JP2006295019A - 電子部品を基板に取り付け及び取り外す加熱装置 - Google Patents

電子部品を基板に取り付け及び取り外す加熱装置 Download PDF

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Publication number
JP2006295019A
JP2006295019A JP2005116518A JP2005116518A JP2006295019A JP 2006295019 A JP2006295019 A JP 2006295019A JP 2005116518 A JP2005116518 A JP 2005116518A JP 2005116518 A JP2005116518 A JP 2005116518A JP 2006295019 A JP2006295019 A JP 2006295019A
Authority
JP
Japan
Prior art keywords
substrate
electronic component
heating element
heating
heating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005116518A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006295019A5 (enExample
Inventor
Michiaki Takada
理映 高田
Kenichiro Tsubone
健一郎 坪根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2005116518A priority Critical patent/JP2006295019A/ja
Priority to TW094125733A priority patent/TW200637450A/zh
Priority to US11/191,986 priority patent/US20060231541A1/en
Priority to CNA2005100978119A priority patent/CN1849041A/zh
Publication of JP2006295019A publication Critical patent/JP2006295019A/ja
Publication of JP2006295019A5 publication Critical patent/JP2006295019A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2005116518A 2005-04-14 2005-04-14 電子部品を基板に取り付け及び取り外す加熱装置 Withdrawn JP2006295019A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005116518A JP2006295019A (ja) 2005-04-14 2005-04-14 電子部品を基板に取り付け及び取り外す加熱装置
TW094125733A TW200637450A (en) 2005-04-14 2005-07-29 Heater that attaches electronic component to and detaches the same from substrate
US11/191,986 US20060231541A1 (en) 2005-04-14 2005-07-29 Heater that attaches electronic component to and detaches the same from substrate
CNA2005100978119A CN1849041A (zh) 2005-04-14 2005-08-29 将电子组件连接到基板上并将其从基板上取下的加热器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005116518A JP2006295019A (ja) 2005-04-14 2005-04-14 電子部品を基板に取り付け及び取り外す加熱装置

Publications (2)

Publication Number Publication Date
JP2006295019A true JP2006295019A (ja) 2006-10-26
JP2006295019A5 JP2006295019A5 (enExample) 2008-04-03

Family

ID=37078350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005116518A Withdrawn JP2006295019A (ja) 2005-04-14 2005-04-14 電子部品を基板に取り付け及び取り外す加熱装置

Country Status (4)

Country Link
US (1) US20060231541A1 (enExample)
JP (1) JP2006295019A (enExample)
CN (1) CN1849041A (enExample)
TW (1) TW200637450A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008283109A (ja) * 2007-05-14 2008-11-20 Nec Corp 支持体、該支持体を用いた電気部品搭載プリント配線基板、該電気部品搭載プリント配線基板の製造方法
KR20110032492A (ko) * 2009-09-23 2011-03-30 삼성전자주식회사 솔더 볼 접합 방법 및 메모리 모듈 리페어 방법
JP2015225911A (ja) * 2014-05-27 2015-12-14 富士電機株式会社 半導体モジュールの取付方法及びこの方法によって取り付けた半導体モジュールを有する電力変換装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202005001163U1 (de) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Leiterplatte oder Platine mit Heizdraht
KR100690391B1 (ko) * 2005-04-21 2007-03-09 임형수 주사바늘 없는 혈액투석용 션트 장치
US8109586B2 (en) 2007-09-04 2012-02-07 Hewlett-Packard Development Company, L.P. Fluid ejection device
US9125301B2 (en) * 2011-10-18 2015-09-01 Integrated Microwave Corporation Integral heater assembly and method for carrier or host board of electronic package assembly
JP6032070B2 (ja) * 2013-03-13 2016-11-24 ソニー株式会社 半導体装置、半導体装置の製造方法
CN106104795B (zh) * 2014-03-29 2019-03-08 英特尔公司 使用局部热源的集成电路芯片附接
US20170179066A1 (en) * 2015-12-18 2017-06-22 Russell S. Aoki Bulk solder removal on processor packaging
US10178763B2 (en) * 2015-12-21 2019-01-08 Intel Corporation Warpage mitigation in printed circuit board assemblies
US20170178994A1 (en) * 2015-12-21 2017-06-22 Intel Corporation Integrated circuit package support structures
US10260961B2 (en) 2015-12-21 2019-04-16 Intel Corporation Integrated circuit packages with temperature sensor traces
US10880994B2 (en) 2016-06-02 2020-12-29 Intel Corporation Top-side connector interface for processor packaging
TWI718812B (zh) * 2019-12-17 2021-02-11 台灣愛司帝科技股份有限公司 微加熱器晶片、晶圓級電子晶片組件以及晶片組件堆疊系統

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3038644B2 (ja) * 1996-07-17 2000-05-08 日本特殊陶業株式会社 中継基板、その製造方法、中継基板付き基板、基板と中継基板と取付基板とからなる構造体、その製造方法およびその構造体の分解方法
US6121576A (en) * 1998-09-02 2000-09-19 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array
US6448575B1 (en) * 1999-10-08 2002-09-10 Teradyne, Inc. Temperature control structure
JP3651413B2 (ja) * 2001-05-21 2005-05-25 日立電線株式会社 半導体装置用テープキャリア及びそれを用いた半導体装置、半導体装置用テープキャリアの製造方法及び半導体装置の製造方法
TW536768B (en) * 2001-08-03 2003-06-11 Matsushita Electric Industrial Co Ltd Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008283109A (ja) * 2007-05-14 2008-11-20 Nec Corp 支持体、該支持体を用いた電気部品搭載プリント配線基板、該電気部品搭載プリント配線基板の製造方法
KR20110032492A (ko) * 2009-09-23 2011-03-30 삼성전자주식회사 솔더 볼 접합 방법 및 메모리 모듈 리페어 방법
US8070048B2 (en) 2009-09-23 2011-12-06 Samsung Electronics Co., Ltd. Method of attaching a solder ball and method of repairing a memory module
KR101660787B1 (ko) 2009-09-23 2016-10-11 삼성전자주식회사 솔더 볼 접합 방법 및 메모리 모듈 리페어 방법
JP2015225911A (ja) * 2014-05-27 2015-12-14 富士電機株式会社 半導体モジュールの取付方法及びこの方法によって取り付けた半導体モジュールを有する電力変換装置

Also Published As

Publication number Publication date
CN1849041A (zh) 2006-10-18
US20060231541A1 (en) 2006-10-19
TW200637450A (en) 2006-10-16

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