JP2009079911A - Inspection jig and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection jig configured to obtain excellent electrical connection with a terminal of an inspection object even when an oxide film is formed on the terminal, thereby improving the reliability of the inspection, and to provide a method of manufacturing the same. <P>SOLUTION: The inspection jig 1 has a substrate 2, a contact 3 provided on the substrate 2 and a wiring pattern 4 electrically connected to the contact 3, and is so constituted that the contact 3 is joined to the terminal of the inspection object. The contact 3 is formed of a bump electrode having an internal resin 8 as a core and a conductive film 9 so provided on the surface of the resin as to cover it, and conductive projections 14 are provided on the conductive film 9. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an inspection jig and a manufacturing method thereof.

  In general, in the manufacturing process of an electro-optical device such as a liquid crystal display panel, an inspection process is provided for various electrical characteristics such as a lighting inspection and an inspection for a short circuit / break in a wiring pattern. In such an inspection process, various wirings are inspected for short circuits and disconnections, and electrical characteristics of component electronic components are also inspected.

In such an electrical characteristic inspection, an inspection jig that is usually brought into direct contact with a liquid crystal display panel or an electronic component that is a component of the liquid crystal display panel is used. Inspection probes having members are known. However, in the inspection probe having such a bar-shaped contact member, it is difficult to position and contact the bar-shaped contact member to the terminal portion of the panel electrode or the wiring as the pitch of the panel electrode or the wiring becomes finer. It has become.
In view of this, a display panel inspection apparatus having a plurality of contact members made of a conductor formed on a rod-shaped protrusion resin has been proposed (see Patent Document 1).
Since the contact member is formed on the rod-shaped projection resin, the contact with the panel electrode (terminal) is favorably caused by the deformation of the rod-shaped projection resin.
JP 2005-16959 A

  By the way, in the object to be inspected such as a display, since the terminal which becomes an electrical contact is exposed at the time of inspection, the surface of the terminal is oxidized depending on the storage state and storage environment, and an oxide film is formed. There is. Then, when inspecting the electrical characteristics of the object to be inspected, even if the contact of the inspection jig is brought into contact with the terminal, a good electrical connection is established between the terminal and the contact by the oxide film. May not be obtained.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide good electrical connection with the terminal even if an oxide film is formed on the terminal of the device under test. Accordingly, it is an object of the present invention to provide an inspection jig with improved inspection reliability and a manufacturing method thereof.

  The inspection jig of the present invention includes a substrate, a contact provided on the substrate, and a wiring pattern electrically connected to the contact, and the contact is a terminal of the object to be inspected. An inspection jig configured to be bonded, wherein the contact includes a bump electrode having an inner resin as a core and a conductive film covered on a surface thereof. It is characterized by having a sexual protrusion.

According to this inspection jig, since the contact consists of a bump electrode having an inner resin as a core and a conductive film covered on its surface, when this contact is joined to the terminal of the object to be inspected Since the internal resin is easily elastically deformed, the conductive film on the surface comes into contact with the terminal over a wide area. In addition, the conductive resin on the surface is bonded to the terminal with high strength by the elastic restoring force (repulsive force) of the internal resin. Therefore, a wide contact area is ensured between the contact and the terminal, and a sufficiently high bonding strength is ensured, so that the reliability of the electrical connection between the contact (bump electrode) and the terminal is improved. This improves the reliability of the electrical property inspection itself.
In addition, since the conductive protrusion is provided on the conductive film, when the contact is joined to the terminal of the object to be inspected, the protrusion breaks through the oxide film formed on the terminal surface of the object to be inspected. It comes in direct contact with the metal surface. Therefore, even when an oxide film is interposed between the conductive film of the contact and the terminal, which makes it difficult to obtain a good electrical connection, the protrusion is in direct contact with the metal surface of the terminal, so that a good electrical connection can be obtained. Can be obtained.

In the inspection jig, it is preferable that the protrusion has a tapered shape in which a distal end side is thinner than a proximal end side.
In this way, the protrusions can more easily break through the oxide film formed on the terminal surface of the object to be inspected, and the electrical connection between the contact and the terminal becomes better.

In the inspection jig, it is preferable that a plurality of the protrusions are provided.
In this way, since the protrusions directly contact the metal surface of the terminal at a plurality of locations, better electrical connection can be obtained between the contact and the terminal.

In the inspection jig, the inner resin has a substantially semicircular shape, a substantially semielliptical shape, or a substantially trapezoidal shape in a main cross section among the cross sections orthogonal to the bottom surface contacting the substrate. It is preferable that the conductive film is provided in a strip shape on the surface of the internal resin along the surface direction of the main cross section of the internal resin.
In this way, by providing a plurality of conductive films at intervals on the surface of the internal resin, a plurality of bump electrodes (contacts) can be formed, which facilitates manufacture.

In the inspection jig, the inner resin has a curved surface whose outer surface is convex outward, and the conductive film is curved along the curved surface of the inner resin. It is preferable that the protrusion is disposed at least on the outermost portion of the curved outer surface of the conductive film.
In this way, in the portion located on the outermost side of the curved outer surface of the conductive film, the inner resin is most greatly deformed (elastically deformed) when the contact is joined to the end surface, so that its elastic restoring force ( The protrusion provided on the conductive film on the surface by the repulsive force is joined to the terminal with a higher pressure. Therefore, even if an oxide film is formed on the terminal surface, the protrusions break through this oxide film better and come into direct contact with the underlying metal surface, so the electrical connection between the contact and the terminal Will be better.

