JP2009218358A5 - - Google Patents

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Publication number
JP2009218358A5
JP2009218358A5 JP2008059852A JP2008059852A JP2009218358A5 JP 2009218358 A5 JP2009218358 A5 JP 2009218358A5 JP 2008059852 A JP2008059852 A JP 2008059852A JP 2008059852 A JP2008059852 A JP 2008059852A JP 2009218358 A5 JP2009218358 A5 JP 2009218358A5
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JP
Japan
Prior art keywords
top plate
pressing member
mounting
pressing
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008059852A
Other languages
English (en)
Japanese (ja)
Other versions
JP4948452B2 (ja
JP2009218358A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008059852A priority Critical patent/JP4948452B2/ja
Priority claimed from JP2008059852A external-priority patent/JP4948452B2/ja
Priority to US12/401,297 priority patent/US20090227136A1/en
Publication of JP2009218358A publication Critical patent/JP2009218358A/ja
Publication of JP2009218358A5 publication Critical patent/JP2009218358A5/ja
Application granted granted Critical
Publication of JP4948452B2 publication Critical patent/JP4948452B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008059852A 2008-03-10 2008-03-10 表面実装デバイスの実装構造体、及び表面実装デバイスの補強実装方法 Expired - Fee Related JP4948452B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008059852A JP4948452B2 (ja) 2008-03-10 2008-03-10 表面実装デバイスの実装構造体、及び表面実装デバイスの補強実装方法
US12/401,297 US20090227136A1 (en) 2008-03-10 2009-03-10 Mounting structure for surface mounted device and method of firmly mounting surface mounted device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008059852A JP4948452B2 (ja) 2008-03-10 2008-03-10 表面実装デバイスの実装構造体、及び表面実装デバイスの補強実装方法

Publications (3)

Publication Number Publication Date
JP2009218358A JP2009218358A (ja) 2009-09-24
JP2009218358A5 true JP2009218358A5 (enExample) 2011-01-27
JP4948452B2 JP4948452B2 (ja) 2012-06-06

Family

ID=41054081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008059852A Expired - Fee Related JP4948452B2 (ja) 2008-03-10 2008-03-10 表面実装デバイスの実装構造体、及び表面実装デバイスの補強実装方法

Country Status (2)

Country Link
US (1) US20090227136A1 (enExample)
JP (1) JP4948452B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5173029B2 (ja) * 2009-09-17 2013-03-27 株式会社東芝 電子機器
KR102540241B1 (ko) * 2018-02-21 2023-06-08 삼성전자주식회사 자성체로부터 발생하는 자기력의 적어도 일부를 차폐하기 위한 차폐 부재 및 차폐 부재와 연결된 비자성체 속성을 갖는 연결부를 포함하는 전자 장치
EP4117407A1 (en) 2018-02-21 2023-01-11 Samsung Electronics Co., Ltd. Electronic device including shield member for shielding at least part of magnetic force generated by magnetic substance and connection portion including property of nonmagnetic substance connected to shield member
CN111246666B (zh) * 2020-03-11 2021-03-26 乐清市日精电气有限公司 一种光电ic输出光学开关
US12249589B2 (en) * 2022-06-06 2025-03-11 Nvidia Corporation Apparatus and method for BGA coplanarity and warpage control

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5724775U (enExample) * 1980-07-17 1982-02-08
JPS59145595A (ja) * 1983-02-09 1984-08-21 松下電器産業株式会社 電子部品の保持装置
JPS6451288A (en) * 1987-08-24 1989-02-27 Fanuc Ltd Calibrating apparatus for industrial robot
US4878846A (en) * 1988-04-06 1989-11-07 Schroeder Jon M Electronic circuit chip connection assembly and method
EP0431707A3 (en) * 1989-12-08 1991-10-02 Shell Internationale Research Maatschappij B.V. Heterocyclic compounds
CA2072377A1 (en) * 1991-07-12 1993-01-13 Masanori Nishiguchi Semiconductor chip module and method of manufacturing the same
US5502397A (en) * 1992-11-12 1996-03-26 Advanced Micro Devices, Inc. Integrated circuit testing apparatus and method
US5984293A (en) * 1997-06-25 1999-11-16 Mcms, Inc. Apparatus for holding printed circuit board assemblies in manufacturing processes
JPH11163494A (ja) * 1997-11-28 1999-06-18 Toshiba Corp 表面実装デバイスの実装方法、ｂｇａパッケージの実装構造、及び電子機器
US6071756A (en) * 1998-08-20 2000-06-06 Lockheed Martin Corporation Method for holding components in place during soldering
US6726195B1 (en) * 1998-10-13 2004-04-27 Dek International Gmbh Method for ensuring planarity when using a flexible, self conforming, workpiece support system
US6255730B1 (en) * 1999-04-30 2001-07-03 Agilent Technologies, Inc. Integrated low cost thick film RF module
US20020008963A1 (en) * 1999-07-15 2002-01-24 Dibene, Ii Joseph T. Inter-circuit encapsulated packaging
JP2003023248A (ja) * 2001-07-05 2003-01-24 Nitto Denko Corp 多層フレキシブル配線回路基板およびその製造方法
US7030485B2 (en) * 2003-06-26 2006-04-18 Intel Corporation Thermal interface structure with integrated liquid cooling and methods
JP4098261B2 (ja) * 2004-03-05 2008-06-11 松下電器産業株式会社 曲げ装置

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