pending JP2006121086A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/967,541 US7430128B2 (en) 2004-10-18 2004-10-18 Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof

Publications (2)

Publication Number Publication Date
JP2006121086A true JP2006121086A (ja) 2006-05-11
JP2006121086A5 JP2006121086A5 (https=) 2008-12-04

Family

ID=35677559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005303550A Pending JP2006121086A (ja) 2004-10-18 2005-10-18 容量性／抵抗性デバイス、有機誘電ラミネート、およびそのようなデバイスを組み込むプリント配線板、ならびにその作製の方法

Country Status (7)

Country Link
US (2) US7430128B2 (https=)
EP (1) EP1651017B1 (https=)
JP (1) JP2006121086A (https=)
KR (1) KR100677787B1 (https=)
CN (1) CN1783379A (https=)
DE (1) DE602005001826T2 (https=)
TW (1) TWI402008B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015190236A1 (ja) * 2014-06-10 2015-12-17 株式会社日立製作所 チップモジュールおよび情報処理機器
JP2020068368A (ja) * 2018-10-26 2020-04-30 鼎展電子股▲分▼有限公司 埋込式受動素子構造

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7345889B1 (en) * 2004-09-28 2008-03-18 Avaya Technology Corp. Method and system for reducing radiated energy emissions in computational devices
US7596842B2 (en) * 2005-02-22 2009-10-06 Oak-Mitsui Inc. Method of making multilayered construction for use in resistors and capacitors
CN105047411A (zh) * 2015-08-12 2015-11-11 深圳市槟城电子有限公司 一种电阻和电容串连的组件及其制作方法
CN105047642B (zh) * 2015-08-12 2024-01-19 深圳市槟城电子股份有限公司 一种端口防护电路集成封装件
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
EP3761492B1 (en) * 2019-07-05 2023-01-04 Infineon Technologies AG Snubber circuit and power semiconductor module with snubber circuit
CN114695131A (zh) * 2022-03-24 2022-07-01 广东佛智芯微电子技术研究有限公司 一种扇出型封装基板结构及其制备方法
US12597567B2 (en) * 2022-10-21 2026-04-07 KYOCERA AVX Components Corporation Single layer capacitor
DE112024002007T5 (de) * 2023-05-10 2026-02-26 KYOCERA AVX Components Corporation Abscheidbarer einzelschichtkondensator

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105322A (en) * 1979-01-26 1980-08-12 Siemens Ag Rc circuit network and method of correcting same
JPH04211191A (ja) * 1990-02-09 1992-08-03 Hitachi Ltd 実装構造体
JPH0594717A (ja) * 1990-02-06 1993-04-16 Matsushita Electric Works Ltd 複合誘電体
JPH07161578A (ja) * 1993-12-06 1995-06-23 Rubikon Denshi Kk フィルムコンデンサの製造方法
JPH07226334A (ja) * 1994-02-09 1995-08-22 Matsushita Electric Ind Co Ltd 薄膜コンデンサ及びその製造方法
JPH10150274A (ja) * 1996-10-10 1998-06-02 General Electric Co <Ge> 可撓性膜層の上に受動素子を集積化するための方法および構造
JP2000269079A (ja) * 1999-03-19 2000-09-29 Dainippon Printing Co Ltd 共振回路及びその製造方法
JP2001189541A (ja) * 1999-09-23 2001-07-10 Morton Internatl Inc 電気回路の形成方法
US6278356B1 (en) * 2000-05-17 2001-08-21 Compeq Manufacturing Company Limited Flat, built-in resistors and capacitors for a printed circuit board
JP2001310911A (ja) * 2000-04-28 2001-11-06 Sumitomo Seika Chem Co Ltd 誘電体形成物質及び誘電体フィルム
JP2002009416A (ja) * 2000-06-20 2002-01-11 Matsushita Electric Works Ltd プリント配線板製造用シート材、このプリント配線板製造用シート材を用いたプリント配線板の製造方法及びプリント配線板
JP2003142590A (ja) * 2001-11-06 2003-05-16 Matsushita Electric Ind Co Ltd 容量素子
JP2004193411A (ja) * 2002-12-12 2004-07-08 Fujikura Ltd 高誘電率電気・電子部品の製造方法と部品
JP2004214586A (ja) * 2002-11-14 2004-07-29 Kyocera Corp 多層配線基板