In the inspection jig, the inner resin has a curved surface whose outer surface is convex outward, and the conductive film is curved along the curved surface of the inner resin. Preferably, the protrusion is disposed at least in the vicinity of the outermost portion of the curved outer surface of the conductive film.
In this way, when the contact is bonded to the terminal of the object to be inspected, the internal resin is compressed around the outermost portion, and the curved surface follows the bonding surface of the terminal and is flat. Become. Then, in the vicinity of the outermost portion of the conductive film described above, the angle formed by the outer surface changes as the curved surface becomes a flat surface, and accordingly, the protrusions disposed on the vicinity portion also change. The tip is directed to the outermost part side described above. Then, when the contact is joined to the terminal, the protrusion displaces the tip of the contact laterally on the terminal, and as a result, acts to scratch the surface of the terminal, and the oxide film on the terminal surface is formed. The oxide film is peeled off not only by piercing but also by scratching. Therefore, the electrical connection between the contact and the terminal becomes better because the terminal peels off the oxide film.

In the inspection jig, the substrate is preferably a transparent substrate.
If it does in this way, the position of a conductive film can also be visually recognized from the back surface side of a board | substrate, and alignment with the terminal of a to-be-inspected object and a conductive film becomes easy.

In the inspection jig, an electrical shielding layer is preferably provided between the substrate and the contact.
In this way, unnecessary radiation can be reduced, noise resistance can be improved, and a more precise electrical characteristic inspection can be performed.

In the inspection jig, it is preferable that a connector is provided on the end of the substrate opposite to the side on which the contact is disposed.
This facilitates electrical connection between the inspection jig and the tester.

In the inspection jig, an inspection electronic component may be mounted on the substrate, and the inspection electronic component may be electrically connected to the wiring pattern.
For example, in an electrical characteristic inspection of an electro-optical device such as a liquid crystal display device, an electronic component such as a driving element that supplies a drive signal to the electro-optical device may be required at the time of inspection. In that respect, according to the above configuration, the inspection electronic component is mounted in advance on the substrate, and the inspection electronic component is electrically connected to the wiring pattern. Therefore, it is possible to cope with this inspection jig alone.

In the connection structure, it is preferable that the electronic component for inspection is an electronic component mounted on the object to be inspected after inspection.
In this way, it is possible to carry out the inspection under the same conditions as the actual use state without preparing electronic parts specially designed and manufactured for inspection.

In the connection structure, it is preferable that the inspection electronic component is mounted on the substrate in a face-down structure.
In this way, since a bonding wire or the like is not used for electrical connection between the terminals of the inspection electronic component and the wiring pattern, the connection structure can be simplified and the entire inspection jig can be made thinner.

The method for manufacturing an inspection jig according to the present invention is a method for manufacturing an inspection jig having a substrate, a contact provided on the substrate, and a wiring pattern electrically connected to the contact. And
The step of forming the contact includes a step of providing an internal resin as a core on the substrate, a step of covering the surface of the internal resin with a conductive film, and a step of forming conductive protrusions on the conductive film It is characterized by having.

According to this inspection jig manufacturing method, the contact is formed by covering the surface of the inner resin as the core with the conductive film and further forming the conductive protrusion on the conductive film. Is bonded to the terminal of the object to be inspected, the internal resin is easily elastically deformed so that the conductive film on the surface comes into contact with the terminal over a wide area. In addition, the conductive resin on the surface is bonded to the terminal with high strength by the elastic restoring force (repulsive force) of the internal resin. Therefore, a wide contact area is ensured between the contact and the terminal, and a sufficiently high bonding strength is ensured, so that the reliability of the electrical connection between the contact (bump electrode) and the terminal is improved. This improves the reliability of the electrical property inspection itself.
In addition, since the conductive protrusion is provided on the conductive film, when the contact is joined to the terminal of the object to be inspected, the protrusion breaks through the oxide film formed on the terminal surface of the object to be inspected. It comes in direct contact with the metal surface. Therefore, even when an oxide film is interposed between the conductive film of the contact and the terminal, which makes it difficult to obtain a good electrical connection, the protrusion is in direct contact with the metal surface of the terminal, so that a good electrical connection can be obtained. Can be obtained.

Further, in the method for manufacturing an inspection jig, in the step of forming the protrusion, a conductive material is selectively disposed on the conductive film by a droplet discharge method, whereby the protrusion made of the conductive material is formed. May be formed.
In this way, it is possible to form a desired number of protrusions at desired positions on the conductive film.

Hereinafter, the present invention will be described in detail based on embodiments.
<Inspection jig>
First, an embodiment of the inspection jig of the present invention will be described. FIG. 1 is a perspective view of an embodiment of an inspection jig, and FIG. 2 is a side sectional view of an embodiment of an inspection jig. 1 and 2, reference numeral 1 denotes an inspection jig, and this inspection jig 1 is used by being electrically connected to a tester (not shown) for detecting and measuring various electrical characteristics. Is.

As shown in FIGS. 1 and 2, the inspection jig 1 includes a plate-like substrate 2, a plurality of contacts 3 including bump electrodes provided on the substrate 2, and a contact 3. The wiring pattern 4, 5 electrically connected, the driving IC 6 (electronic component for inspection), and the connector 7 are roughly configured.
The substrate 2 is made of a transparent and rectangular insulating substrate made of, for example, glass or quartz. Note that the substrate 2 is not necessarily transparent, and may be formed of, for example, a ceramic substrate, a resin substrate, a silicon substrate, or the like.

A contact 3 is formed on one end side of the substrate 2. The contact 3 is composed of a bump electrode. As shown in FIG. 1, the contact 3 has a substantially bowl-shaped internal resin 8 provided on the substrate 2 as a core (core portion), and the surface thereof has a plurality of strip-like conductive films. 9 has a structure covered with 9. A plurality of conductive protrusions 14 are formed on the conductive film 9.
The plurality of conductive films 9 are provided on the surface of the substrate 2 as shown in FIG. 2 and are formed to extend continuously from the surface of the internal resin 8 to the left and right. As shown in FIG. 1, the portion extending to the side opposite to the side where the contact 3 is formed and extending to the substantially central portion of the substrate 2 is a wiring pattern 4. The wiring pattern 4 is electrically connected to the driving IC 6 at an end opposite to the contact 3, that is, at a substantially central portion of the substrate 2.

