JP2006059814A5 - - Google Patents

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Publication number
JP2006059814A5
JP2006059814A5 JP2005238111A JP2005238111A JP2006059814A5 JP 2006059814 A5 JP2006059814 A5 JP 2006059814A5 JP 2005238111 A JP2005238111 A JP 2005238111A JP 2005238111 A JP2005238111 A JP 2005238111A JP 2006059814 A5 JP2006059814 A5 JP 2006059814A5
Authority
JP
Japan
Prior art keywords
support
connector
lead
compressible film
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005238111A
Other languages
English (en)
Japanese (ja)
Other versions
JP4686300B2 (ja
JP2006059814A (ja
Filing date
Publication date
Priority claimed from US10/711,076 external-priority patent/US7332821B2/en
Application filed filed Critical
Publication of JP2006059814A publication Critical patent/JP2006059814A/ja
Publication of JP2006059814A5 publication Critical patent/JP2006059814A5/ja
Application granted granted Critical
Publication of JP4686300B2 publication Critical patent/JP4686300B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005238111A 2004-08-20 2005-08-19 デバイス支持構造体及びこれの製造方法 Expired - Fee Related JP4686300B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/711,076 US7332821B2 (en) 2004-08-20 2004-08-20 Compressible films surrounding solder connectors
US10/711076 2004-08-20

Publications (3)

Publication Number Publication Date
JP2006059814A JP2006059814A (ja) 2006-03-02
JP2006059814A5 true JP2006059814A5 (enExample) 2008-07-10
JP4686300B2 JP4686300B2 (ja) 2011-05-25

Family

ID=35910206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005238111A Expired - Fee Related JP4686300B2 (ja) 2004-08-20 2005-08-19 デバイス支持構造体及びこれの製造方法

Country Status (4)

Country Link
US (2) US7332821B2 (enExample)
JP (1) JP4686300B2 (enExample)
CN (1) CN100399560C (enExample)
TW (1) TWI346518B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006056999A2 (en) * 2004-11-29 2006-06-01 N-Trig Ltd. Methods for manufacturing a sensor assembly
US20070063344A1 (en) * 2005-09-22 2007-03-22 Chun-Hung Lin Chip package structure and bumping process
US20100224395A1 (en) * 2006-03-28 2010-09-09 Panasonic Corporation Multilayer wiring board and its manufacturing method
US7727805B2 (en) * 2007-06-11 2010-06-01 Intel Corporation Reducing stress in a flip chip assembly
US20090108442A1 (en) * 2007-10-25 2009-04-30 International Business Machines Corporation Self-assembled stress relief interface
US8507325B2 (en) * 2010-01-28 2013-08-13 International Business Machines Corporation Co-axial restraint for connectors within flip-chip packages
FR2957748B1 (fr) * 2010-03-16 2012-09-07 St Microelectronics Grenoble 2 Composant electronique a montage en surface
US9082780B2 (en) * 2012-03-23 2015-07-14 Stats Chippac, Ltd. Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layer
US20140291834A1 (en) * 2013-03-27 2014-10-02 Micron Technology, Inc. Semiconductor devices and packages including conductive underfill material and related methods
US9711474B2 (en) * 2014-09-24 2017-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure with polymeric layer and manufacturing method thereof
WO2016064350A1 (en) * 2014-10-23 2016-04-28 Agency For Science, Technology And Research Method of bonding a first substrate and a second substrate
KR102458034B1 (ko) 2015-10-16 2022-10-25 삼성전자주식회사 반도체 패키지, 반도체 패키지의 제조방법, 및 반도체 모듈
US10597486B2 (en) 2016-11-02 2020-03-24 Seagate Technology Llc Encapsulant composition for use with electrical components in hard disk drives, and related electrical components and hard disk drives
US10163847B2 (en) * 2017-03-03 2018-12-25 Tdk Corporation Method for producing semiconductor package
CN108538726B (zh) * 2017-03-03 2022-08-26 Tdk株式会社 半导体芯片的制造方法
US11304303B2 (en) * 2020-04-30 2022-04-12 Dujud Llc Methods and processes for forming electrical circuitries on three-dimensional geometries

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274913A (en) 1991-10-25 1994-01-04 International Business Machines Corporation Method of fabricating a reworkable module
US5956605A (en) * 1996-09-20 1999-09-21 Micron Technology, Inc. Use of nitrides for flip-chip encapsulation
JPH10178121A (ja) * 1996-12-18 1998-06-30 Toshiba Corp 半導体パッケージ用金属ボール配設板、半導体装置及びその製造方法
AU8502798A (en) * 1997-07-21 1999-02-10 Aguila Technologies, Inc. Semiconductor flip-chip package and method for the fabrication thereof
JP3876953B2 (ja) * 1998-03-27 2007-02-07 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
US6100114A (en) 1998-08-10 2000-08-08 International Business Machines Corporation Encapsulation of solder bumps and solder connections
US6281452B1 (en) 1998-12-03 2001-08-28 International Business Machines Corporation Multi-level thin-film electronic packaging structure and related method
US6225206B1 (en) * 1999-05-10 2001-05-01 International Business Machines Corporation Flip chip C4 extension structure and process
JP2001007502A (ja) * 1999-06-23 2001-01-12 Sony Corp 電子部品パッケージの接続構造及び接続方法
JP2001127108A (ja) 1999-10-25 2001-05-11 Hitachi Ltd 半導体装置
US6700209B1 (en) * 1999-12-29 2004-03-02 Intel Corporation Partial underfill for flip-chip electronic packages
JP2001339012A (ja) 2000-05-30 2001-12-07 Nec Kyushu Ltd 半導体装置およびその製造方法
US6680436B2 (en) * 2000-07-12 2004-01-20 Seagate Technology Llc Reflow encapsulant
US6573122B2 (en) 2001-03-28 2003-06-03 International Rectifier Corporation Wafer level insulation underfill for die attach
JP2001313315A (ja) * 2001-04-25 2001-11-09 Hitachi Ltd 実装用半導体装置とその実装方法
CN1383197A (zh) * 2001-04-25 2002-12-04 松下电器产业株式会社 半导体装置的制造方法及半导体装置
TW544826B (en) * 2001-05-18 2003-08-01 Nec Electronics Corp Flip-chip-type semiconductor device and manufacturing method thereof
JP3708478B2 (ja) * 2001-11-20 2005-10-19 松下電器産業株式会社 電子部品の実装方法
JP2003234362A (ja) * 2002-02-12 2003-08-22 Yokogawa Electric Corp 半導体装置
TW540123B (en) 2002-06-14 2003-07-01 Siliconware Precision Industries Co Ltd Flip-chip semiconductor package with lead frame as chip carrier
JP2004103928A (ja) * 2002-09-11 2004-04-02 Fujitsu Ltd 基板及びハンダボールの形成方法及びその実装構造
US6921860B2 (en) * 2003-03-18 2005-07-26 Micron Technology, Inc. Microelectronic component assemblies having exposed contacts

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