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3934119A (en) 1974-09-17 1976-01-20 Texas Instruments Incorporated Electrical resistance heaters
US4377652A (en) 1978-02-17 1983-03-22 Asahi Kasei Kogyo Kabushiki Kaisha Polyamide-imide compositions and articles for electrical use prepared therefrom
US4410867A (en) * 1978-12-28 1983-10-18 Western Electric Company, Inc. Alpha tantalum thin film circuit device
US4407883A (en) 1982-03-03 1983-10-04 Uop Inc. Laminates for printed circuit boards
JPS58190091A (ja) 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造方法
JPS59144162A (ja) 1983-02-08 1984-08-18 Nec Corp 薄膜回路の製造方法
JPS60113993A (ja) 1983-11-25 1985-06-20 三菱電機株式会社 多層回路基板の製造方法
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
US5093036A (en) 1988-09-20 1992-03-03 Raychem Corporation Conductive polymer composition
JP2764745B2 (ja) 1989-07-21 1998-06-11 オムロン株式会社 混成回路基板およびその製造方法
JP3019541B2 (ja) 1990-11-22 2000-03-13 株式会社村田製作所 コンデンサ内蔵型配線基板およびその製造方法
JPH0565456A (ja) 1991-09-09 1993-03-19 Sumitomo Bakelite Co Ltd 気密封止用樹脂ペースト
DE69305942T2 (de) 1992-09-15 1997-03-13 Du Pont Zusammensetzung für einen Polymer-Dickschichtwiderstand
US6111005A (en) 1993-07-30 2000-08-29 Diemat, Inc. Polymeric adhesive paste
US6140402A (en) 1993-07-30 2000-10-31 Diemat, Inc. Polymeric adhesive paste
JP3117175B2 (ja) 1994-02-09 2000-12-11 アルプス電気株式会社 抵抗体
TW301843B (en) 1994-11-15 1997-04-01 Ibm Electrically conductive paste and composite and their use as an electrically conductive connector
JP3684239B2 (ja) * 1995-01-10 2005-08-17 株式会社 日立製作所 低ｅｍｉ電子機器
TW367621B (en) 1995-02-27 1999-08-21 Nxp Bv Electronic component comprising a thin-film structure with passive elements
US5993698A (en) 1997-11-06 1999-11-30 Acheson Industries, Inc. Electrical device containing positive temperature coefficient resistor composition and method of manufacturing the device
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6030553A (en) 1999-04-01 2000-02-29 Industrial Technology Research Institute Polymer thick film resistor pastes
US6285542B1 (en) 1999-04-16 2001-09-04 Avx Corporation Ultra-small resistor-capacitor thin film network for inverted mounting to a surface
US6541137B1 (en) * 2000-07-31 2003-04-01 Motorola, Inc. Multi-layer conductor-dielectric oxide structure
JP2002252297A (ja) 2001-02-23 2002-09-06 Hitachi Ltd 多層回路基板を用いた電子回路装置
EP1265466A3 (en) * 2001-06-05 2004-07-21 Dai Nippon Printing Co., Ltd. Method for fabrication wiring board provided with passive element and wiring board provided with passive element
JP3711343B2 (ja) * 2002-06-26 2005-11-02 株式会社トッパンＮｅｃサーキットソリューションズ 印刷配線板及びその製造方法並びに半導体装置
US6600645B1 (en) 2002-09-27 2003-07-29 Ut-Battelle, Llc Dielectric composite materials and method for preparing
US6910264B2 (en) 2003-01-03 2005-06-28 Phoenix Precision Technology Corp. Method for making a multilayer circuit board having embedded passive components
JP2004214573A (ja) 2003-01-09 2004-07-29 Murata Mfg Co Ltd セラミック多層基板の製造方法