A plurality of wiring patterns 5 formed in the same process as the conductive film 9 and the wiring pattern 4 are disposed on the other end side of the substrate 2, that is, the side opposite to the side on which the contact 3 is formed. ing. These wiring patterns 5 are also electrically connected to the driving IC 6 at a substantially central portion of the substrate 2.
Further, a connector 7 for electrically connecting to the tester is connected to the wiring pattern 5 at the end opposite to the driving IC 6.
Under such a configuration, the conductive film 9 provided on the surface of the internal resin 8 is independently connected / conductive to the driving IC 6 and further connected / conductive to the connector 7. Therefore, each of these conductive films 9 together with the internal resin 8 located inside thereof functions independently as the contact (bump electrode) 3 according to the present invention.

  Here, the substantially bowl-like shape of the internal resin 8 refers to a columnar shape in which the inner surface (bottom surface) in contact with the substrate 2 is a flat surface, and the outer surface not in contact is a curved surface protruding outward. Specifically, as shown in FIG. 2, it is preferable that the cross section (cross section) has a substantially semicircular shape (or a substantially semielliptical shape). This transverse section is the main section of the internal resin 8 in the present invention. The main cross section of the internal resin 8 in the present invention is a characteristic surface of the cross section orthogonal to the bottom surface in contact with the substrate 2, and the internal resin 8 is substantially bowl-shaped as in this embodiment. If it is, the cross section in the width direction is the main cross section. And in the contactor (bump electrode) 3 in this invention, the electrically conductive film 9 is provided on the surface of the said internal resin 8 along the surface direction of the said main cross section.

In this embodiment, the substantially semicircular shape in the main cross section (transverse cross section) of the internal resin 8 is surrounded by the bottom side 8 a that contacts the base material 2 and the outer side 8 b that protrudes outside the base material 2. Is formed.
Such an internal resin 8 is made of a photosensitive insulating resin or a thermosetting insulating resin, and specifically, is formed of a polyimide resin, an acrylic resin, a phenol resin, a silicone resin, a silicone-modified polyimide resin, an epoxy resin, or the like. It has been done. The internal resin 8 made of such a resin is formed in the above-described substantially bowl shape by a known lithography technique or reflow technique as described later. Note that the resin material (hardness) and the shape (height and width) in details about the bowl shape are appropriately selected and designed according to the shape and size of the terminals of the objects to be inspected.

The conductive film 9 is formed on the curved surface of the internal resin 8 with an outer surface curved in accordance with the curved surface. The conductive film 9 is made of a metal or alloy such as Au, TiW, Cu, Cr, Ni, Ti, W, NiV, Al, Pd, lead-free solder, etc., and is a single layer of these metals (alloys). Alternatively, a laminate of a plurality of types may be used. Thus, since the conductive film 9 is formed so as to follow the curved surface of the internal resin 8, local stress concentration is less likely to occur, and therefore disconnection due to the stress concentration is prevented. It has become.
The conductive film 9 may be formed by a known film formation method such as a sputtering method and then patterned into a strip shape, or may be formed selectively by electroless plating. Alternatively, a base film may be formed by sputtering or electroless plating, and then an upper layer film may be formed on the base film by electrolytic plating, and the conductive film 9 may be formed by a laminated film including the base film and the upper layer film. Good.

  Note that the type, layer structure, film thickness, width, and the like of the metal (alloy) are appropriately selected and designed according to the shape and size of the terminal of the device to be inspected, as in the case of the internal resin 8. However, as described later, since the conductive film 9 is elastically deformed together with the internal resin 8 by being bonded to the terminal of the object to be inspected, it is preferable to use gold (Au) that is particularly excellent in spreadability. Moreover, when forming the electrically conductive film 9 with a laminated film, it is preferable to use gold for the outermost layer. Furthermore, it is preferable that the conductive film 9 be formed sufficiently wider than the terminal to be joined.

  The protrusion 14 is made of a hard conductive material such as a metal or an alloy, and is formed of a metal (alloy) of the same material as the conductive film 9 or formed of a metal (alloy) harder than the conductive film 9. It is. Further, for example, a core portion made of a metal (alloy) made of the same material as that of the conductive film 9 may be provided, and a metal (alloy) harder than the core portion may be adhered on the surface thereof. Such a protrusion 14 is formed with a height of, for example, about several hundreds of nanometers to several μm, and particularly preferably has a tapered shape (substantially conical shape) whose tip side is narrower than the base end side.

  The material, shape, and the like of the projection 14 are mainly characterized by the formation method. Specifically, when the conductive layer 9 is formed by the sputtering method, after the film formation of the conductive layer 9 is once completed, the film formation material is deposited on the conductive layer 9 with a low distribution density by changing the sputtering conditions. A large number of protrusions 14 can be formed. At this time, for the sputtering conditions, for example, by lowering the temperature of the substrate 2, the movement of the particles made of the film forming material attached on the conductive film 9 is suppressed, and the film forming material is uniformly attached with a high distribution density. A large number of protrusions 14 can be formed by suppressing the proximity of a thick film. The sputtering time is also sufficiently shorter than the formation time of the conductive film 9 so that the film forming material does not adhere with a high distribution density.

