JPH11271795A - Type carrier package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid crystal display device in which yield is high, and the number of processes is small. SOLUTION: This liquid crystal display device in which a driving IC 11 for driving a liquid crystal panel is connected with a liquid crystal panel and a circuit substrate by using a TCP method. In this case, one face of the TCP part is covered with a copper foil pattern 23, and a copper foil is grounded so that the generation of any high frequency noise can be reduced. Also, a fine opening is formed like zigzag at the bending position of the TCP part so that the strength of a base film can be maintained, and the copper foil pattern 23 can be prevented from being broken. Moreover, dummy bumps for connecting the driving IC with the carrier tape of the TCP part are arrayed along an original signal line copper foil pattern, and grounded to a circuit substrate 29 so that the level of an impedance and an EMI can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a tape carrier package, and more particularly to an improvement in yield and a reduction in the number of steps in a connection process between a liquid crystal panel and a drive circuit.

[0002]

2. Description of the Related Art At present, a liquid crystal display device widely used as a thin display device has a glass substrate having pixel electrodes and a glass substrate having a counter electrode opposed to each other, and a liquid crystal sealing opening is formed around each substrate. After fixing with an adhesive, a liquid crystal composition is injected between the substrates from a liquid crystal sealing opening, and the liquid crystal sealing opening is sealed with a sealant.

In particular, a scanning line and a scanning line are provided on a main surface of one of two glass substrates, as a display having an increased display speed, a display capable of displaying a color image, and a display having an enhanced contrast. There is known an active matrix drive liquid crystal display device in which a TFT (thin film transistor) is disposed as a switching element at a position where a signal line perpendicular to the TFT intersects with the signal line.

In the above-mentioned liquid crystal display device, TCP (tape carrier package) using a carrier tape as a sheet-like wiring medium in which a conductor foil (mainly copper foil) used as an electrode pattern is bonded to an insulating film.
By connecting a driving circuit element (generally, an integrated circuit and hereinafter referred to as a driving IC) mounted by a method and a TFT of a liquid crystal panel, the driving circuit element is driven by the TCP (the driving method by the TCP method).
Signals required for driving the liquid crystal panel can be transferred from a circuit system outside the portion (where C and the carrier tape are connected). The drive IC is fixed to a predetermined position of a glass substrate or a predetermined position of a housing constituting a liquid crystal display device by bending a conductive foil of a TCP portion into a predetermined shape.

More specifically, as shown in FIG. 9, a drive IC 1101 includes an insulating film (base film) 111.
1 on a surface to which a conductor (copper foil) pattern 1113 is bonded via an adhesive layer 1112,
Fixed. At this time, by connecting the bump 1102 provided at a predetermined position (back side) of the drive IC 1101 to the copper foil pattern 1113, the drive IC 1101 is connected.
Is connected to an external circuit system (not shown). Note that a solder resist layer 1114 is formed on the back surface (the side opposite to the base film 1111) of the conductor pattern 1113. Further, around the driving IC 1101, a sealing resin 111 is provided.
5 is molded.

On the other hand, as shown in FIG. 10, a driving IC 1101 includes a driving IC
Dummy bumps 1103 are provided to alleviate the stress generated when mounting 1101 and to alleviate the elongation and warpage of the base film 1111. In addition, a dummy conductor (copper foil) pattern 1116 having a shorter length than the conductor pattern 1113 is provided on the base film 1111 with respect to the dummy bump 1103. The conductor pattern 1113 is bent in the conductor pattern area 1113a from which the base film 1111 has been removed as shown in FIG.

[0007]

By the way, in today's liquid crystal display devices, the number of pixels has been increased along with the enlargement of the screen and the increase in definition, so that the clock frequency of the driving IC is extremely high. Has become.

Therefore, the driving IC 1101 in the TCP portion
Unnecessary radio waves of high frequency are also generated from the wiring (conductor pattern 1113) up to this point, causing a problem that the level of unnecessary radiation called EMI is increased.

The base film 11 shown in FIG.
In the conductor pattern region 1113a from which the conductor pattern 11 has been removed, mechanical or thermal stress tends to concentrate.
There is a problem that the yield is lowered due to the fracture of No. 3. Although a method of reinforcing the conductor pattern 1113 by applying a resin or the like to the conductor pattern region 1113a has been proposed, there is a problem in that the number of manufacturing processes is increased and material costs are high. An object of the present invention is to provide an inexpensive liquid crystal display device having good display performance and high yield.

[0010]

SUMMARY OF THE INVENTION The present invention has been made on the basis of the above-mentioned problems, and is directed to a liquid crystal display device driven by a circuit element fixed on a sheet-like insulating medium having a conductor pattern formed thereon. Another object of the present invention is to provide a tape carrier package, wherein one surface of the sheet-shaped insulating medium is covered with a conductor layer, and the conductor layer is grounded.

