JP2004245751A5 - - Google Patents

Download PDF

Info

Publication number
JP2004245751A5
JP2004245751A5 JP2003037503A JP2003037503A JP2004245751A5 JP 2004245751 A5 JP2004245751 A5 JP 2004245751A5 JP 2003037503 A JP2003037503 A JP 2003037503A JP 2003037503 A JP2003037503 A JP 2003037503A JP 2004245751 A5 JP2004245751 A5 JP 2004245751A5
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
solder
printed
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003037503A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004245751A (ja
JP4016389B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003037503A priority Critical patent/JP4016389B2/ja
Priority claimed from JP2003037503A external-priority patent/JP4016389B2/ja
Publication of JP2004245751A publication Critical patent/JP2004245751A/ja
Publication of JP2004245751A5 publication Critical patent/JP2004245751A5/ja
Application granted granted Critical
Publication of JP4016389B2 publication Critical patent/JP4016389B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003037503A 2003-02-14 2003-02-14 プリント配線基板の検査装置及び検査方法 Expired - Fee Related JP4016389B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003037503A JP4016389B2 (ja) 2003-02-14 2003-02-14 プリント配線基板の検査装置及び検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003037503A JP4016389B2 (ja) 2003-02-14 2003-02-14 プリント配線基板の検査装置及び検査方法

Publications (3)

Publication Number Publication Date
JP2004245751A JP2004245751A (ja) 2004-09-02
JP2004245751A5 true JP2004245751A5 (enExample) 2005-08-04
JP4016389B2 JP4016389B2 (ja) 2007-12-05

Family

ID=33022285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003037503A Expired - Fee Related JP4016389B2 (ja) 2003-02-14 2003-02-14 プリント配線基板の検査装置及び検査方法

Country Status (1)

Country Link
JP (1) JP4016389B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007114334A1 (ja) * 2006-03-31 2009-08-20 パナソニック株式会社 回路基板、回路基板の検査方法、およびその製造方法
JP2009053084A (ja) * 2007-08-28 2009-03-12 East Japan Railway Co 温度センサ
EP4517286A1 (de) * 2023-08-30 2025-03-05 Siemens Aktiengesellschaft Temperaturereignis-detektionsstruktur und -verfahren

Similar Documents

Publication Publication Date Title
US8338715B2 (en) PCB with soldering pad projections forming fillet solder joints and method of production thereof
ATE534269T1 (de) Verfahren zum aufbau von oberflächen- elektronikvorrichtungen
JP5458966B2 (ja) 温度検出素子の実装構造
JP2006295019A5 (enExample)
JP2004245751A5 (enExample)
US9485850B2 (en) Circuit device and method of manufacturing the same
JP2008205335A (ja) 回路基板、携帯電子機器及び回路基板の製造方法
JP2007305615A (ja) スルーホールのはんだ付け構造
JP2012089742A (ja) 電子装置の製造方法
US12491572B2 (en) Heating device
KR101000573B1 (ko) 반도체 패키지 실장용 인쇄회로기판
JP2014165235A (ja) 回路基板及び接続構造
KR101237483B1 (ko) 인쇄회로기판 제조 방법
JPH11298099A (ja) 回路基板
JP2006156819A (ja) 電子部品
JP2007207868A (ja) 配線基板
JP2008028213A (ja) 回路基板及びその検査方法
JP2010080770A (ja) 電子回路モジュールおよびその検査方法
JP6400318B2 (ja) チップ部品及びその製造方法
JP5668621B2 (ja) 電子部品の実装構造
KR100575885B1 (ko) 반도체 칩 패키지용 회로 기판 및 이의 제조 방법
KR101128146B1 (ko) 인쇄회로기판
JP2007266178A (ja) プリント配線基板
JP2010092919A (ja) プリント基板及びそのはんだ上がり確認方法
JPH098434A (ja) 電子回路ユニット及びその製造方法