As described above, when the protrusions 14 are formed under sputtering conditions different from those for forming the conductive film 9, the protrusions 14 can be formed of the same material as that of the conductive film 9 as described above. It can also be formed of another material by changing to the above. Therefore, in particular, when the conductive film 9 is made of gold, the protrusions 14 can also be made of gold, or can be made of a harder metal (alloy) material.
When the conductive film 9 and the protrusion 14 are formed by the sputtering method in this way, an unnecessary portion is actually formed after the conductive material film to be the conductive film 9 is formed by the sputtering method and the protrusion 14 is further formed thereon. The conductive film 9 and the protrusion 14 positioned on the conductive film 9 are formed by performing patterning for removing the film.

Further, in order to form the protrusions 14, a plating method can be used instead of the sputtering method. For example, many protrusions 14 can be formed by performing electroless plating on the surface of the conductive film 9. That is, many metal nuclei are formed on the conductive film 9 by electroless plating. The electroless plating process is terminated when the nucleus grows to a desired size. In this way, the height of the protrusion 14 can be adjusted, and the shape of the protrusion 14 can also be a tapered shape (substantially conical shape) with a thin tip side.
Alternatively, the core portion of the protrusion 14 can be formed by sputtering, and a hard metal material can be attached to the surface by electrolytic plating. Specifically, the core portion can be formed of gold, and Ni or Cu fine particles or a thin film can be attached to the surface thereof. For example, when performing electrolytic plating of Cu, Cu can be favorably adhered to the core portion by increasing the current density to 1 A / d or more.

Further, the protrusion 14 can be formed by selectively disposing a conductive material on the conductive film 9 by a droplet discharge method. As the droplet discharge method, a known inkjet method or dispense method is employed. As the conductive material, a liquid material in which fine metal particles such as Au, Ag, Cu, and Ni are dispersed is used, and Ag, Cu, and Ni that are harder than Au are particularly suitable. The particle size of the metal fine particles is about 10 nm to 100 nm. Accordingly, a desired amount of droplets containing such fine particles are distributed (discharged) to a desired location on the conductive film 9, and further dried and baked to selectively form the protrusions 14 in a desired size. be able to.
In the formation of the projections 14, in particular, for the purpose of adjusting the size, shape, and properties, the projections once formed are subjected to dry etching, wet etching, chemical conversion treatment, etc. A characteristic protrusion 14 may be formed.

  In addition, the protrusion 14 formed in this way is preferably formed at least at the position shown in FIG. 3A or the position shown in FIG. As shown in FIGS. 3A and 4A, on the outer surface of the inner resin 8, that is, on the curved surface represented by the outer edge 8b having a substantially arc shape in the main cross section of the inner resin 8, A conductive film 9 is provided along the surface, and thus the conductive film 9 also has a curved outer surface 9a. And in the curved outer surface 9a of this electrically conductive film 9, it is preferable to arrange | position the processus | protrusion 14 at least on the site | part P located in the outermost side of the said outer surface 9a, as shown to Fig.3 (a). Here, the portion P is a position farthest from the surface of the substrate 2 when the shape of the main cross section including the thickness of the conductive film 9 is a semicircular shape, that is, a straight line that bisects the semicircle and the outer surface 9a. It becomes the intersection point with the arc. Moreover, it is preferable that the protrusions 14 are disposed in the vicinity thereof at least on both sides of the portion P as shown in FIG.

  As will be described later, the conductive film 9 of the contact 3 is bonded to the terminal of the object to be inspected. At that time, the internal resin 8 is compressed and deformed, so that a wide contact area is secured between the conductive film 9 and the terminal, and a sufficiently high bonding strength is secured. When the conductive film 9 is bonded to the terminal in this way, the portion P shown in FIG. 3A is located on the outermost side, so that the amount of compressive deformation is maximized as shown in FIG. 3B. Become. Therefore, since the elastic restoring force (repulsive force) is also increased, the protrusion 14 provided on the portion P is joined to the terminal with a higher pressure. Therefore, even if an oxide film is formed on the terminal surface, the protrusion 14 breaks through the oxide film better and comes into direct contact with the underlying metal surface.

  In addition, in the vicinity of the portion P shown in FIG. 4A, when the conductive film 9 is bonded to the end face, the angle formed by the outer surface 9a is changed as the outer surface 9a of the conductive film 9 changes from a curved surface to a flat surface. Change. That is, as shown in FIG. 4A, before the conductive film 9 is bonded to the end surface, the direction of the normal line L1 of the arc that forms the outer surface 9a at the position where the protrusions 14a and 14b are formed is It faces outward from the normal L. On the other hand, when the conductive film 9 is bonded to the end face as shown in FIG. 4B, the normal line L2 where the protrusions 14a and 14b are formed is almost in the same direction as the normal line L at the part P. It comes to be suitable for.

Therefore, since the tips of the protrusions 14a and 14b are oriented in the same direction as the normal line L at the respective portions, the state before the conductive film 9 is joined to the end face as shown in FIG. As shown in FIG. 4B, in the process of reaching the state where the conductive film 9 is bonded to the end face, the protrusions 14a and 14b are displaced in the lateral direction. Therefore, the protrusions 14a and 14b act so as to scratch the surface of the terminal, and not only pierce the oxide film on the terminal surface but also peel off the oxide film by scratching.
In the present embodiment, the protrusion 14 is provided on the part P as shown in FIG. 3A, and the protrusion P is also provided near the part P as shown in FIG. 4A. 14 is provided.

  The driving IC 6 is for supplying a driving signal to a liquid crystal display device as an object to be inspected, for example. In the case where the object to be inspected is a liquid crystal display device in this way, the drive IC 6 is the same as the drive IC mounted on the external substrate connected to the liquid crystal display device and performing drive control of the liquid crystal panel. It is preferable to use one. This is because the inspection can be carried out under the same conditions as the actual use state without preparing electronic parts specially designed and manufactured for inspection. However, as the driving IC 6, one designed for inspection can of course be used.

