JP4016389B2 - プリント配線基板の検査装置及び検査方法 - Google Patents

プリント配線基板の検査装置及び検査方法 Download PDF

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Publication number
JP4016389B2
JP4016389B2 JP2003037503A JP2003037503A JP4016389B2 JP 4016389 B2 JP4016389 B2 JP 4016389B2 JP 2003037503 A JP2003037503 A JP 2003037503A JP 2003037503 A JP2003037503 A JP 2003037503A JP 4016389 B2 JP4016389 B2 JP 4016389B2
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JP
Japan
Prior art keywords
solder
temperature
printed wiring
wiring board
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003037503A
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English (en)
Japanese (ja)
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JP2004245751A (ja
JP2004245751A5 (enExample
Inventor
篤志 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Electronics Inc
Original Assignee
Canon Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Electronics Inc filed Critical Canon Electronics Inc
Priority to JP2003037503A priority Critical patent/JP4016389B2/ja
Publication of JP2004245751A publication Critical patent/JP2004245751A/ja
Publication of JP2004245751A5 publication Critical patent/JP2004245751A5/ja
Application granted granted Critical
Publication of JP4016389B2 publication Critical patent/JP4016389B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
    • G01K11/06—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using melting, freezing, or softening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2003037503A 2003-02-14 2003-02-14 プリント配線基板の検査装置及び検査方法 Expired - Fee Related JP4016389B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003037503A JP4016389B2 (ja) 2003-02-14 2003-02-14 プリント配線基板の検査装置及び検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003037503A JP4016389B2 (ja) 2003-02-14 2003-02-14 プリント配線基板の検査装置及び検査方法

Publications (3)

Publication Number Publication Date
JP2004245751A JP2004245751A (ja) 2004-09-02
JP2004245751A5 JP2004245751A5 (enExample) 2005-08-04
JP4016389B2 true JP4016389B2 (ja) 2007-12-05

Family

ID=33022285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003037503A Expired - Fee Related JP4016389B2 (ja) 2003-02-14 2003-02-14 プリント配線基板の検査装置及び検査方法

Country Status (1)

Country Link
JP (1) JP4016389B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007114334A1 (ja) * 2006-03-31 2009-08-20 パナソニック株式会社 回路基板、回路基板の検査方法、およびその製造方法
JP2009053084A (ja) * 2007-08-28 2009-03-12 East Japan Railway Co 温度センサ
EP4517286A1 (de) * 2023-08-30 2025-03-05 Siemens Aktiengesellschaft Temperaturereignis-detektionsstruktur und -verfahren

Also Published As

Publication number Publication date
JP2004245751A (ja) 2004-09-02

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