201107757 六、發明說明： 【發明所屬之技術領域】 本發明係一種檢查平面顯示器的接觸式積體電路探針單 元（ProbeUnit)及它的製造方法，係一種透過延展積體電路 軟板的第一電極部，使該第一電極部之電極間距（padpitch) 與平面顯示器的電極板（pad) —致之後進行接觸的方法。 【先前技術】 一般來講，製造平面顯示器及半導體的工程需要進行電氣 訊號檢測。 ^ 其中平面顯示器所進行的3項工程：將液晶注入TFT基板 與彩色濾光片（color f i 1 ter )之間（此步驟為Cel丨段工程）、 之後貼上裝有驅動ic之積體電路軟板（此步驟為模組m〇dule 工程），然後組裝框架（Frame)(此步驟為Set工程）.其中 在施行模組工程前，需進行電氣訊號檢測。 模組(module)工程尚未進行之前，可先將完成CeU段工 程的平面顯示器電極板（Pad)跟積體電路軟板的電極板（pad) 接觸之後，導通電氣訊號進行認可檢測，針對Cell段品質優 良的面板（panel)進行模組工程。 為了施行電氣訊號檢測，需使用探針單元（Pr〇be Unit) 檢測裝置’早期探針單元（pr〇beUnit)之各部裝置分別如下： 探針區塊（Probe block)、探針（Probe)、安裝著驅動ic的 積體電路軟板、軟性迴路基板、印刷迴路基板。電氣訊號經由 印刷迴路基板，軟性迴路基板，裝有驅動Ic的積體電路軟板， 最後再透過探針區塊（Probe block)上的探針（pr〇be)將電 氣訊號輸入平面顯示器，使用探針（probe)傳達電氣訊號會 發生電氣訊號沒有徹底到達電極板（Pad)的風險，造成電氣 201107757 訊號的遺漏（Loss);需要另外製造探針（pr〇b 照平 面顯示器的電極間距（pad pitch)把這些針進行微細地排列， 因而增加製作上的困難度。 請參麵1 ’為了克服這些問題，需改善先前本發明人已 發明過的韓國專利的探針單元（Pr〇beUnit)，先 前的探針單元（Probe Unit) i包括探針區塊（pr〇be bl〇d〇 10、積體電路軟板20、軟性迴路基板4〇、固定積體電路軟板 20在探針區塊（Probe bl〇ck )丨〇上所需要的著組裝配件3〇、 印刷迴路基板(未表示）。 此改善的方案為不使用探針（pr〇be)，直接將積體電路軟 板20接觸於平面顯示器的電極板（pad) 5〇，藉此克服上述問 題。 由圖2可看出，前述積體電路軟板2〇的結構為：絕緣基 板21，與平面顯示器電極板（Pad) 50 (示於圖3)接觸的第 1電極部23、與軟性迴路基板4〇連接的第2電極部24、驅動 扣22。其中前述第丨電極部23是對照平面顯示器電極板 (Pad) 50製作，以1對1方式來接觸的複數電極23a，形成 連接排線23b。 參考圖3表示積體電路軟板2〇的第丨電極部23接觸於平 面顯示器⑹之電極板（Pad) 50的狀態。可以看出在接觸部 位的中心，電極板（Pad) 50之電極51跟第1電極部23之電 極23a的接觸狀態可以比較準確的對齊（參考中央的部分擴大 圖）。 ' 但接觸部位愈往右方’第1電極部23之電極23a無法準 確的對到電極板（⑽5G之電極51中央而往左偏(參考右方 的部分擴大圖）。 4 201107757 相同的狀況，接觸部位愈往左方 ^^法準確的制電極板（Pad)5km5i=^= 1雷it ^的部分擴大圖）。這是因為積體電路軟板20之第 的，距⑽pitch) P1比平面顯示 之電極間距⑽奶⑻以小而發生的現象 這樣的現象纽正麵，因域組卫程#巾， 壓著的方式將積體電路軟板之第丨電極部與平面顯示器電極、 板（pad)連接，在熱1著的過程中積體電路軟板會跟延展 來，如果製造積體電路軟板時第丨電極部與平面顯示器電極板 (Pad)的各電極間距（pitch)相同，經過熱廢著的過程 體電路軟細^延展錢，反而會it成無法贿的情況。因此 在設計上積體電路軟板的第丨電極部之電極間距（咐⑻比 平面顯示器電極板（Pad)之電極間距（pitch)小。 但是在檢測過程中積體電路軟板之電極跟平面顯示器電 極板（Pad)之電極接觸時需要1對1接觸，若使用比顯;器 電極板（Pad)之電極間距（pitch)小的積體電路軟板來直接 接觸’會因各電極的間距（pitch)不一樣，而無法有效進行 電氣訊號傳送。 【發明内容】 為解決上述問題，使用延展積體電路軟板的電極間距 (Pitch)與平面顯示器電極板（pad)上之電極間距（pitch) 相同的接觸式積體電路探針單元（pr〇be Unit)及它的製造方 法為其目標。 為了達成如上所述的目的，使用本發明之接觸式積體 電路探針單元（Probe Unit)，此接觸式積體電路探針單元 201107757 听咖隨）包括探針區塊（Probe Block)，此探針區塊 (Probe Block)底部設置含有電晶體的積體軟板，該積 體電路軟板的第1電極部直接接觸平面顯示器的電極板 (pad)，第2電極部連接軟性迴路基板。 延展前述積體電路軟板的第丨電極部，舰第i電極部之 電極間距（padpitch)與平面顯示器的電極板（pad) 一致之 後進行接觸為本發明特點。 义為了避免已延展的電極間距（pitch) _原本狀態，在 前述第1電極部上枯貼熱熔性膠帶傲為間隔維持配件。 本發明之接觸式積體電路探針單元（Pr〇beUnit)的製造 方法包括1)延展前述第i電極部之電極間距（pitch)，讓 第1電極部正碟地與平面顯示器之電極板（Pad)進行接觸2) 將積體電路軟板之第2電極部連接軟性迴路基板的階段。 前述1)階段’是在積體電路軟板第丨電極部上加熱或者 壓力來延展間距（pitch)，為了不讓已延展的電極間距 (pitch)回復原本的狀態，加熱加壓之前或加熱加壓之後， 在第1電極部上粘貼熱熔性膠帶，針對熱熔性膠帶部份與第j 電極部使用熱壓板（hot plate)來加熱或壓力，同時拉扯前 这第1電極部之兩末端來^延展電極間距（pitch)，冷卻之後， 第1電極部便可藉由熱熔性膠帶來維持電極板（pad)的間隔。 延展積體電路軟板之電極間距（pitch)，使其與平面顯示 器電極板（Pad)上的電極間距（Pitch)相同之後，便可更準 確地與平面顯示器電極板（pad)接觸。 【實施方式】 本發明包括探針區塊（Probe block)(參考圖1之10)、 積體電路軟板120、軟性迴路基板(參考圖1之4〇)以及印刷迴 6 201107757 路基板（未表示）。 如圖4所示，積體電路軟板12〇包括絕緣基板121、驅動 IC 122、接觸於平面顯示器之電極板（Pad) 50 #第1電極 部123、接觸軟性迴路基板4〇的第2電極部124。 其中延展積體電路軟板U0第丨電極部123間距（pitch) ，後’積體電路軟板12〇的所有範圍之電極哪巾點皆可與 平面顯不||的電極51對正，提冑細效率（參考部分擴大圖）。 為了讓第1電極部123之延展的電極間距（pitch) p3維 持延展狀態’在積體電路軟板120上具有一間隔維持配件以 ，了避免已延展的電極間距（piteh) p3回復縣狀態，而該固 定維持配件可為一熱熔性膠帶T，用粘貼一熱熔性膠帶τ 的方式’避免延展後的電極間距（pitch) P3回復至原本狀 態，以下作更詳細說明。 以下將說明延展第1電極部123間距（pitch)之 方法。 首先’將熱熔性膠帶T貼在積體電路軟板12〇之第 1電極部123(參考圖5a)。 再者’使用已充分加熱的一熱壓板（HotPlate) Η 將熱炼性膠帶τ與第1電極部123加熱與加壓（參考圖 5b)。過一段時間之後’第1電極部123因熱與壓力而 延展電極間距（Pitch) P3。同時，熱熔性膠帶T會因 又熱而貼在已延展的第1電極部123之電極123a上， 雖，移除熱壓板（Hot plate) Η後，解除熱與壓力依 然能維持第1電極部123之電極間距（pitch) ρ3的延 展狀態。如果沒貼熱熔性膠帶T的話，在解除加熱與加 201107757 壓後已延展的電極間距（pi tch ) P3會回復到原本的狀 態。 另外的方法是先使用熱壓板（Hot plate) Η來加 熱與加壓’再粘貼有黏著力的膠帶在積體電路軟板120 之第1電極部123也可以達成同樣的效果。