  The driving IC 6 is mounted on the substrate 2 in a face-down structure as shown in FIG. 2, and a terminal 6a for outputting a driving signal to the device to be inspected among the plurality of terminals. The terminal 6 b connected to the end of the wiring pattern 4 connected to the contact 3 and receiving a signal from a tester or the like is connected to the end of the wiring pattern 5. By adopting such a face-down structure, the electrical connection structure between the terminals 6a and 6b of the driving IC 6 and the wiring patterns 4 and 5 is simplified, and the overall thickness of the inspection jig 1 can be reduced. It has been. Note that the mounting of the driving IC 6 is not limited to the face-down structure, and a structure using wire bonding or the like may be used.

  The connection portions between the terminals 6a and 6b of the driving IC 6 and the wiring patterns 4 and 5 are sealed with the resin layer 10, whereby the connection portions are corroded due to intrusion of moisture and foreign matter, or are short-circuited. Inconveniences such as the occurrence of this are prevented. Further, although not shown, a protective layer made of a solder resist or the like is provided on each wiring pattern 4 and 5 at a place other than the electrical connection portion with the contact 3 or the driving IC 6. Is desirable. Similar to the resin layer 10, this protective layer is also for protecting the wiring patterns 4 and 5 and preventing corrosion and short circuits.

  As described above, the connector 7 is provided at the end of the upper surface of the substrate 2 opposite to the side on which the contact 3 is provided, connected to the wiring pattern 5. The connector 7 is for electrical connection with a tester. For example, a wiring pattern 12 provided corresponding to each of the wiring patterns 5 is formed on one surface of a flexible substrate 11 made of an arbitrary resin material. It is what. The connector 7 having such a configuration has an anisotropic conductive film 13 (Anisotropic Conductive Film) in a state where the wiring pattern 12 on the flexible substrate 11 is disposed so as to face the wiring pattern 5 on the substrate 2. The wiring pattern 12 is electrically connected to the wiring pattern 5. As a result, the flexible substrate 11 is mechanically bonded to the substrate 2.

<Inspected object>
Next, an example of an object to be inspected by the inspection jig 1 of the present invention will be described. FIG. 5 is a plan view showing a schematic configuration of a liquid crystal display device as an example of an object to be inspected, and FIG. 6 is a cross-sectional view taken along line HH ′ of FIG.

  As shown in FIGS. 5 and 6, the liquid crystal display device 100 as an object to be inspected includes a TFT array substrate 30 provided with a thin film transistor (hereinafter referred to as TFT) as a pixel switching element, and a counter substrate 40. Are bonded together by a sealing material 52, and the liquid crystal layer 50 is sealed inside the sealing material 52. A light-shielding film (peripheral parting) 53 made of a light-shielding material is formed inside the formation region of the sealing material 52. A data line driving circuit 201 is formed along one side of the TFT array substrate 10 in the peripheral circuit region outside the sealing material 52, and a scanning line driving circuit 104 is formed along two sides adjacent to the one side. ing. On the remaining side of the TFT array substrate 10, a plurality of wirings 105 are provided for connecting the two scanning line driving circuits 104 provided on both sides of the display area to each other. In the corner portion of the counter substrate 40, an inter-substrate conductive material 106 for providing electrical continuity between the TFT array substrate 30 and the counter substrate 40 is disposed.

  A large number of external circuit mounting terminals 202 are arranged in a row outside the data line driving circuit 201 on the TFT array substrate 10. As shown in FIG. 4, the outer shape of the TFT array substrate 30 is larger than the outer shape of the counter substrate 40, and the region where the external circuit mounting terminal 202 is provided at the edge of the TFT array substrate 10 is from the edge of the counter substrate 40. It is arranged so as to protrude outside. With such a configuration, when an electrical property inspection is performed using the inspection jig 1 as described later, the contact 3 of the inspection jig 1 can easily contact the external circuit mounting terminal 202. It has become.

  In the liquid crystal display device 100 having such a configuration, for example, after the TFT array substrate 30 and the counter substrate 40 are bonded to each other through a sealing material 52 to form an empty liquid crystal cell, the liquid crystal display device 100 is formed in the liquid crystal cell by vacuum injection. Liquid crystal is injected. Then, it manufactures by sealing a liquid-crystal inlet with a sealing material. Then, the completed liquid crystal display device 100 is subjected to an electrical property test in order to check whether or not the electrical property satisfies the regulation. That is, the electrical property inspection of the liquid crystal display device 100 is performed using the inspection jig 1.

  In order to perform this electrical characteristic inspection, first, as shown in FIG. 7, the contact 3 of the inspection jig 1 is brought into contact with the terminal (external circuit mounting terminal) 202 of the liquid crystal display device 100 and further pressed in this state. By means, the contact 3 is relatively pressed against the terminal 202 at a predetermined pressure or higher, whereby the contact 3 is electrically connected to the terminal 202. When the contact 3 of the inspection jig 1 is brought into contact with the terminal 202, it is necessary to align them. At this time, since the base material 2 is a transparent substrate, the conductive film 9 of the contact 3 and The positional relationship with the terminal 202 can be viewed from the back side of the substrate 2. Therefore, alignment can be performed easily.

  As the pressing means, as shown in FIG. 7, for example, the pressure plate 15 is lowered by a pressure equal to or higher than a predetermined pressure by air pressure or the like, and the inspection treatment on the liquid crystal display device 100 placed on a stage (not shown) is performed. A pressing device that presses the back side of the tool 1 (substrate 2) and presses the inspection jig 1 onto the liquid crystal display device 100 is used. Although not shown, a clip that sandwiches the back surface side of the TFT array substrate 30 of the liquid crystal display device 100 and the back surface side of the substrate 2 of the inspection jig 1 at a predetermined pressure or more by a spring force can also be used. Further, a plate for pressing the back surface side of the TFT array substrate 30 and a plate for pressing the back surface side of the substrate 2 of the inspection jig 1 are prepared, the plates are fastened with screws, and a fastening force (screw force) is provided via these plates. The inspection jig 1 may be pressed onto the TFT array substrate 30 (on the liquid crystal display device 100).