The sheet-like insulating medium according to the present invention is defined at a position corresponding to the bending position at a predetermined interval in a direction orthogonal to a direction in which the conductor pattern extends.
It is characterized by having openings arranged at predetermined intervals on a straight line.

Further, the opening according to the present invention is characterized in that it crosses one or a plurality of the conductor patterns. The openings of the present invention are arranged in a staggered manner with respect to the two straight lines.

Further, the conductor pattern of the present invention includes a dummy conductor pattern connected to a dummy bump provided on the circuit element, and the conductor pattern and the dummy conductor pattern are parallel to each other.

That is, the present invention provides a liquid crystal display device in which a driving IC for driving a liquid crystal panel is connected to a liquid crystal panel and a driving circuit board by using a TCP method.
By covering one side of the CP portion with a copper foil and grounding the copper foil, the occurrence of high-frequency noise can be reduced.

Further, by forming minute openings in a staggered shape at the bending position of the TCP portion, the strength of the base film is maintained and the breakage of the copper foil pattern is reduced.

Further, the carrier tape in the TCP portion is
By arranging the dummy bumps for connecting the drive ICs along the original signal line copper foil pattern and grounding the circuit board, the impedance and the EMI level can be reduced.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing an example of a transmission type liquid crystal display device to which an embodiment of the present invention is applied.

As shown in FIG. 1, a liquid crystal display device 1 with a backlight comprises a liquid crystal panel unit 3 (not described in detail).
A panel driving circuit 5 for displaying an image by making a pixel at an arbitrary position in the liquid crystal panel unit 3 non-transmissive is provided on the back side of the display surface 3a of the liquid crystal panel unit 3, and illuminates the liquid crystal panel unit 3 from the back. It comprises a lighting unit 7 and a power supply circuit 9 for supplying power to the lighting unit 7 and the panel drive circuit 5. The liquid crystal panel unit 3 has a circuit as described in detail later with reference to, for example, FIG.

The liquid crystal panel unit 3 is described in detail in FIG.
As shown in FIG. 1, a liquid crystal panel 11 having an array substrate 20 and a counter substrate 22 and having a liquid crystal material injected between the two substrates.
0, and the size of the display surface 3a is, for example, diagonal 12.1
Formed in inches.

The liquid crystal panel unit 3 includes a liquid crystal panel 110, a signal line driving circuit board 114 for driving the liquid crystal panel 110, a scanning line driving circuit board 116, and each of the driving circuit boards electrically connected to the liquid crystal display panel. A plurality of tape carrier packages (referred to as TCP) 118. That is, one end of a plurality of TCPs 118 is connected to an electrode (not shown) of the array substrate 20.
A drive circuit board 116 is connected to the other end of the CP. Thus, the array substrate 20 is connected to the drive circuit substrate 116 via the TCP 118.

FIG. 3 is a schematic diagram for explaining a state of mounting a drive IC of a panel drive circuit section of the liquid crystal display device shown in FIG. As shown in FIG. 3, the driving IC 11
It is mounted on one surface of the insulating base film 21 on the side to which the conductor (copper foil) pattern 23 is bonded via the adhesive layer 22. At this time, the driving IC 11
By connecting the bump 12 provided at a predetermined position (back side) to the copper foil pattern 23, the drive IC 11
Is connected to an external circuit system (not shown). A solder resist layer 24 is formed on the back surface of the conductor pattern 23, that is, on the surface opposite to the base film 21.
The periphery of the drive IC 11 is molded with a sealing resin 25.

A conductor (copper foil) 27 is provided on the entire surface of the base film 21 facing the copper foil pattern 23 with an adhesive layer 26 interposed therebetween. In addition, the entire copper foil 27
Is bent on the side where the input terminal 28 is provided, and FIG.
As shown in (2), after extending along the thickness direction of the base film 21, it is connected to the circuit board 29. That is, most of the area of the copper foil pattern 23 is covered with the entire conductor 27 except for the part where the drive IC 11 is exposed when viewed from the plane. Thereby, high-frequency components (noise) emitted from the conductor pattern 23
Are grounded through the circuit board 29.

FIG. 5 shows the driving IC 11 and the TC shown in FIG.
FIG. 4 is a schematic diagram showing a state where a P portion is viewed from the back side of the drive IC 11. As shown in FIG. 5, in addition to the bumps 12 described above, dummy bumps 13 used to reduce stress generated when mounting the drive IC 11 and to reduce elongation and warpage of the base film 21 are provided on the drive IC 11. Is provided.