201107757 VI. Description of the Invention: [Technical Field] The present invention relates to a contact integrated circuit probe unit (ProbeUnit) for inspecting a flat panel display and a method of manufacturing the same, which is a first through a soft board of an extended integrated circuit The electrode portion is a method in which the electrode pitch of the first electrode portion is brought into contact with an electrode pad of the flat panel display. [Prior Art] In general, electrical signal detection is required for the manufacture of flat panel displays and semiconductors. ^ Among the three projects carried out by the flat panel display: the liquid crystal is injected between the TFT substrate and the color filter (color fi 1 ter ) (this step is Cel section engineering), and then the integrated circuit with the driving ic is attached. The soft board (this step is the module m〇dule project), and then assemble the frame (this step is the Set project). In the implementation of the module project, electrical signal detection is required. Before the module project has not been carried out, the flat display electrode plate (Pad) that completes the CeU segment project is contacted with the electrode pad of the integrated circuit soft board, and then the electrical signal is turned on for approval detection, for the Cell segment. High quality panels are used for modular engineering. In order to perform electrical signal detection, it is necessary to use a probe unit (Pr〇be Unit) detection device. The components of the early probe unit (pr〇beUnit) are as follows: Probe block, Probe, The integrated circuit board, the flexible circuit board, and the printed circuit board that drive the ic are mounted. The electrical signal passes through the printed circuit substrate, the flexible circuit substrate, and the integrated circuit board for driving Ic, and finally the electrical signal is input to the flat display through the probe (pr〇be) on the probe block. Probes convey electrical signals that cause electrical signals to not reach the electrode plate (Pad), resulting in the loss of electrical 201107757 signals (Loss); additional probes need to be manufactured (pr〇b according to the flat electrode display electrode spacing (pad Pitch) The fine needles are arranged in a fine manner to increase the difficulty in production. Please refer to 1' In order to overcome these problems, it is necessary to improve the probe unit (Pr〇beUnit) of the Korean patent which the inventor has invented before. The previous probe unit i includes a probe block (pr〇be bl〇d〇10, an integrated circuit soft board 20, a flexible circuit substrate 4〇, and a fixed integrated circuit soft board 20 in the probe block). (Probe bl〇ck) The required assembly parts 3〇, printed circuit board (not shown) are required. This improved solution is to directly contact the integrated circuit soft board 20 without using a probe (pr〇be). The electrode pad of the flat panel display is used to overcome the above problem. As can be seen from FIG. 2, the structure of the integrated circuit board 2 is: an insulating substrate 21, and a flat display electrode plate (Pad) 50 ( 3) the first electrode portion 23 that is in contact with the second electrode portion 24 that is connected to the flexible circuit substrate 4A, and the drive button 22. The second electrode portion 23 is formed by a flat panel display electrode plate (Pad) 50. The connection electrode 23a is formed by the plurality of electrodes 23a which are in contact