JP2006086534A - 高温基板処理用の粗面サセプタ - Google Patents

高温基板処理用の粗面サセプタ Download PDF

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Publication number
JP2006086534A
JP2006086534A JP2005268362A JP2005268362A JP2006086534A JP 2006086534 A JP2006086534 A JP 2006086534A JP 2005268362 A JP2005268362 A JP 2005268362A JP 2005268362 A JP2005268362 A JP 2005268362A JP 2006086534 A JP2006086534 A JP 2006086534A
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JP
Japan
Prior art keywords
substrate support
susceptor
semiconductor substrate
substrate
silicon carbide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005268362A
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English (en)
Japanese (ja)
Other versions
JP2006086534A5 (enExample
Inventor
Den Berg Jannes Remco Van
レムコ ファン デン ベルフ ヤンネス
Ernst H A Grannemann
ハー．アー．フラッネマン エルンスト
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ASM International NV
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ASM International NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM International NV filed Critical ASM International NV
Publication of JP2006086534A publication Critical patent/JP2006086534A/ja
Publication of JP2006086534A5 publication Critical patent/JP2006086534A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/14—Substrate holders or susceptors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
JP2005268362A 2004-09-17 2005-09-15 高温基板処理用の粗面サセプタ Pending JP2006086534A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61099304P 2004-09-17 2004-09-17

Publications (2)

Publication Number Publication Date
JP2006086534A true JP2006086534A (ja) 2006-03-30
JP2006086534A5 JP2006086534A5 (enExample) 2008-10-16

Family

ID=35519641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005268362A Pending JP2006086534A (ja) 2004-09-17 2005-09-15 高温基板処理用の粗面サセプタ

Country Status (3)

Country Link
US (2) US20060060145A1 (enExample)
EP (2) EP1965412A1 (enExample)
JP (1) JP2006086534A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277781A (ja) * 2007-03-30 2008-11-13 Covalent Materials Corp 縦型ウエハボート

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NL1031985C2 (nl) * 2006-06-12 2007-12-13 Xycarb Ceramics B V Werkwijze voor het vervaardigen van een inrichting voor het ondersteunen van een substraat tijdens de vervaardiging van halfgeleider-componenten alsmede een dergelijke inrichting.
JP2010509778A (ja) * 2006-11-10 2010-03-25 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド サセプタおよびサセプタを用いたｌｅｄ装置の形成方法
FR2914488B1 (fr) * 2007-03-30 2010-08-27 Soitec Silicon On Insulator Substrat chauffage dope
JP5444607B2 (ja) * 2007-10-31 2014-03-19 株式会社Ｓｕｍｃｏ エピタキシャル膜形成装置用のサセプタ、エピタキシャル膜形成装置、エピタキシャルウェーハの製造方法
JP5415853B2 (ja) * 2009-07-10 2014-02-12 東京エレクトロン株式会社 表面処理方法
JP5562409B2 (ja) * 2010-02-26 2014-07-30 株式会社日立国際電気 半導体装置の製造方法及び基板製造方法及び基板処理装置
WO2011139640A2 (en) * 2010-05-06 2011-11-10 Applied Materials, Inc. Improved radiation heating efficiency by increasing absorption of a silicon containing material
US10316412B2 (en) 2012-04-18 2019-06-11 Veeco Instruments Inc. Wafter carrier for chemical vapor deposition systems
JP5906318B2 (ja) * 2012-08-17 2016-04-20 株式会社Ihi 耐熱複合材料の製造方法及び製造装置
US10167571B2 (en) 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
US10763154B2 (en) 2018-08-28 2020-09-01 Applied Materials, Inc. Measurement of flatness of a susceptor of a display CVD chamber

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JPH0745534A (ja) * 1993-07-30 1995-02-14 Sony Corp 縦型ｃｖｄ装置
JPH0758041A (ja) * 1993-08-20 1995-03-03 Toshiba Ceramics Co Ltd サセプタ
JPH10321543A (ja) * 1997-05-20 1998-12-04 Sumitomo Metal Ind Ltd ウェハ支持体及び縦型ボート
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277781A (ja) * 2007-03-30 2008-11-13 Covalent Materials Corp 縦型ウエハボート

Also Published As

Publication number Publication date
EP1638135A3 (en) 2008-03-19
EP1638135A2 (en) 2006-03-22
EP1965412A1 (en) 2008-09-03
US20060060145A1 (en) 2006-03-23
US20080124470A1 (en) 2008-05-29

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