The dummy bumps 13 have the base film 2
In 1, the dummy conductor (copper foil) pattern 30 extending along the conductor pattern 23 is connected to a region 23a where the conductor pattern 23 is bent. Since the dummy conductor pattern 30 is arranged in parallel with the copper foil pattern 23 which is an original signal line, the impedance of the dummy conductor pattern 30 can be reduced. Further, by connecting the dummy conductor pattern to the circuit board 29 shown in FIG. 4, the shielding effect can be further enhanced.

FIG. 6 is a schematic view showing the characteristics of the base film 21 in the outer portion of the TCP portion shown in FIG. FIG.
As shown in FIG. 3, the end of the base film 21 in the direction in which the copper foil pattern 23 extends, that is, the bent region 23
An opening 31 defined in units of one or a plurality of copper foil patterns 23 is provided in a and its peripheral region 21a. The openings 31 are alternately arranged along two parallel straight lines A and B defined in a direction orthogonal to the direction in which the copper foil pattern 23 extends.

That is, the bent region 21a of the base film 21 can be bent into a predetermined shape with a smaller bending stress than the bending stress of the film alone by the plurality of openings 31 provided in a staggered manner. In addition, since each opening 31 is provided relatively close to the direction in which the copper foil pattern 23 extends, the bending radius of the bending region 21a can be reduced, and the size of the TCP portion is not affected. Also, by setting the size and the number of the openings optimally, the strength as a film can be secured.

FIG. 7 shows the driving IC shown in FIGS.
FIG. 7 is a schematic diagram illustrating a modification of the mount, that is, the drive IC 11 and the dummy copper foil pattern. As shown in FIG. 7, the length of the dummy copper foil pattern 33 in the longitudinal direction is limited as compared with the dummy copper foil pattern 30 shown in FIG. In the example shown in FIG. 7, the dummy copper foil pattern 3
3 is set to a length substantially equal to the entire surface of the copper foil 27 described with reference to FIG.

The use of the dummy copper foil pattern 33 shown in FIG. 7 facilitates the arrangement of bonding wires with respect to the copper foil pattern 23 which is the original signal line, as compared with the example shown in FIG. That is, when the copper foil pattern 23 is connected to the corresponding signal line from the external circuit system, the density of the copper foil pattern 23 is reduced by the number of the dummy copper foil patterns 33. The connection processing of the signal lines is simplified. By providing a bonding wire (not shown) between the dummy copper foil pattern 33 and the entire copper foil 27, a sufficient shielding effect can be ensured.

FIG. 8 is a schematic diagram showing an example of a liquid crystal display unit applicable to each of the liquid crystal panel unit 3 and the drive circuit 5 of the liquid crystal display device 1 shown in FIG. The liquid crystal panel unit 3 is shown by an equivalent circuit in which the glass substrate is omitted and only the electrical connection is shown.

As shown in FIG. 8, a liquid crystal display unit 41 takes in image data displayed by the liquid crystal panel unit 3 (51) and drives a driving circuit described below at a predetermined timing. 43
The first signal line driver circuit 45 that outputs a predetermined drive signal corresponding to an image signal to an odd-numbered signal line among the signal lines described below under the control of A second signal line driver circuit 4 for outputting a predetermined drive signal corresponding to an image signal to an even-numbered signal line
7. A scanning line driver circuit 49 for supplying a predetermined driving signal to a scanning line described below and a liquid crystal panel 51 (3 in FIG. 1) are included.

The liquid crystal panel 51 has, for example, 1024 × 3 signal lines 53 and 768 on a glass substrate (not shown).
The scanning lines 55, the thin film transistors (hereinafter abbreviated as TFTs) 57 connected to the signal lines 53 and the scanning lines 55,
An array substrate on which a pixel electrode 59 connected to the TFT 57 is disposed, and a counter substrate (not shown) in which a counter electrode 61 and a color filter layer (not shown) are respectively formed on a glass substrate (not shown) are formed of alignment films (not shown). Are arranged so as to sandwich the liquid crystal material 63 therebetween.

More specifically, among the signal lines 53 of the liquid crystal panel 51, the odd-numbered signal lines are electrically connected to the first signal line driver circuit 45, and the even-numbered signal lines are connected to the second signal line. Each scanning line 55 is electrically connected to a scanning line driver circuit 49 that sequentially outputs scanning pulses.

The liquid crystal controller 43 generates a 25 MHz horizontal clock signal CKH, based on a clock signal CKR (50 MHz here) supplied from a main control circuit (not shown) and image data DATA-O and DATA-E. The horizontal start signal STH and the image data DATA-O and DATA-E are output to the first and second signal line driver circuits 43 and 45, and the vertical clock signal CKV and the vertical start signal S
The TV is output to the scanning line driver circuit 49.