with each other in a one-to-one manner. Referring to Fig. 3, the state in which the second electrode portion 23 of the integrated circuit board 2A is in contact with the electrode pad (Pad) 50 of the flat panel display (6) is shown. It can be seen that at the center of the contact portion, the contact state of the electrode 51 of the electrode pad 50 with the electrode 23a of the first electrode portion 23 can be aligned relatively accurately (refer to the enlarged portion of the central portion). The electrode 23a of the right first electrode portion 23 cannot be accurately aligned with the electrode plate (the center of the electrode 51 of the (10) 5G is turned to the left (refer to the enlarged view of the right part). 4 201107757 In the same situation, the contact portion is further to the left. ^^ method accurate electrode plate Pad) 5km5i=^= 1 partial enlargement of Lei ^ ^. This is because the first circuit of the integrated circuit board 20, the distance from the (10) pitch) P1 is smaller than the plane display electrode spacing (10) milk (8) In the process of heat, the integrated circuit is soft in the process of heat 1 due to the method of pressing, the 丨 electrode part of the integrated circuit board is connected to the flat display electrode and the pad (pad). The board will be extended. If the electrode of the first circuit is the same as the pitch of the electrodes of the flat display electrode (Pad), the process circuit of the heat-dissipating process will be extended. Will it become a situation that cannot be bribed. Therefore, in designing the electrode spacing of the second electrode portion of the integrated circuit board (咐(8) is smaller than the electrode pitch of the flat display electrode plate (Pad). However, the electrode and plane of the integrated circuit soft board during the detection process When the electrodes of the display electrode plate (Pad) are in contact, a one-to-one contact is required. If a thin circuit board with a smaller electrode pitch than the display electrode pad is used, the direct contact may be made due to the spacing of the electrodes. (Pitch) is different, and electrical signal transmission cannot be performed effectively. SUMMARY OF THE INVENTION In order to solve the above problem, the electrode pitch (Pitch) of the extended integrated circuit board and the electrode pitch on the flat display electrode pad (pitch) are used. The same contact integrated circuit probe unit and its manufacturing method are targeted. In order to achieve the above object, the contact integrated circuit probe unit (Probe Unit) of the present invention is used. The contact integrated circuit probe unit 201107757 includes a probe block, and the bottom of the probe block is provided with an integrated soft plate containing a transistor, and the integrated body is provided. The electrode plate (PAD) of the first electrode portions in direct contact with the plate of Soft flat-panel display, a second electrode connected to the flexible circuit board portions. It is a feature of the present invention that the second electrode portion of the flexible circuit board of the integrated circuit is extended, and the electrode pitch (padpitch) of the i-th electrode portion of the ship is matched with the electrode pad of the flat display. In order to avoid the spread of the electrode pitch _ original state, the hot-melt tape is attached to the first electrode portion to maintain the fitting. The manufacturing method