JP2012238903A5 - - Google Patents
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- Publication number
- JP2012238903A5 JP2012238903A5 JP2012179087A JP2012179087A JP2012238903A5 JP 2012238903 A5 JP2012238903 A5 JP 2012238903A5 JP 2012179087 A JP2012179087 A JP 2012179087A JP 2012179087 A JP2012179087 A JP 2012179087A JP 2012238903 A5 JP2012238903 A5 JP 2012238903A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- electronic component
- wiring
- anisotropic conductive
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- VTLYHLREPCPDKX-UHFFFAOYSA-N 1,2-dichloro-3-(2,3-dichlorophenyl)benzene Chemical group ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1Cl VTLYHLREPCPDKX-UHFFFAOYSA-N 0.000 description 7
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012179087A JP5429334B2 (ja) | 2012-08-10 | 2012-08-10 | 配線板モジュール及び該配線板モジュールの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012179087A JP5429334B2 (ja) | 2012-08-10 | 2012-08-10 | 配線板モジュール及び該配線板モジュールの製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007072720A Division JP2008235556A (ja) | 2007-03-20 | 2007-03-20 | 配線板モジュール及び該配線板モジュールの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012238903A JP2012238903A (ja) | 2012-12-06 |
| JP2012238903A5 true JP2012238903A5 (enExample) | 2013-08-01 |
| JP5429334B2 JP5429334B2 (ja) | 2014-02-26 |
Family
ID=47461464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012179087A Active JP5429334B2 (ja) | 2012-08-10 | 2012-08-10 | 配線板モジュール及び該配線板モジュールの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5429334B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6705244B2 (ja) * | 2016-03-25 | 2020-06-03 | 大日本印刷株式会社 | フレキシブル回路コネクタ、回路装置および情報記録装置 |
| WO2022004080A1 (ja) * | 2020-07-02 | 2022-01-06 | 株式会社村田製作所 | アンテナモジュール、接続部材、およびそれを搭載した通信装置 |
| CN115803964A (zh) * | 2020-07-02 | 2023-03-14 | 株式会社村田制作所 | 天线模块、连接构件以及搭载有天线模块的通信装置 |
| KR102843210B1 (ko) | 2020-10-05 | 2025-08-05 | 삼성전자주식회사 | 디스플레이 장치 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0723267A (ja) * | 1993-06-30 | 1995-01-24 | Sony Corp | 電子機器及び撮像装置 |
| JP4627125B2 (ja) * | 2001-07-27 | 2011-02-09 | 三井化学株式会社 | 異方性導電ペースト |
| JP4433449B2 (ja) * | 2001-11-09 | 2010-03-17 | 住友電気工業株式会社 | 異方導電膜とその製造方法 |
| JP2004063710A (ja) * | 2002-07-29 | 2004-02-26 | Hitachi Cable Ltd | 配線板および電子装置、ならびに配線板の製造方法および電子装置の製造方法 |
| EP1885168A1 (en) * | 2005-05-25 | 2008-02-06 | Matsushita Electric Industrial Co., Ltd. | Circuit substrate connection structure and circuit substrate connection method |
-
2012
- 2012-08-10 JP JP2012179087A patent/JP5429334B2/ja active Active
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