TWI277164B - Leak detector and process gas monitor - Google Patents

Leak detector and process gas monitor Download PDF

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Publication number
TWI277164B
TWI277164B TW094133387A TW94133387A TWI277164B TW I277164 B TWI277164 B TW I277164B TW 094133387 A TW094133387 A TW 094133387A TW 94133387 A TW94133387 A TW 94133387A TW I277164 B TWI277164 B TW I277164B
Authority
TW
Taiwan
Prior art keywords
chamber
gas
gases
mass spectrometer
controller
Prior art date
Application number
TW094133387A
Other languages
English (en)
Chinese (zh)
Other versions
TW200612511A (en
Inventor
Samuel Leung
Ulrich A Bonne
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200612511A publication Critical patent/TW200612511A/zh
Application granted granted Critical
Publication of TWI277164B publication Critical patent/TWI277164B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Examining Or Testing Airtightness (AREA)
TW094133387A 2004-10-12 2005-09-26 Leak detector and process gas monitor TWI277164B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61771404P 2004-10-12 2004-10-12
US11/087,193 US20060075968A1 (en) 2004-10-12 2005-03-23 Leak detector and process gas monitor

Publications (2)

Publication Number Publication Date
TW200612511A TW200612511A (en) 2006-04-16
TWI277164B true TWI277164B (en) 2007-03-21

Family

ID=36742271

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133387A TWI277164B (en) 2004-10-12 2005-09-26 Leak detector and process gas monitor

Country Status (5)

Country Link
US (1) US20060075968A1 (enExample)
JP (1) JP2006121072A (enExample)
KR (1) KR20060092966A (enExample)
CN (1) CN1766162A (enExample)
TW (1) TWI277164B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425208B (zh) * 2007-05-15 2014-02-01 愛發科股份有限公司 質量分析單元
TWI730076B (zh) * 2016-03-31 2021-06-11 德商英飛康股份有限公司 用以氣體洩漏偵測的裝置及其使用方法

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US8440049B2 (en) * 2006-05-03 2013-05-14 Applied Materials, Inc. Apparatus for etching high aspect ratio features
KR101501426B1 (ko) * 2006-06-02 2015-03-11 어플라이드 머티어리얼스, 인코포레이티드 차압 측정들에 의한 가스 유동 제어
JP5043394B2 (ja) * 2006-09-29 2012-10-10 東京エレクトロン株式会社 蒸着装置およびその運転方法
JP5385875B2 (ja) * 2010-08-26 2014-01-08 東京エレクトロン株式会社 プラズマ処理装置及び光学モニタ装置
US9097610B2 (en) * 2011-03-16 2015-08-04 Norden Machinery Ab Method and arrangement for leak detection
DE102012200211A1 (de) * 2012-01-09 2013-07-11 Carl Zeiss Nts Gmbh Vorrichtung und Verfahren zur Oberflächenbearbeitung eines Substrates
TWI654695B (zh) * 2012-12-06 2019-03-21 英福康公司 真空工具及測量該真空工具的客真空室中的氛圍的方法
US9209040B2 (en) * 2013-10-11 2015-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. Amorphorus silicon insertion for STI-CMP planarity improvement
US9412619B2 (en) * 2014-08-12 2016-08-09 Applied Materials, Inc. Method of outgassing a mask material deposited over a workpiece in a process tool
CN104297423B (zh) * 2014-09-23 2015-12-02 京东方科技集团股份有限公司 检测装置和检测方法
KR101650887B1 (ko) * 2015-02-12 2016-08-25 주식회사 비스텔 반도체 제조 공정에서 통계적 방법을 이용하여, 가스 누출을 감지하는 방법 장치
KR101859058B1 (ko) * 2016-05-11 2018-05-18 (주)쎄미시스코 챔버의 리크 검출 방법 및 그 장치
CN107591344B (zh) * 2016-07-06 2022-05-27 北京北方华创微电子装备有限公司 工艺室气氛检测方法和晶片加工设备
US10930535B2 (en) * 2016-12-02 2021-02-23 Applied Materials, Inc. RFID part authentication and tracking of processing components
US20190109029A1 (en) * 2017-10-05 2019-04-11 Globalfoundries Inc. Methods, Apparatus and System for Dose Control for Semiconductor Wafer Processing
US11111937B2 (en) * 2018-06-29 2021-09-07 The Boeing Company Fault prediction in hydraulic systems
CN110894599B (zh) * 2018-09-13 2022-02-11 中国建筑材料科学研究总院有限公司 等离子体化学气相沉积系统及方法
JP7013589B2 (ja) * 2018-09-21 2022-01-31 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置およびプログラム
US10985059B2 (en) * 2018-11-01 2021-04-20 Northrop Grumman Systems Corporation Preclean and dielectric deposition methodology for superconductor interconnect fabrication
US11512389B2 (en) * 2019-03-20 2022-11-29 Samsung Electronincs Co., Ltd. Apparatus for and method of manufacturing semiconductor device
US11635338B2 (en) * 2020-10-23 2023-04-25 Applied Materials, Inc. Rapid chamber vacuum leak check hardware and maintenance routine
KR20240007199A (ko) * 2021-05-11 2024-01-16 배트 홀딩 아게 진공 처리 시스템 및 공정 제어
US12469751B2 (en) 2021-06-03 2025-11-11 Applied Materials, Inc. Apparatus to detect and quantify radical concentration in semiconductor processing systems
WO2023086395A1 (en) * 2021-11-12 2023-05-19 Mks Instruments, Inc. Methods and systems for feedback control in plasma processing using radical sensing

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425208B (zh) * 2007-05-15 2014-02-01 愛發科股份有限公司 質量分析單元
TWI730076B (zh) * 2016-03-31 2021-06-11 德商英飛康股份有限公司 用以氣體洩漏偵測的裝置及其使用方法

Also Published As

Publication number Publication date
JP2006121072A (ja) 2006-05-11
KR20060092966A (ko) 2006-08-23
CN1766162A (zh) 2006-05-03
TW200612511A (en) 2006-04-16
US20060075968A1 (en) 2006-04-13

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