JP5597564B2 - プローブ装置及びその製造方法 - Google Patents
プローブ装置及びその製造方法 Download PDFInfo
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- JP5597564B2 JP5597564B2 JP2011022590A JP2011022590A JP5597564B2 JP 5597564 B2 JP5597564 B2 JP 5597564B2 JP 2011022590 A JP2011022590 A JP 2011022590A JP 2011022590 A JP2011022590 A JP 2011022590A JP 5597564 B2 JP5597564 B2 JP 5597564B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
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- 238000012360 testing method Methods 0.000 description 44
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- 238000010521 absorption reaction Methods 0.000 description 6
- 238000007689 inspection Methods 0.000 description 6
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- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000002783 friction material Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
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- 230000006835 compression Effects 0.000 description 1
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- 239000013039 cover film Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Toxicology (AREA)
- Measuring Leads Or Probes (AREA)
- Liquid Crystal (AREA)
- Surgical Instruments (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
44,144 配線シート
44b 延在部
46 支持体
48,248 間隔維持部材
56 配線
58 接触電極
60 集積回路チップ
64,264 接着材
66 ストッパ
67 弾性部材
68 表面層
100 貼り付け治具
Claims (12)
- 可撓性を有する配線シートであって、該配線シートの一方の面に設けられ、かつ第1の方向に間隔をおいて該第1の方向に交差する第2の方向に延びる複数の配線と、該配線に設けられた複数の接触電極とを備える配線シートと、
前記配線シートを支持する支持体と、
前記配線シートより低い熱膨張係数及び高い剛性を有する間隔維持部材であって、前記配線シートに取り付けられて、前記配線シートが膨張した状態に前記複数の配線相互の間隔を維持する間隔維持部材とを含み、
前記間隔維持部材は、前記配線シートに対向して前記配線を覆う平面を備え、かつ該平面において接着材により前記配線シートに接着されている、プローブ装置。 - 前記間隔維持部材はガラス製の板状部材を備え、前記接着材は熱硬化性を有する、請求項1に記載のプローブ装置。
- 前記間隔維持部材は、前記接触電極が設けられた領域に対応する前記配線シートの他方の面に取り付けられている、請求項1又は2に記載のプローブ装置。
- 前記間隔維持部材は前記配線シートの一方の面に取り付けられている、請求項1又は2に記載のプローブ装置。
- 前記配線シートは前記支持体から延びる延在部を備え、前記接触電極は前記延在部に設けられている、請求項1から4のいずれか1項に記載のプローブ装置。
- さらに、前記支持体に取り付けられたストッパであって、前記配線シートの前記接触電極が被検査体の電極に押されたとき、前記配線シートの前記延在部の前記接触電極と反対側の部位が当接することを許すストッパを含む、請求項5に記載のプローブ装置。
- 前記間隔維持部材は前記延在部に取り付けられている、請求項6に記載のプローブ装置。
- 前記ストッパは、弾性を有する弾性部材と、前記配線シートが接触可能に前記弾性部材に設けられた表面層であって、前記表面層と前記配線シートとの間の摩擦を低減する表面層を備える、請求項7に記載のプローブ装置。
- 前記配線シートは、さらに、前記配線に電気的に接続された集積回路チップを備える、請求項1から8のいずれか1項に記載のプローブ装置。
- 可撓性を有する配線シートであって、該配線シートの一方の面に設けられ、かつ第1の方向に間隔をおいて該第1の方向に交差する第2の方向に延びる複数の配線と、該配線に設けられた複数の接触電極とを備える配線シートを加熱膨張させて、前記配線シートより低い熱膨張係数及び高い剛性を有する間隔維持部材であって、前記配線の間隔を維持する間隔維持部材を前記配線シートに取り付ける第1の工程と、
前記配線シートを支持体に取り付ける第2の工程とを含み、
前記第1の工程は、前記間隔維持部材を熱硬化性の接着材により前記配線シートに取り付けるべく、前記配線シートを加熱膨張させる熱により前記熱硬化性の接着材を硬化させることで前記間隔維持部材を前記配線シートに接着することを含む、プローブ装置の製造方法。 - 前記第1の工程は、前記配線シートを加熱膨張させると同時に、前記配線シートを前記間隔維持部材に押圧することを含む、請求項10に記載のプローブ装置の製造方法。
- 前記第1の工程は、前記間隔維持部材を貼り付け治具に配置する第3の工程と、前記間隔維持部材の上に前記熱硬化性の接着材を配置する第4の工程と、前記間隔維持部材及び前記熱硬化性の接着材の上に前記配線シートを配置する第5の工程と、前記配線シートの上方から貼り付け装置により前記配線シート、前記熱硬化性の接着材及び前記間隔維持部材を加熱及び押圧する第6の工程とを含む、請求項10に記載のプローブ装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011022590A JP5597564B2 (ja) | 2011-02-04 | 2011-02-04 | プローブ装置及びその製造方法 |