The driving IC 1 shown in FIGS.
1 is the first and second signal line driver circuits 4
It goes without saying that the scanning line driver circuit 49 corresponds to 3 and 45.

[0035]

As described above, since the entire area of the driving IC in the planar direction is covered with the conductor and grounded, it is possible to prevent the EMI level from being increased by high frequency noise generated from the driving IC. Further, by grounding a dummy copper foil pattern provided corresponding to a dummy bump used when fixing the drive IC to the carrier tape, the shielding characteristics are improved.

According to the present invention, the size of the portion where the copper foil pattern is exposed from the base film used for the carrier tape is set by the openings arranged in a staggered manner in two straight lines defined at a predetermined interval. By doing so, the copper foil pattern is prevented from being broken due to the bending of the copper foil pattern in the TCP portion, and the yield is improved. In addition,
By optimally setting the size and number of the openings, the bending radius of the bending area can be reduced, and TCP
Does not affect the size of the part. Further, the strength as a film can be secured. Therefore, the cost of the liquid crystal display device is reduced by reducing the number of steps or improving the yield.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an example of a liquid crystal display device to which an embodiment of the present invention is applied.

FIG. 2 is a schematic diagram illustrating an example of a panel drive circuit section of the liquid crystal display device illustrated in FIG.

FIG. 3 is a schematic diagram illustrating a state of mounting a drive IC of a panel drive circuit unit of the liquid crystal display device illustrated in FIG. 2;

FIG. 4 is a schematic view showing a mounted state of the drive IC shown in FIG. 3;

FIG. 5 is a schematic diagram showing a mounting state of the drive IC shown in FIG. 3 from the back side direction shown in FIG. 3;

FIG. 6 is a schematic view showing characteristics of a base film 21 in an outer portion of a TCP portion shown in FIG. 4;

FIG. 7 is a schematic diagram illustrating a mount of the drive IC shown in FIGS. 3 to 5, that is, a modification of the drive IC 11 and the dummy copper foil pattern.

FIG. 8 is a schematic diagram showing an example of a liquid crystal panel and a driving circuit that can be used in the liquid crystal display device shown in FIG.

FIG. 9 is a schematic diagram showing a mounting state of a conventional driving IC.

FIG. 10 is a schematic diagram showing a mounting state of a conventional driving IC.

FIG. 11 is a schematic view showing a mounting state of a conventional driving IC.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display device, 3 ... Liquid crystal panel, 5 ... Panel drive circuit, 7 ... Lighting unit, 9 ... Power supply circuit, 11 ... Drive IC, 12 ... Bump, DESCRIPTION OF SYMBOLS 13 ... Dummy bump, 21 ... Base film, 22 ... Adhesive layer, 23 ... Copper foil pattern, 24 ... Solder resist layer, 25 ... Seal resin, 26 ... Adhesive layer , 27 ... overall conductor, 28 ... input terminal, 29 ... circuit board, 30 ... dummy copper foil pattern, 31 ... opening.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuhiro Ohashi 50 Kamiyube, Amebu-ku, Himeji-shi, Hyogo Pref. The company Toshiba Himeji factory

Claims (9)

[Claims] 1. A liquid crystal display device driven by a circuit element fixed to a sheet-like insulating medium having a conductor pattern formed thereon, wherein one side of the sheet-like insulating medium is covered with a conductor layer, and the conductor layer is covered with a conductor layer. A tape carrier package characterized by being grounded. 2. The sheet-like insulating medium is arranged at predetermined positions on two straight lines defined at predetermined intervals in a direction orthogonal to a direction in which the conductor pattern extends at a position corresponding to a bending position. 2. The tape carrier package according to claim 1, wherein the tape carrier package has a formed opening. 3. The tape carrier package according to claim 1, wherein the opening crosses one or a plurality of the conductor patterns. 4. The tape carrier package according to claim 1, wherein the openings are arranged in a staggered manner with respect to the two straight lines. 5. The conductor pattern includes a dummy conductor pattern connected to a dummy bump provided on the circuit element, wherein the conductor pattern and the dummy conductor pattern are
The tape carrier package according to claim 1, wherein the tape carrier packages are parallel to each other. 6. The tape carrier package according to claim 5, wherein said dummy conductor pattern is grounded. 7. The sheet-like insulating medium is arranged at a position corresponding to a bending position at a predetermined interval on two straight lines defined at a predetermined interval in a direction orthogonal to a direction in which the conductor pattern extends. 6. The tape carrier package according to claim 5, wherein the tape carrier package has a formed opening. 8. The tape carrier package according to claim 7, wherein the opening crosses one or a plurality of the conductor patterns. 9. The tape carrier package according to claim 7, wherein the openings are arranged in a staggered manner with respect to the two straight lines.