JP2006121072A5 - - Google Patents
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- Publication number
- JP2006121072A5 JP2006121072A5 JP2005296634A JP2005296634A JP2006121072A5 JP 2006121072 A5 JP2006121072 A5 JP 2006121072A5 JP 2005296634 A JP2005296634 A JP 2005296634A JP 2005296634 A JP2005296634 A JP 2005296634A JP 2006121072 A5 JP2006121072 A5 JP 2006121072A5
- Authority
- JP
- Japan
- Prior art keywords
- gases
- gas analyzer
- chamber
- historical
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007789 gas Substances 0.000 claims 25
- 238000000034 method Methods 0.000 claims 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 4
- 229910052757 nitrogen Inorganic materials 0.000 claims 4
- 239000001301 oxygen Substances 0.000 claims 4
- 229910052760 oxygen Inorganic materials 0.000 claims 4
- 238000001771 vacuum deposition Methods 0.000 claims 4
- 238000009530 blood pressure measurement Methods 0.000 claims 3
- 238000012544 monitoring process Methods 0.000 claims 3
- 229910052786 argon Inorganic materials 0.000 claims 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000007619 statistical method Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US61771404P | 2004-10-12 | 2004-10-12 | |
| US11/087,193 US20060075968A1 (en) | 2004-10-12 | 2005-03-23 | Leak detector and process gas monitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006121072A JP2006121072A (ja) | 2006-05-11 |
| JP2006121072A5 true JP2006121072A5 (enExample) | 2008-11-27 |
Family
ID=36742271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005296634A Withdrawn JP2006121072A (ja) | 2004-10-12 | 2005-10-11 | リーク検出器及びプロセスガスモニタ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20060075968A1 (enExample) |
| JP (1) | JP2006121072A (enExample) |
| KR (1) | KR20060092966A (enExample) |
| CN (1) | CN1766162A (enExample) |
| TW (1) | TWI277164B (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8440049B2 (en) * | 2006-05-03 | 2013-05-14 | Applied Materials, Inc. | Apparatus for etching high aspect ratio features |
| KR101501426B1 (ko) * | 2006-06-02 | 2015-03-11 | 어플라이드 머티어리얼스, 인코포레이티드 | 차압 측정들에 의한 가스 유동 제어 |
| JP5043394B2 (ja) * | 2006-09-29 | 2012-10-10 | 東京エレクトロン株式会社 | 蒸着装置およびその運転方法 |
| JP5016031B2 (ja) * | 2007-05-15 | 2012-09-05 | 株式会社アルバック | 質量分析ユニット |
| JP5385875B2 (ja) * | 2010-08-26 | 2014-01-08 | 東京エレクトロン株式会社 | プラズマ処理装置及び光学モニタ装置 |
| US9097610B2 (en) * | 2011-03-16 | 2015-08-04 | Norden Machinery Ab | Method and arrangement for leak detection |
| DE102012200211A1 (de) * | 2012-01-09 | 2013-07-11 | Carl Zeiss Nts Gmbh | Vorrichtung und Verfahren zur Oberflächenbearbeitung eines Substrates |
| TWI654695B (zh) * | 2012-12-06 | 2019-03-21 | 英福康公司 | 真空工具及測量該真空工具的客真空室中的氛圍的方法 |
| US9209040B2 (en) * | 2013-10-11 | 2015-12-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Amorphorus silicon insertion for STI-CMP planarity improvement |
| US9412619B2 (en) * | 2014-08-12 | 2016-08-09 | Applied Materials, Inc. | Method of outgassing a mask material deposited over a workpiece in a process tool |
| CN104297423B (zh) * | 2014-09-23 | 2015-12-02 | 京东方科技集团股份有限公司 | 检测装置和检测方法 |
| KR101650887B1 (ko) * | 2015-02-12 | 2016-08-25 | 주식회사 비스텔 | 반도체 제조 공정에서 통계적 방법을 이용하여, 가스 누출을 감지하는 방법 장치 |
| DE102016205381B4 (de) * | 2016-03-31 | 2023-11-30 | Inficon Gmbh | Gaslecksuche mit einer Testgassprühvorrichtung |