TW100146171A TWI434046B (zh) | 2011-02-04 | 2011-12-14 | Probe device and manufacturing method thereof |
KR1020110139188A KR101231700B1 (ko) | 2011-02-04 | 2011-12-21 | 프로브 장치 및 그 제조방법 |
CN2012100129028A CN102628879A (zh) | 2011-02-04 | 2012-01-16 | 探测装置及其制造方法 |
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JP2011022590A JP5597564B2 (ja) | 2011-02-04 | 2011-02-04 | プローブ装置及びその製造方法 |
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JP2012163397A JP2012163397A (ja) | 2012-08-30 |
JP5597564B2 true JP5597564B2 (ja) | 2014-10-01 |
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JP (1) | JP5597564B2 (ja) |
KR (1) | KR101231700B1 (ja) |
CN (1) | CN102628879A (ja) |
TW (1) | TWI434046B (ja) |
Families Citing this family (3)
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CA2905121C (en) | 2013-03-12 | 2021-10-26 | Mary Kay Inc. | Preservative system |
KR101574530B1 (ko) * | 2014-07-31 | 2015-12-04 | 임근환 | 전자 부품 특성 검사용 프로브, 및 이에 사용되는 cof 제조 방법 |
CN110346617A (zh) * | 2019-07-23 | 2019-10-18 | 深圳市卓精微智能机器人设备有限公司 | 一种管装ic的烧录与测试针座 |
Family Cites Families (12)
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WO2001036987A1 (fr) * | 1999-11-16 | 2001-05-25 | Toray Engineering Co., Ltd. | Sonde, son procede de fabrication, et procede de verification d'un substrat a l'aide de la sonde |
JP3866058B2 (ja) * | 2001-07-05 | 2007-01-10 | シャープ株式会社 | 半導体装置、配線基板及びテープキャリア |
JP2004212068A (ja) * | 2002-12-26 | 2004-07-29 | Tokyo Cathode Laboratory Co Ltd | 両端接触型多ピンループプローブ及び両端接触型多ピンループプローブを含む測定器具 |
TWI239685B (en) * | 2003-05-13 | 2005-09-11 | Jsr Corp | Flaky probe, its manufacturing method and its application |
JP2006064647A (ja) * | 2004-08-30 | 2006-03-09 | Optonix Seimitsu:Kk | 電子回路検査用プローブ |
JP2006098344A (ja) * | 2004-09-30 | 2006-04-13 | Kobe Steel Ltd | プローブカード |
JP2006284362A (ja) | 2005-03-31 | 2006-10-19 | Nhk Spring Co Ltd | コンタクトプローブ |
KR100720378B1 (ko) | 2005-04-13 | 2007-05-22 | 주식회사 코디에스 | 액정 디스플레이 패널 검사용 프로브 유니트 |
JP5364240B2 (ja) * | 2007-03-20 | 2013-12-11 | 株式会社日本マイクロニクス | プローブユニット及び検査装置 |
TW201107757A (en) * | 2009-08-26 | 2011-03-01 | Kodi S Co Ltd | Contact-type integrated circuit probe unit for inspecting monitor and manufacture method thereof |
KR20110133279A (ko) * | 2010-06-04 | 2011-12-12 | 티에스씨멤시스(주) | 평판 표시 소자 검사 조립체 |
KR20120009241A (ko) * | 2010-07-23 | 2012-02-01 | 주식회사 코디에스 | 필름타입의 프로브 장치 및 프로브 제조방법 |
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2011
- 2011-02-04 JP JP2011022590A patent/JP5597564B2/ja active Active
- 2011-12-14 TW TW100146171A patent/TWI434046B/zh active
- 2011-12-21 KR KR1020110139188A patent/KR101231700B1/ko active IP Right Grant
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2012
- 2012-01-16 CN CN2012100129028A patent/CN102628879A/zh active Pending
Also Published As
Publication number | Publication date |
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KR20120090754A (ko) | 2012-08-17 |
KR101231700B1 (ko) | 2013-02-12 |
JP2012163397A (ja) | 2012-08-30 |
TW201234018A (en) | 2012-08-16 |
CN102628879A (zh) | 2012-08-08 |
TWI434046B (zh) | 2014-04-11 |
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