JP2006295019A5 - - Google Patents

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Publication number
JP2006295019A5
JP2006295019A5 JP2005116518A JP2005116518A JP2006295019A5 JP 2006295019 A5 JP2006295019 A5 JP 2006295019A5 JP 2005116518 A JP2005116518 A JP 2005116518A JP 2005116518 A JP2005116518 A JP 2005116518A JP 2006295019 A5 JP2006295019 A5 JP 2006295019A5
Authority
JP
Japan
Prior art keywords
substrate
electronic component
grid array
array structure
ball grid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005116518A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006295019A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005116518A priority Critical patent/JP2006295019A/ja
Priority claimed from JP2005116518A external-priority patent/JP2006295019A/ja
Priority to TW094125733A priority patent/TW200637450A/zh
Priority to US11/191,986 priority patent/US20060231541A1/en
Priority to CNA2005100978119A priority patent/CN1849041A/zh
Publication of JP2006295019A publication Critical patent/JP2006295019A/ja
Publication of JP2006295019A5 publication Critical patent/JP2006295019A5/ja
Withdrawn legal-status Critical Current

Links

JP2005116518A 2005-04-14 2005-04-14 電子部品を基板に取り付け及び取り外す加熱装置 Withdrawn JP2006295019A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005116518A JP2006295019A (ja) 2005-04-14 2005-04-14 電子部品を基板に取り付け及び取り外す加熱装置
TW094125733A TW200637450A (en) 2005-04-14 2005-07-29 Heater that attaches electronic component to and detaches the same from substrate
US11/191,986 US20060231541A1 (en) 2005-04-14 2005-07-29 Heater that attaches electronic component to and detaches the same from substrate
CNA2005100978119A CN1849041A (zh) 2005-04-14 2005-08-29 将电子组件连接到基板上并将其从基板上取下的加热器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005116518A JP2006295019A (ja) 2005-04-14 2005-04-14 電子部品を基板に取り付け及び取り外す加熱装置

Publications (2)

Publication Number Publication Date
JP2006295019A JP2006295019A (ja) 2006-10-26
JP2006295019A5 true JP2006295019A5 (enExample) 2008-04-03

Family

ID=37078350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005116518A Withdrawn JP2006295019A (ja) 2005-04-14 2005-04-14 電子部品を基板に取り付け及び取り外す加熱装置

Country Status (4)

Country Link
US (1) US20060231541A1 (enExample)
JP (1) JP2006295019A (enExample)
CN (1) CN1849041A (enExample)
TW (1) TW200637450A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202005001163U1 (de) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Leiterplatte oder Platine mit Heizdraht
KR100690391B1 (ko) * 2005-04-21 2007-03-09 임형수 주사바늘 없는 혈액투석용 션트 장치
JP5105053B2 (ja) * 2007-05-14 2012-12-19 日本電気株式会社 支持体、該支持体を用いた電気部品搭載プリント配線基板、該電気部品搭載プリント配線基板の製造方法
US8109586B2 (en) 2007-09-04 2012-02-07 Hewlett-Packard Development Company, L.P. Fluid ejection device
KR101660787B1 (ko) 2009-09-23 2016-10-11 삼성전자주식회사 솔더 볼 접합 방법 및 메모리 모듈 리페어 방법
US9125301B2 (en) * 2011-10-18 2015-09-01 Integrated Microwave Corporation Integral heater assembly and method for carrier or host board of electronic package assembly
JP6032070B2 (ja) * 2013-03-13 2016-11-24 ソニー株式会社 半導体装置、半導体装置の製造方法
CN106104795B (zh) * 2014-03-29 2019-03-08 英特尔公司 使用局部热源的集成电路芯片附接
JP6357874B2 (ja) * 2014-05-27 2018-07-18 富士電機株式会社 半導体モジュールの取付方法及びこの方法に使用される半導体モジュール半田付け用治工具
US20170179066A1 (en) * 2015-12-18 2017-06-22 Russell S. Aoki Bulk solder removal on processor packaging
US10178763B2 (en) * 2015-12-21 2019-01-08 Intel Corporation Warpage mitigation in printed circuit board assemblies
US20170178994A1 (en) * 2015-12-21 2017-06-22 Intel Corporation Integrated circuit package support structures
US10260961B2 (en) 2015-12-21 2019-04-16 Intel Corporation Integrated circuit packages with temperature sensor traces
US10880994B2 (en) 2016-06-02 2020-12-29 Intel Corporation Top-side connector interface for processor packaging
TWI718812B (zh) * 2019-12-17 2021-02-11 台灣愛司帝科技股份有限公司 微加熱器晶片、晶圓級電子晶片組件以及晶片組件堆疊系統

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3038644B2 (ja) * 1996-07-17 2000-05-08 日本特殊陶業株式会社 中継基板、その製造方法、中継基板付き基板、基板と中継基板と取付基板とからなる構造体、その製造方法およびその構造体の分解方法
US6121576A (en) * 1998-09-02 2000-09-19 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array
US6448575B1 (en) * 1999-10-08 2002-09-10 Teradyne, Inc. Temperature control structure
JP3651413B2 (ja) * 2001-05-21 2005-05-25 日立電線株式会社 半導体装置用テープキャリア及びそれを用いた半導体装置、半導体装置用テープキャリアの製造方法及び半導体装置の製造方法
TW536768B (en) * 2001-08-03 2003-06-11 Matsushita Electric Industrial Co Ltd Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method

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