| KR101859058B1 (ko) * | 2016-05-11 | 2018-05-18 | (주)쎄미시스코 | 챔버의 리크 검출 방법 및 그 장치 |
| CN107591344B (zh) * | 2016-07-06 | 2022-05-27 | 北京北方华创微电子装备有限公司 | 工艺室气氛检测方法和晶片加工设备 |
| US10930535B2 (en) * | 2016-12-02 | 2021-02-23 | Applied Materials, Inc. | RFID part authentication and tracking of processing components |
| US20190109029A1 (en) * | 2017-10-05 | 2019-04-11 | Globalfoundries Inc. | Methods, Apparatus and System for Dose Control for Semiconductor Wafer Processing |
| US11111937B2 (en) * | 2018-06-29 | 2021-09-07 | The Boeing Company | Fault prediction in hydraulic systems |
| CN110894599B (zh) * | 2018-09-13 | 2022-02-11 | 中国建筑材料科学研究总院有限公司 | 等离子体化学气相沉积系统及方法 |
| JP7013589B2 (ja) * | 2018-09-21 | 2022-01-31 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理装置およびプログラム |
| US10985059B2 (en) * | 2018-11-01 | 2021-04-20 | Northrop Grumman Systems Corporation | Preclean and dielectric deposition methodology for superconductor interconnect fabrication |
| US11512389B2 (en) * | 2019-03-20 | 2022-11-29 | Samsung Electronincs Co., Ltd. | Apparatus for and method of manufacturing semiconductor device |
| US11635338B2 (en) * | 2020-10-23 | 2023-04-25 | Applied Materials, Inc. | Rapid chamber vacuum leak check hardware and maintenance routine |
| KR20240007199A (ko) * | 2021-05-11 | 2024-01-16 | 배트 홀딩 아게 | 진공 처리 시스템 및 공정 제어 |
| US12469751B2 (en) | 2021-06-03 | 2025-11-11 | Applied Materials, Inc. | Apparatus to detect and quantify radical concentration in semiconductor processing systems |
| WO2023086395A1 (en) * | 2021-11-12 | 2023-05-19 | Mks Instruments, Inc. | Methods and systems for feedback control in plasma processing using radical sensing |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3944826A (en) * | 1973-07-19 | 1976-03-16 | Applied Research Laboratories Limited | Methods and apparatus for analyzing mixtures |
| IL81375A (en) * | 1987-01-23 | 1990-11-05 | Univ Ramot | Method and apparatus for producing ions by surface ionization of energy-rich molecules and atoms |
| US5108569A (en) * | 1989-11-30 | 1992-04-28 | Applied Materials, Inc. | Process and apparatus for forming stoichiometric layer of a metal compound by closed loop voltage controlled reactive sputtering |
| US5300774A (en) * | 1991-04-25 | 1994-04-05 | Applied Biosystems, Inc. | Time-of-flight mass spectrometer with an aperture enabling tradeoff of transmission efficiency and resolution |
| US5384465A (en) * | 1993-09-17 | 1995-01-24 | Applied Materials, Inc. | Spectrum analyzer in an ion implanter |
| US5565424A (en) * | 1994-02-07 | 1996-10-15 | Ramot - University Authority For Applied Research And Industrial Development Ltd. | Superactive VIP antagonists |
| US5779926A (en) * | 1994-09-16 | 1998-07-14 | Applied Materials, Inc. | Plasma process for etching multicomponent alloys |
| US5711843A (en) * | 1995-02-21 | 1998-01-27 | Orincon Technologies, Inc. | System for indirectly monitoring and controlling a process with particular application to plasma processes |
| JP3768575B2 (ja) * | 1995-11-28 | 2006-04-19 | アプライド マテリアルズ インコーポレイテッド | Cvd装置及びチャンバ内のクリーニングの方法 |
| US5943230A (en) * | 1996-12-19 | 1999-08-24 | Applied Materials, Inc. | Computer-implemented inter-chamber synchronization in a multiple chamber substrate processing system |