of the contact integrated circuit probe unit (Pr〇beUnit) of the present invention comprises: 1) extending the electrode pitch of the ith electrode portion, and allowing the first electrode portion to be positively grounded and the electrode plate of the flat display ( Pad) Contact 2) The stage in which the second electrode portion of the integrated circuit board is connected to the flexible circuit substrate. The above 1) stage 'is heating or pressure on the second electrode portion of the integrated circuit board to extend the pitch, in order to prevent the extended electrode pitch from returning to the original state, before heating or pressurizing or heating plus After the pressure, the hot-melt tape is attached to the first electrode portion, and the hot-melt tape portion and the j-th electrode portion are heated or pressed by using a hot plate, and the first electrode portion is pulled before the first electrode portion is pulled. At the end, the electrode pitch is extended, and after cooling, the first electrode portion can maintain the interval of the electrode pads by the hot-melt tape. By extending the electrode pitch of the integrated circuit board so that it is the same as the electrode pitch (Pitch) on the flat display electrode pad (Pad), it can be more accurately contacted with the flat display electrode pad. [Embodiment] The present invention includes a probe block (refer to FIG. 1), an integrated circuit soft board 120, a flexible circuit substrate (refer to FIG. 1), and a printed back 6 201107757 circuit substrate (not Express). As shown in FIG. 4, the integrated circuit board 12A includes an insulating substrate 121, a driver IC 122, an electrode plate (Pad) 50 that contacts the flat panel display, a first electrode portion 123, and a second electrode that contacts the flexible circuit substrate 4A. Department 124. Wherein the pitch of the electrode portion of the integrated circuit board U0 is the pitch of the second electrode portion 123, and the electrode of all the ranges of the rear integrated circuit board 12 〇 can be aligned with the electrode 51 of the plane display||胄 fine efficiency (refer to the partial expansion map). In order to maintain the extended electrode pitch p3 of the first electrode portion 123, the spacer circuit has an interval maintaining fitting on the integrated circuit board 120, thereby avoiding the extended electrode pitch (piteh) p3 returning to the county state, The fixed maintenance fitting can be a hot-melt adhesive tape T, and the electrode pitch P3 after the extension is prevented from returning to the original state by sticking a hot-melt adhesive tape τ, which will be described in more detail below. A method of extending the pitch of the first electrode portion 123 will be described below. First, the hot-melt tape T is attached to the first electrode portion 123 of the integrated circuit board 12A (refer to Fig. 5a). Further, the hot-melt tape τ and the first electrode portion 123 are heated and pressurized by using a hot plate (HotPlate) which is sufficiently heated (refer to Fig. 5b). After a certain period of time, the first electrode portion 123 extends the electrode pitch P3 due to heat and pressure. At the same time, the hot-melt tape T is attached to the electrode 123a of the extended first electrode portion 123 due to heat, and the heat and pressure are maintained after the hot plate is removed. The electrode pitch of the electrode portion 123 is an extended state of the pitch ρ3. If the hot-melt tape T is not attached, the electrode spacing (pi tch ) P3 that has been extended after the heating is removed and the pressure is increased by 201107757 will return to its original state. Alternatively, the same effect can be obtained in the first electrode portion 123 of the integrated circuit board 120 by heating and pressurizing with a hot plate.