By such pressing means, the inspection jig 1 is relatively pressed onto the liquid crystal display device 100, whereby the contact 3 of the inspection jig 1 is connected to the terminals of the liquid crystal display device 100, that is, the TFT array substrate 30. It is pressed against the external circuit mounting terminal 202.
Then, since the internal resin 8 of the contact 3 is easily elastically deformed, the conductive film 9 on the surface comes into contact with the terminal 202 over a wide area. Further, the conductive film 9 on the surface thereof is bonded to the terminal 202 with high strength by the elastic restoring force (repulsive force) of the internal resin 8. Therefore, a wide contact area is ensured between the contact 3 and the terminal 202, and a sufficiently high bonding strength is ensured, whereby the reliability of electrical connection between the contact 3 and the terminal 202 is improved. This improves the reliability of the electrical property inspection itself.

  Further, the protrusion 14 on the conductive film 9 breaks through an oxide film (not shown) formed on the surface when the contact 3 is bonded to the terminal 202, and comes into direct contact with the lower metal surface. . Therefore, even when an oxide film is interposed between the conductive film 9 of the contactor 3 and the terminal 202, and thus it is difficult to obtain a good electrical connection, the protrusion 14 directly contacts the metal surface of the terminal 202, A good electrical connection can be obtained between the contact 3 and the terminal 202.

Furthermore, in this embodiment, since the protrusion 14 is provided on the part P as shown in FIG. 3A, the amount of compressive deformation of the internal resin 8 is maximum as shown in FIG. 3B. Therefore, the elastic restoring force (repulsive force) is also increased and the terminal 202 is joined with a higher pressure. Therefore, even if an oxide film is formed on the surface of the terminal 202, the protrusion 14 breaks through the oxide film better and comes into direct contact with the lower metal surface. The electrical connection between them becomes better.
Further, since it is also provided in the vicinity of the part P shown in FIG. 4A, in the process from the state shown in FIG. 4A to the state shown in FIG. The protrusions 14 a and 14 b act to displace the tips in the lateral direction and scratch the surface of the terminal 202. Therefore, the protrusions 14 (14a, 14b) not only pierce the oxide film on the surface of the terminal 202, but also peel off the oxide film by scratching, whereby a good electrical connection between the contact 3 and the terminal 202 is obtained. Can be obtained.

  Then, the tester is connected to the connector 7 of the inspection jig 1 before or after the contact 3 is brought into contact with the terminal 202 and electrically connected in this way. Thereafter, in this state, an inspection signal is input from the tester to the liquid crystal display device 100 through the inspection jig 1 and an output is obtained, thereby performing various electrical characteristic inspections including a lighting inspection.

In such an inspection jig 1, since the bump electrode formed by covering the surface of the internal resin 8 with the conductive film 9 is used as the contact 3, as described above, the contact 3, the terminal 202, A wide contact area can be ensured between them, and a sufficiently high bonding strength can be secured, thereby improving the reliability of the electrical connection between the contact 3 and the terminal 202, and an electrical characteristic test. The reliability of itself can be improved.
Moreover, since the oxide film on the surface of the terminal is pierced by the protrusion 14 on the conductive film 9 and is directly brought into contact with the lower metal surface, a better electrical connection can be obtained between the contact 3 and the terminal 202. Can do.

Next, an embodiment of a method for manufacturing an inspection jig according to the present invention will be described.
First, the process of forming the contact (bump electrode) 3 will be described.
In this contactor 3 formation step, first, as shown in FIG. 8A, a resin for forming the internal resin 8, for example, a polyimide resin to be a negative resist, is formed on the surface of the substrate 2 with a thickness of, for example, about 10 to 20 μm. Apply it. Then, the resin layer 18 is formed by pre-baking the applied forming resin.

  Next, as shown in FIG. 8B, a photomask 19 is positioned at a predetermined position on the resin layer 18 and set. The photomask 19 is made of a glass plate on which a light shielding film such as Cr is formed, for example, and has a rectangular opening 19a corresponding to the planar shape of the substantially bowl-shaped inner resin 8 to be formed. The positioning of the photomask 19 is performed so that the opening 19a is located at the location where the internal resin 8 is formed. For the photomask 19, description of the glass plate is omitted, and only the light-shielding film is described, and this is denoted by 19.

Next, the photomask 19 is irradiated with exposure light to expose the resin layer 18 exposed in the opening 19a. However, at the time of this exposure, by adjusting the exposure conditions, the pattern made of the resin layer 18 obtained after development has a substantially semicircular shape (or substantially semielliptical shape) in cross section (main cross section). Pattern.
Specifically, the exposure light is obliquely irradiated as shown by an arrow in FIG. 8B, and the exposed portion of the resin layer 18 has a substantially semicircular cross section as shown by a broken line in FIG. 8B. (Substantially trapezoidal). Further, as shown in FIG. 8C, off-contact exposure is performed in which the photomask 19 is exposed in a state where it is separated from the resin layer 18, and a portion to be exposed in the resin layer 18 is indicated by a broken line in FIG. 8C. Thus, it is good also as a cross-sectional substantially semicircle shape (substantially trapezoid shape). Further, as the photomask 19, a transflective half mask may be used, and the cross section of the exposed portion may be substantially semicircular (substantially trapezoidal) as described above. As the half mask, the peripheral portion of the opening 19a is made semi-transparent, and the translucency gradually decreases as the distance from the opening 19a increases. By forming the semi-transmissive region in this way, it is possible to perform exposure of the outer side portion, that is, the side surface portion in the substantially semicircular shape (substantially trapezoidal shape).