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105322A (en) * 1979-01-26 1980-08-12 Siemens Ag Rc circuit network and method of correcting same
JPH0594717A (ja) * 1990-02-06 1993-04-16 Matsushita Electric Works Ltd 複合誘電体
JPH04211191A (ja) * 1990-02-09 1992-08-03 Hitachi Ltd 実装構造体
JPH07161578A (ja) * 1993-12-06 1995-06-23 Rubikon Denshi Kk フィルムコンデンサの製造方法
JPH07226334A (ja) * 1994-02-09 1995-08-22 Matsushita Electric Ind Co Ltd 薄膜コンデンサ及びその製造方法
JPH10150274A (ja) * 1996-10-10 1998-06-02 General Electric Co <Ge> 可撓性膜層の上に受動素子を集積化するための方法および構造
JP2000269079A (ja) * 1999-03-19 2000-09-29 Dainippon Printing Co Ltd 共振回路及びその製造方法
JP2001189541A (ja) * 1999-09-23 2001-07-10 Morton Internatl Inc 電気回路の形成方法
JP2001310911A (ja) * 2000-04-28 2001-11-06 Sumitomo Seika Chem Co Ltd 誘電体形成物質及び誘電体フィルム
US6278356B1 (en) * 2000-05-17 2001-08-21 Compeq Manufacturing Company Limited Flat, built-in resistors and capacitors for a printed circuit board
JP2002009416A (ja) * 2000-06-20 2002-01-11 Matsushita Electric Works Ltd プリント配線板製造用シート材、このプリント配線板製造用シート材を用いたプリント配線板の製造方法及びプリント配線板
JP2003142590A (ja) * 2001-11-06 2003-05-16 Matsushita Electric Ind Co Ltd 容量素子
JP2004214586A (ja) * 2002-11-14 2004-07-29 Kyocera Corp 多層配線基板
JP2004193411A (ja) * 2002-12-12 2004-07-08 Fujikura Ltd 高誘電率電気・電子部品の製造方法と部品

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015190236A1 (ja) * 2014-06-10 2015-12-17 株式会社日立製作所 チップモジュールおよび情報処理機器
JP2020068368A (ja) * 2018-10-26 2020-04-30 鼎展電子股▲分▼有限公司 埋込式受動素子構造

Also Published As

Publication number Publication date
CN1783379A (zh) 2006-06-07
EP1651017B1 (en) 2007-08-01
KR100677787B1 (ko) 2007-02-02
TW200635454A (en) 2006-10-01
US7430128B2 (en) 2008-09-30
DE602005001826T2 (de) 2008-04-24
TWI402008B (zh) 2013-07-11
KR20060054031A (ko) 2006-05-22
EP1651017A3 (en) 2006-05-03
DE602005001826D1 (de) 2007-09-13
EP1651017A2 (en) 2006-04-26
US20060082980A1 (en) 2006-04-20
US20080297274A1 (en) 2008-12-04
US7813141B2 (en) 2010-10-12

Similar Documents

Publication Publication Date Title
KR100812515B1 (ko) 용량성/저항성 디바이스 및 이러한 디바이스를 통합하는인쇄 배선 기판, 그리고 그 제작 방법
US7813141B2 (en) Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
US7186919B2 (en) Printed circuit board including embedded capacitors and method of manufacturing the same
US20050156906A1 (en) Capacitive touchpad and method for forming the same
WO2007050114A2 (en) A substantially continuous layer of embedded transient protection for printed circuit boards
JP4500759B2 (ja) 容量性／抵抗性デバイス、高誘電率有機誘電ラミネート、およびそのようなデバイスを組み込むプリント配線板、ならびにその作製の方法
CN101247699A (zh) 具有内埋电阻的电路板
CN106341945A (zh) 一种柔性线路板及其制作方法
US7573721B2 (en) Embedded passive device structure and manufacturing method thereof
US20110252639A1 (en) Printed wiring board with a built-in resistive element
CN101087495A (zh) 无导通孔的多层印刷电路板的制造方法
JP4069097B2 (ja) 基板内蔵用電子部品、電子部品内蔵基板、および電子部品内蔵基板の製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081020

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081020

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110224

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110301

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110601

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111108

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120208

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120213

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120308

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20120312

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20120312

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120911