與使用熱壓板（Hot plate) Η來加熱與加壓不同 的方法’在圖6上可以看到，用夾取器（Gripper) G 抓住第1電極部123之兩末端，往外方向拉扯，拉長第 1電極部123。 最後將完成延展電極間距（pitch) P3作業的積體 電路軟板120之第2電極部124連接軟性迴路基板（如圖1 之4〇) ’最後固定在探針區塊（Pr〇be M〇ck) 1〇上， 此為製造探針單元（Probe Unit) 1的整體方法。 以上是本發明的詳細說明，本發明能保護的範圍不只限制 於上述例子’具有該行業的技術知識的人都應當了解，未來所 有依照本發明的概念及技術領域之相關多樣性應用及變更皆 受到本發明保護及限制。 【圖式簡單說明】 圖1係接觸式積體電路探針單元（Probe Unit)示意圖。 圖2為習知探針單元（Probe unit)之積體電路軟板示意圖。 圖3為習知的探針單元（pr〇beunit)的整體示意以及局部放 大圖。 圖4係由於本發明而出來的探針單元（Probe unit)及它的使 用狀態示意圖。 圖5a及圖5b係探針單元（pr〇be unit)之製造方法示意圖。 圖6係由於本發明而出來的探針單元（Probe unit)之另外製 8 201107757 造方法示意圖。 【主要元件符號說明】 1 ......探針單元 10......探針區塊 120 ......積體電路軟板 121 ......絕緣基板A method different from heating and pressurization using a hot plate '" can be seen in Fig. 6, grasping both ends of the first electrode portion 123 with a gripper (Gripper) G, and pulling outward, The first electrode portion 123 is elongated. Finally, the second electrode portion 124 of the integrated circuit board 120 which completes the pitch P3 operation is connected to the flexible circuit substrate (Fig. 1 (Fig. 1)). Finally, it is fixed in the probe block (Pr〇be M〇). Ck) In the first step, this is the overall method of manufacturing the probe unit 1. The above is a detailed description of the present invention, and the scope of protection of the present invention is not limited only to the above examples. Those having technical knowledge of the industry should understand that all relevant applications and changes in the future in accordance with the concepts and technical fields of the present invention are It is protected and limited by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram of a probe unit of a contact integrated circuit. 2 is a schematic diagram of a soft circuit of an integrated circuit of a conventional probe unit. Fig. 3 is an overall schematic and partial enlarged view of a conventional probe unit. Fig. 4 is a schematic view showing a probe unit and its use state due to the present invention. 5a and 5b are schematic views showing a manufacturing method of a probe unit. Fig. 6 is a schematic view showing the manufacturing method of the probe unit which is obtained by the present invention. [Main component symbol description] 1 ... probe unit 10 ... probe block 120 ... integrated circuit board 121 ... insulation substrate
122 ......驅動1C 123 ......第1電極部 123a......電極 124 ......第2電極部 20 ......積體電路軟板 21 ......絕緣基板122 ... drive 1C 123 ... first electrode portion 123a ... electrode 124 ... second electrode portion 20 ... integrated circuit soft Board 21 ... insulating substrate
22 ......驅動1C 23 ......第1電極部 23a......電極 23b......連接排線 24 ......第2電極部 30......著組裝配件 40......軟性迴路基板 50 ......電極板 51 ......電極 P1......電極間距 P2......電極間距 P3......電極間距 T ......熱熔性膠帶 Η ......熱壓板 G ......夾取器 L ......平面顯示器22 ... drive 1C 23 ... first electrode portion 23a ... electrode 23b ... connection wire 24 ... second electrode portion 30 ... assembly of assembly 40... soft circuit substrate 50 ... electrode plate 51 ... electrode P1 ... electrode spacing P2.... ..electrode pitch P3...electrode pitch T...hot melt tape Η...hot plate G ......clipper L ..... Flat panel display