  When exposure is performed in this manner, the entire area of the resin layer 18 exposed in the opening 19a of the mask 19 is exposed in the thickness direction. In the peripheral portion of the opening 19a, the exposure amount gradually decreases as the distance from the opening 19a increases. Therefore, after the exposure process is performed in this manner, when the development process is performed, the unexposed portion of the resin layer 18 is developed and removed. On the other hand, the exposed portion in the opening 19a, which is an exposed portion, remains as it is without being developed. In addition, the bottom surface side remains in the peripheral portion according to the exposure amount. As a result, as shown in FIG. 7D, a resin pattern 18a having a substantially trapezoidal cross section and a substantially bowl shape is obtained.

  About the resin pattern 18a obtained, the shape can be adjusted to some extent by exposure conditions and development conditions. Therefore, the shoulder portion 18b of the resin pattern 18a can be curved to some extent as shown in FIG. 8D by adjusting the semi-transmissive region of the half mask. However, it is preferable to perform a reflow process in order to curve the shoulder portion 18b more gently and further curve the side portion and the upper side portion so that the entire exposed surface has a curved (curved) shape.

  The reflow process is performed by heating to a temperature at which the resin softens and the surface melts according to the material of the resin pattern 18a. After heating and melting in this manner, the internal resin 8 having a substantially semicircular main cross section is obtained as shown in FIG. That is, the resin pattern 18a becomes a continuous curved surface whose surface state is gently curved as a whole in the process of softening / melting and solidifying the surface by the reflow process. Speaking of the cross section (main cross section) formed in a substantially semicircular shape (substantially trapezoidal shape), the entire outer side 8b is a continuous and gently curved line, which is closer to a semicircle. That is, when the resin is softened and the surface is melted, the outer side 8b has a shape closer to a semicircle by dripping both sides (both shoulder portions side) by its own weight as shown in FIG. 9A. .

After forming the internal resin 8 in the present invention in this way, the above-described metal (alloy) such as Au is formed on the entire surface of the substrate 2 by sputtering (sputtering method), plating method or the like with an appropriate thickness, A conductive layer (not shown) is formed. Then, the obtained conductive layer is patterned by a known method to form a conductive film 9 as shown in FIG. 9B, and a protrusion 14 is formed on the conductive film 9.
Here, as described above, a droplet discharge method such as a sputtering method, a plating method, an ink jet method or the like is employed for the formation of the protrusions 14. Each of these methods is appropriately selected and used according to the desired material and shape of the protrusion 14. In particular, it is preferable to use a droplet discharge method because a desired number of protrusions 14 can be formed at a desired position on the conductive film 9.

  By forming the conductive film 9 and the protrusions 14 in this way, the conductive film 9 having a predetermined pattern as shown in FIGS. 1 and 2, the wiring pattern 4 and the wiring pattern 5 continuous therewith are obtained. Thereby, the contact 3 is obtained. Depending on the formation method, the protrusions 14 are also formed on the wiring pattern 4 and the wiring pattern 5 as shown in FIG. 9B. Further, the wiring pattern 4 and the wiring pattern 5 can be formed separately from, for example, aluminum without being formed in the same process as the conductive film 9.

  Further, particularly when forming the internal resin 8, the cross section (main cross section) is obtained by combining half exposure for adjusting the exposure amount for the resin layer 18 and reflow processing for the resin pattern 18a after development as described above. Although formed in a substantially semicircular shape (substantially semi-elliptical shape), as described above, a desired shape may be formed only by half exposure, or a desired shape may be formed only by reflow processing.

Further, after the contact 3 is formed in this way, and the wiring patterns 4 and 5 are further formed, a driving IC is mounted on the substrate 2 as shown in FIG. 2, and each of the wiring pattern 4 and the wiring pattern 5 is placed. Connect electrically. Then, with the state maintained, a sealing resin is disposed around the periphery to form the resin layer 10.
Further, the connector 7 is connected to the end side of the wiring pattern 5 via the anisotropic conductive film 13 so that the wiring pattern 5 and the wiring pattern 12 are electrically connected. Thereby, the inspection jig 1 is obtained.

In such a manufacturing method of the inspection jig 1, the contact 3 is formed by covering the surface of the internal resin 8 with the conductive film 9 and further forming the conductive protrusions 14 on the conductive film 9. Therefore, as described above, a wide contact area is ensured between the contact 3 and the terminal 202, and a sufficiently high bonding strength is ensured. Therefore, the reliability of the electrical connection between the contact 3 and the terminal 202 is improved, and the reliability of the electrical characteristic inspection itself is improved.
Further, since the oxide film on the terminal surface is pierced by the protrusions 14 on the conductive film 9 and comes into direct contact with the lower metal surface, a better electrical connection between the contact 3 and the terminal 202 is achieved. It will be obtained.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, as an inspection jig according to the present invention, as shown in FIG. 10, electrical shielding is provided between the substrate 2 and the internal resin 8 on the substrate 2 of the inspection jig 1 shown in FIG. 2. A layer 25 may be provided. In this way, unnecessary radiation can be reduced, noise resistance can be improved, and a more precise electrical characteristic inspection can be performed.

As the material of the electrical shielding layer 25, aluminum alone, aluminum alloy such as aluminum-silicon, aluminum-copper, etc., copper alone, copper alloy, gold, titanium, titanium alloy, chromium, or the like can be used. Such an electrical shielding layer 25 may be in an electrically floating state, but is preferably fixed to a constant potential, particularly ground, from the viewpoint of improving noise resistance.
Further, as a modification of the form for forming the electrical shielding layer 25 in this way, a solid potential layer and a ground layer are multilayered, or a known strip or microstrip structure is adopted for the wiring pattern. Noise resistance may be improved.