| DE69823352T2 (de) * | 1997-06-12 | 2004-09-02 | Applied Research Systems Ars Holding N.V. | Cd28/ctla-4 inhibierende peptidomimetika und diese enthaltende pharmazeutische zusammensetzungen |
| JPH11111680A (ja) * | 1997-09-30 | 1999-04-23 | Yasuhiro Horiike | エッチング方法 |
| KR100257903B1 (ko) * | 1997-12-30 | 2000-08-01 | 윤종용 | 인시튜 모니터링가능한 플라즈마 식각장치, 그 인시튜 모니터링방법, 플라즈마 식각챔버내의 잔류물 제거를 위한 인시튜 세정방법 |
| US5947053A (en) * | 1998-01-09 | 1999-09-07 | International Business Machines Corporation | Wear-through detector for multilayered parts and methods of using same |
| US6114692A (en) * | 1998-05-28 | 2000-09-05 | Siemens Applied Automation, Inc. | Total ion number determination in an ion cyclotron resonance mass spectrometer using ion magnetron resonance |
| US6468814B1 (en) * | 1998-07-24 | 2002-10-22 | Leybold Inficon, Inc. | Detection of nontransient processing anomalies in vacuum manufacturing process |
| US6255648B1 (en) * | 1998-10-16 | 2001-07-03 | Applied Automation, Inc. | Programmed electron flux |
| US6374831B1 (en) * | 1999-02-04 | 2002-04-23 | Applied Materials, Inc. | Accelerated plasma clean |
| US6362099B1 (en) * | 1999-03-09 | 2002-03-26 | Applied Materials, Inc. | Method for enhancing the adhesion of copper deposited by chemical vapor deposition |
| US6286362B1 (en) * | 1999-03-31 | 2001-09-11 | Applied Materials, Inc. | Dual mode leak detector |
| US6210745B1 (en) * | 1999-07-08 | 2001-04-03 | National Semiconductor Corporation | Method of quality control for chemical vapor deposition |
| US6490144B1 (en) * | 1999-11-29 | 2002-12-03 | Applied Materials, Inc. | Support for supporting a substrate in a process chamber |
| US6372291B1 (en) * | 1999-12-23 | 2002-04-16 | Applied Materials, Inc. | In situ deposition and integration of silicon nitride in a high density plasma reactor |
| US6863019B2 (en) * | 2000-06-13 | 2005-03-08 | Applied Materials, Inc. | Semiconductor device fabrication chamber cleaning method and apparatus with recirculation of cleaning gas |
| US6745095B1 (en) * | 2000-10-04 | 2004-06-01 | Applied Materials, Inc. | Detection of process endpoint through monitoring fluctuation of output data |
| US6639227B1 (en) * | 2000-10-18 | 2003-10-28 | Applied Materials, Inc. | Apparatus and method for charged particle filtering and ion implantation |
| US7094614B2 (en) * | 2001-01-16 | 2006-08-22 | International Business Machines Corporation | In-situ monitoring of chemical vapor deposition process by mass spectrometry |
| US6286632B1 (en) * | 2001-03-27 | 2001-09-11 | Kao Teh Chai | Brake unit for scooter |
| US6936183B2 (en) * | 2001-10-17 | 2005-08-30 | Applied Materials, Inc. | Etch process for etching microstructures |
| US7153362B2 (en) * | 2002-04-30 | 2006-12-26 | Samsung Electronics Co., Ltd. | System and method for real time deposition process control based on resulting product detection |
-
2005
- 2005-03-23 US US11/087,193 patent/US20060075968A1/en not_active Abandoned
- 2005-09-26 TW TW094133387A patent/TWI277164B/zh not_active IP Right Cessation
- 2005-09-29 CN CNA2005101087427A patent/CN1766162A/zh active Pending
- 2005-10-11 KR KR1020050095556A patent/KR20060092966A/ko not_active Withdrawn
- 2005-10-11 JP JP2005296634A patent/JP2006121072A/ja not_active Withdrawn
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