  Further, the structure of the bump electrode constituting the contact 3 is not that in which the internal resin 8 is formed in a substantially bowl shape as shown in FIG. Then, as shown in FIG. 11, the internal resin 27 is formed in a substantially hemispherical shape, and the conductive film 9 covers the entire upper surface of the internal resin 27 and is continuous with the wiring pattern 4 on the base material (not shown). It may be a structure provided in the state. Although illustration of protrusions is omitted in FIG. 11, it is natural that one or more protrusions are formed on the conductive film 9.

  In the above embodiment, the object to be inspected is the TFT array substrate 30 of the liquid crystal display device 100. However, the object to be inspected according to the present invention is not only a liquid crystal display device but also an organic electroluminescence device (organic EL device). Various electro-optical devices and various electronic modules such as a plasma display device, an electrophoretic display device, and a device using an electron-emitting device (such as a field emission display and a surface-conduction electron-emitter display) can be used.

Further, the object to be inspected may be a semiconductor device such as an LSI or a single electronic component, instead of such an electro-optical device or an electronic module. Specifically, various types of electronic components such as various IC chips, diodes, transistors, light emitting diodes, laser diodes, oscillators, capacitors, and the like can be used as test objects.
In the embodiment, the example in which the driving IC 6 for the liquid crystal display device is mounted on the substrate 2 has been described. However, electronic components other than the driving IC 6 may be mounted as appropriate at the time of inspection.

It is a perspective view showing a schematic structure of one embodiment of an inspection jig of the present invention. It is a sectional side view showing the schematic structure of one embodiment of the inspection jig of the present invention. (A) (b) is a figure for demonstrating the position of a processus | protrusion, and its effect | action. (A) (b) is a figure for demonstrating the position of a processus | protrusion, and its effect | action. It is a top view which shows schematic structure of the liquid crystal display device used as to-be-inspected object. It is sectional drawing which follows the H-H 'line | wire of FIG. It is a sectional side view for demonstrating the inspection method using the jig | tool for an inspection of this invention. (A)-(d) is a sectional side view for demonstrating the formation process of a contactor. (A) (b) is a sectional side view for demonstrating the formation process of a contactor. It is a sectional side view which shows the modification of the jig | tool for an inspection. It is a perspective view which shows schematic structure of a contactor.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Inspection jig | tool, 2 ... Board | substrate, 3 ... Contact (bump electrode), 4 ... Wiring pattern, 5 ... Wiring pattern, 6 ... Driving IC (inspection electronic component), 7 ... Connector, 8, 27 ... Inner resin, 8a ... bottom side, 8b ... outer side, 9 ... conductive film, 9a ... outer surface, 14 ... projection, 15 ... pressing plate, 25 ... electric shielding layer, 30 ... TFT array substrate (inspected object), 100 ... Liquid crystal display device (inspected object), 202... External circuit mounting terminal (terminal)

Claims (14)

It has a substrate, a contact provided on the substrate, and a wiring pattern electrically connected to the contact, and is configured such that the contact is joined to a terminal of a device under test. An inspection jig,
The contact is composed of a bump electrode having an inner resin as a core and a conductive film covered on the surface thereof, and a conductive protrusion is provided on the conductive film. .   The inspection jig according to claim 1, wherein the protrusion has a tapered shape in which a distal end side is narrower than a proximal end side.   The inspection jig according to claim 1, wherein a plurality of the protrusions are provided.   The internal resin is formed in a substantially bowl shape in which the shape of the main cross section of the cross section orthogonal to the bottom surface contacting the substrate is a substantially semicircular shape, a substantially semielliptical shape, or a substantially trapezoidal shape, 4. The test according to claim 1, wherein the conductive film is provided in a strip shape on the surface of the internal resin along a surface direction of the main cross section of the internal resin. jig.   The inner resin has a curved surface whose outer surface is convex outward, and the conductive film has an outer surface curved along the curved surface on the curved surface of the inner resin, and the protrusion The inspection jig according to any one of claims 1 to 4, wherein the inspection jig is disposed at least at a portion located on the outermost side of the curved outer surface of the conductive film.   The inner resin has a curved surface whose outer surface is convex outward, and the conductive film has an outer surface curved along the curved surface on the curved surface of the inner resin, and the protrusion The inspection jig according to any one of claims 1 to 5, wherein the inspection jig is disposed at least in the vicinity of the outermost portion of the curved outer surface of the conductive film.   The inspection jig according to claim 1, wherein the substrate is a transparent substrate.   The inspection jig according to claim 1, wherein an electrical shielding layer is provided between the substrate and the contact.   The inspection jig according to claim 1, wherein the board is provided with a connector at an end opposite to the side on which the contact is disposed.   The inspection electronic component is mounted on the substrate, and the inspection electronic component is electrically connected to the wiring pattern. The inspection according to claim 1, wherein the inspection electronic component is electrically connected to the wiring pattern. Jig.   The inspection jig according to claim 10, wherein the inspection electronic component is an electronic component mounted on the object to be inspected after inspection.   12. The inspection jig according to claim 10, wherein the inspection electronic component is mounted on the substrate in a face-down structure. A manufacturing method of an inspection jig having a substrate, a contact provided on the substrate, and a wiring pattern electrically connected to the contact,
The step of forming the contact includes a step of providing an internal resin as a core on the substrate, a step of covering the surface of the internal resin with a conductive film, and a step of forming conductive protrusions on the conductive film And a method for manufacturing an inspection jig.   14. The step of forming the protrusion includes forming a protrusion made of the conductive material by selectively disposing a conductive material on the conductive film by a droplet discharge method. Manufacturing method of inspection jig.

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